Molecular dynamics simulation of friction, lubrication, and tool wear during nanometric machining

2022 ◽  
pp. 187-211
Author(s):  
Jia Li ◽  
Yuanyuan Tian ◽  
Qihong Fang
2013 ◽  
Vol 579-580 ◽  
pp. 211-215
Author(s):  
Guo Jun Dong ◽  
Yuan Jing Zhang ◽  
Ming Zhou

The problem of diamond tool wear is the bottleneck for machining large metal reflector with ultraprecision cutting method. In this paper, the author performed simulation study on diamond tool wear in machining large metal reflectors, and established a molecular dynamics simulation model for dynamic simulation of tool wear; and found that in the simulation process the change in cutting speed and cutting depth had definite effect on the tool wear, and the main factors affecting the tool wear was the cutting distance.


2004 ◽  
Vol 471-472 ◽  
pp. 144-148 ◽  
Author(s):  
Hui Wu ◽  
Bin Lin ◽  
S.Y. Yu ◽  
Hong Tao Zhu

Molecular dynamics (MD) simulation can play a significant role in addressing a number of machining problems at the atomic scale. This simulation, unlike other simulation techniques, can provide new data and insights on nanometric machining; which cannot be obtained readily in any other theory or experiment. In this paper, some fundamental problems of mechanism are investigated in the nanometric cutting with the aid of molecular dynamics simulation, and the single-crystal silicon is chosen as the material. The study showed that the purely elastic deformation took place in a very narrow range in the initial stage of process of nanometric cutting. Shortly after that, dislocation appeared. And then, amorphous silicon came into being under high hydrostatic pressure. Significant change of volume of silicon specimen is observed, and it is considered that the change occur attribute to phase transition from a diamond silicon to a body-centered tetragonal silicon. The study also indicated that the temperature distributing of silicon in nanometric machining exhibited similarity to conventional machining.


RSC Advances ◽  
2019 ◽  
Vol 9 (3) ◽  
pp. 1341-1353 ◽  
Author(s):  
Qihong Fang ◽  
Yuanyuan Tian ◽  
Jia Li ◽  
Qiong Wang ◽  
Hong Wu

The nanometric machining of Cu/Ag bilayers and pure Cu film is performed using molecular dynamics (MD) simulations.


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