The role of emerging grain boundary at iron surface, temperature and hydrogen on metal dusting initiation

2017 ◽  
Vol 135 ◽  
pp. 340-347 ◽  
Author(s):  
El Tayeb Bentria ◽  
Gawonou K. N'tsouaglo ◽  
Charlotte S. Becquart ◽  
Othmane Bouhali ◽  
Normand Mousseau ◽  
...  
Author(s):  
A.H. Advani ◽  
L.E. Murr ◽  
D. Matlock

Thermomechanically induced strain is a key variable producing accelerated carbide precipitation, sensitization and stress corrosion cracking in austenitic stainless steels (SS). Recent work has indicated that higher levels of strain (above 20%) also produce transgranular (TG) carbide precipitation and corrosion simultaneous with the grain boundary phenomenon in 316 SS. Transgranular precipitates were noted to form primarily on deformation twin-fault planes and their intersections in 316 SS.Briant has indicated that TG precipitation in 316 SS is significantly different from 304 SS due to the formation of strain-induced martensite on 304 SS, though an understanding of the role of martensite on the process has not been developed. This study is concerned with evaluating the effects of strain and strain-induced martensite on TG carbide precipitation in 304 SS. The study was performed on samples of a 0.051%C-304 SS deformed to 33% followed by heat treatment at 670°C for 1 h.


Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


2011 ◽  
Vol 11 (12) ◽  
pp. 6049-6062 ◽  
Author(s):  
X. Yue ◽  
H. Liao ◽  
H. J. Wang ◽  
S. L. Li ◽  
J. P. Tang

Abstract. Mineral dust aerosol can be transported over the nearby oceans and influence the energy balance at the sea surface. The role of dust-induced sea surface temperature (SST) responses in simulations of the climatic effect of dust is examined by using a general circulation model with online simulation of mineral dust and a coupled mixed-layer ocean model. Both the longwave and shortwave radiative effects of mineral dust aerosol are considered in climate simulations. The SST responses are found to be very influential on simulated dust-induced climate change, especially when climate simulations consider the two-way dust-climate coupling to account for the feedbacks. With prescribed SSTs and dust concentrations, we obtain an increase of 0.02 K in the global and annual mean surface air temperature (SAT) in response to dust radiative effects. In contrast, when SSTs are allowed to respond to radiative forcing of dust in the presence of the dust cycle-climate interactions, we obtain a global and annual mean cooling of 0.09 K in SAT by dust. The extra cooling simulated with the SST responses can be attributed to the following two factors: (1) The negative net (shortwave plus longwave) radiative forcing of dust at the surface reduces SST, which decreases latent heat fluxes and upward transport of water vapor, resulting in less warming in the atmosphere; (2) The positive feedback between SST responses and dust cycle. The dust-induced reductions in SST lead to reductions in precipitation (or wet deposition of dust) and hence increase the global burden of small dust particles. These small particles have strong scattering effects, which enhance the dust cooling at the surface and further reduce SSTs.


Sign in / Sign up

Export Citation Format

Share Document