Corrosion reliability testing, standards, and failure analysis

2022 ◽  
pp. 339-380
Author(s):  
Rajan Ambat ◽  
Kamila Piotrowska
Keyword(s):  
Failure Analysis ◽  
Reliability Testing ◽  
Testing Standards

Unique Autoclave Stress Induced Failure Mechanism

2005 ◽  
Author(s):  
John Butchko ◽  
Bruce T. Gillette
Keyword(s):  
Corrosion Rate ◽  
Grain Boundary ◽  
Failure Analysis ◽  
Failure Mechanism ◽  
Metal Corrosion ◽  
Corrosion Mechanism ◽  
Reliability Testing ◽  
Process Change ◽  
Transistor Reliability ◽  
Pass Through

Abstract Autoclave Stress failures were encountered at the 96 hour read during transistor reliability testing. A unique metal corrosion mechanism was found during the failure analysis, which was creating a contamination path to the drain source junction, resulting in high Idss and Igss leakage. The Al(Si) top metal was oxidizing along the grain boundaries at a faster rate than at the surface. There was subsurface blistering of the Al(Si), along with the grain boundary corrosion. This blistering was creating a contamination path from the package to the Si surface. Several variations in the metal stack were evaluated to better understand the cause of the failures and to provide a process solution. The prevention of intergranular metal corrosion and subsurface blistering during autoclave testing required a materials change from Al(Si) to Al(Si)(Cu). This change resulted in a reduced corrosion rate and consequently prevented Si contamination due to blistering. The process change resulted in a successful pass through the autoclave testing.

Failure Analysis of Polysilicon Micromirror Arrays

2002 ◽  
Author(s):  
Jeremy A. Walraven ◽  
Edward I. Cole ◽  
Danelle M. Tanner ◽  
Seethambal S. Mani ◽  
Ernest J. Garcia ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Optical Switching ◽  
Failure Modes ◽  
Reliability Testing ◽  
Processing Technologies ◽  
Optical Signals ◽  
Home Entertainment ◽  
Micromirror Arrays ◽  
Spectrometer System ◽  
Potential Use

Abstract Surface micromachined micromirror technologies are being employed for various commercial and government applications. One application of micromirror technologies in the commercial sector can be found in Digital Light Projection (DLP™) systems used for theater and home entertainment centers. DLP™ systems developed by Texas Instruments uses DMD™ technology (Digital Mirror Device), an array of micromirrors, to project light onto a screen [1]. This technology is also used by Infocus™ projection systems and widescreen tabletop televisions [2]. Here, the micromirrors act as individual pixels, reflecting light onto the screen with high ¡§digital¡¨ resolution. The most recent application of surface micromachined micromirror technology is optical switching [3], which uses micromirrors to switch optical signals from fiber to fiber for lightwave telecommunications [4]. Companies such as Lucent have fabricated entire optical micromirror switching systems based on their Microstar™ technology [5]. For government applications, surface micromachined micromirror arrays have been developed for potential use in a spectrometer system planned for NASA's Next Generation Space Telescope (NGST) [6]. Various processing technologies are used to fabricate surface micromachined micromirrors. The micromirror arrays developed by TI and Lucent [1,4] uses metal for their structural and reflective components. Micromirrors fabricated at Sandia National Laboratories use the SUMMiT™ (Sandia's Ultra-planar MEMS Multi-level Technology) process with metal deposited on the surface of mechanical polysilicon components to reflect light. Optical micromirror arrays designed and fabricated at Sandia for potential use in the NGST have undergone reliability testing and failure analysis. This paper will discuss the failure modes found in these micromirrors after reliability testing. Suggestions and corrective actions for improvements in device performance will also be discussed.

Failure analysis of wafer-level reliability testing failure

1999 ◽  
Author(s):  
Chong K. Oh ◽  
Soh P. Neo ◽  
Jian H. Bi ◽  
Zong M. Wu ◽  
Lian C. Goh ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Reliability Testing ◽  
Wafer Level

Design for Reliability and Common Failure Mechanisms in Vertical Cavity Surface Emitting Lasers

2012 ◽  
Vol 1432 ◽  
Author(s):  
Robert W. Herrick
Keyword(s):  
Failure Analysis ◽  
Semiconductor Lasers ◽  
Failure Mechanisms ◽  
Cavity Surface ◽  
Reliability Testing ◽  
Materials Selection ◽  
Surface Emitting Lasers ◽  
Vertical Cavity Surface ◽  
Emitting Lasers ◽  
Vertical Cavity

ABSTRACTVertical-Cavity Surface-Emitting Lasers are making up a large and growing share of the world’s production of semiconductor lasers. But the 850 nm GaAs quantum well VCSELs that make up most of present product are highly vulnerable to dislocation networks. In this paper, we discuss how materials selection affects the reliability of semiconductor lasers generally. We then describe the most common failure mechanisms observed in VCSELs, and what precautions are used to prevent them. We finish with a brief discussion of reliability testing and failure analysis.

scholarly journals The Reliability, Testing and Evaluation of Hybrid Microcircuits

1977 ◽  
Vol 4 (3-4) ◽  
pp. 213-217 ◽  
Author(s):  
A. H. George
Keyword(s):  
Thermal Stress ◽  
Prediction Model ◽  
Failure Analysis ◽  
Reliability Testing ◽  
Endurance Test ◽  
Element Data ◽  
Bonding System ◽  
Reliability Modelling ◽  
Endurance Testing ◽  
Testing And Evaluation

Reliability aspects of Hybrid Microcircuits are considered, including a prediction model illustrating the detail knowledge of the technology and application necessary. Circuit, part and element data is presented for two different test circuits. Use is made of predicted circuit failure rates to establish an electrical endurance test programme together with the thermal stress levels likely to generate some failures in an acceptable time. Results of testing the circuits at more than one temperature are presented, evaluated and compared with prediction. Failure analysis enables the performance of add-on parts, circuit elements and bonds to be assessed. A second series of test circuits confirms an improved bonding system. The usefulness of reliability modelling prior to endurance testing is justified together with some degree of thermal overstress.

Failure Analysis With the Scanning Electron Microscope

1972 ◽  
Vol 30 ◽  
pp. 482-483
Author(s):  
John R. Devaney
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
High Reliability ◽  
Military Applications ◽  
Small Structure ◽  
Useful Life ◽  
Insight Into ◽  
Scanning Electron

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.

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