Exceptional performance from the development qualification and implementation of a silicone adhesive for bonding heatsinks to semiconductor packages'
1995 ◽
Vol 18
(1)
◽
pp. 94-100
◽
Keyword(s):
2011 ◽
Vol 255-260
◽
pp. 161-165
2020 ◽
Vol 257
(2)
◽
pp. 22-27
Keyword(s):