Exceptional performance from the development, qualification and implementation of a silicone adhesive for bonding heatsinks to semiconductor packages

1995 ◽  
Vol 18 (1) ◽  
pp. 94-100 ◽  
Author(s):  
S. Bosworth ◽  
S.C. Hsu ◽  
J. Polcari
Keyword(s):  
Silicone Adhesive ◽  
Semiconductor Packages

Detection and Characterization of an Electrical Failure Induced during Laser Ablation of Packages

2008 ◽  
Author(s):  
P. Schwindenhammer ◽  
H. Murray ◽  
P. Descamps ◽  
P. Poirier
Keyword(s):  
Laser Ablation ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
Ablation Process ◽  
Thermally Induced ◽  
Electrical Failure ◽  
Electrical Phenomenon ◽  
Semiconductor Packages ◽  
Complex Semiconductor

Abstract Decapsulation of complex semiconductor packages for failure analysis is enhanced by laser ablation. If lasers are potentially dangerous for Integrated Circuits (IC) surface they also generate a thermal elevation of the package during the ablation process. During measurement of this temperature it was observed another and unexpected electrical phenomenon in the IC induced by laser. It is demonstrated that this new phenomenon is not thermally induced and occurs under certain ablation conditions.

Using a novel breathable silicone adhesive (Sil2 technology) in stoma appliances to improve peristomal skin health: answering the key questions

2021 ◽  
Vol 30 (Sup8) ◽  
pp. 19-24
Author(s):  
Fiona Le Ber
Keyword(s):  
Skin Damage ◽  
Skin Injury ◽  
Moisture Management ◽  
Silicone Adhesive ◽  
Peristomal Skin ◽  
Medical Adhesive ◽  
Key Questions ◽  
Stoma Care

Fiona Le Ber answers some of the questions that stoma care nurses may have regarding this novel silicone adhesive based technology, which helps to avoid medical adhesive related skin injury (MARSI) and moisture-associated skin damage (MASD). Whereas hydrocolloid stoma appliances absorb moisture, this has a non-absorptive method of moisture management that prevents peristomal skin becoming damp and excoriated.

Analysis of Primary Aluminum Composite Panel Gypsum Board Construction Method Paste

2011 ◽  
Vol 255-260 ◽  
pp. 161-165
Author(s):  
Xiang Rong Zhang ◽  
Lu Li
Keyword(s):  
Primary Aluminum ◽  
Economic Benefits ◽  
Construction Method ◽  
Composite Panel ◽  
Aluminum Plate ◽  
Gypsum Board ◽  
Aluminum Composite ◽  
Quality Requirements ◽  
Construction Period ◽  
Silicone Adhesive

Gypsum board as the basis, combined with double-sided adhesive sponge and neutral silicone adhesive connection, this method using gypsum board as the primary fire to A-level, affordable. With high construction speed, short construction period, it can save money and meet the quality requirements and bring greater economic benefits to investors. Therefore, the gypsum board primary aluminum plate construction method paste will be introduced to more and more application.

Thermal Analysis of SiC Power Semiconductor Packages using the Structure Function

2021 ◽  
Author(s):  
Salvatore Race ◽  
Ivana Kovacevic-Badstuebner ◽  
Michel Nagel ◽  
Thomas Ziemann ◽  
Shweta Tiwari ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Structure Function ◽  
Power Semiconductor ◽  
Semiconductor Packages

scholarly journals DESIGN AND TECHNOLOGICAL FEATURES OF CERAMIC-METAL TO-247 AND TO-220 SEMICONDUCTOR PACKAGES

2020 ◽  
Vol 257 (2) ◽  
pp. 22-27
Author(s):  
V.A. Sidorov ◽  
A.G. Chuprunov ◽  
S.V. Kataev ◽  
K.V. Sidorov
Keyword(s):  
Pulsed Current ◽  
Operating Voltage ◽  
Smart Power ◽  
Power Switches ◽  
Semiconductor Packages ◽  
Glass Metal

In this paper we introduce the design of sealed ceramic-metal TO-247 and TO-220 packages, which are intended for the same applications as plactic-metal and glass-metal alternatives. Packages could be used for epitaxial Si and SiC multi-die assemblies, for GaN smart power switches, etc., with operating voltage up to 2500 V and pulsed current up to 350 A.

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