scholarly journals Mesophase pitch-based graphite fiber-reinforced acrylonitrile butadiene styrene resin composites with high thermal conductivity

Carbon ◽  
2015 ◽  
Vol 95 ◽  
pp. 1007-1019 ◽  
Author(s):  
Guanming Yuan ◽  
Xuanke Li ◽  
Jing Yi ◽  
Zhijun Dong ◽  
Aidan Westwood ◽  
...  
1995 ◽  
Vol 390 ◽  
Author(s):  
Chris H. Stoessel ◽  
C. Pan ◽  
J. C. Withers ◽  
D. Wallace ◽  
R. O. Loutfy

ABSTRACTHigh thermal conductivity heat sinks for thermal management in electronic packaging is enabling to a variety of advanced electronic applications. Heat sinks in industrial semiconductor application have thermal conductivities generally less than 180 W/mK, and frequently have large expansion mismatch with chips such as silicon and gallium arsenide. A unique technology of producing graphite fiber reinforced copper (Cf/Cu) composite has been developed that produced thermal conductivities up to 454 W/mK utilizing a K=640 W/mK fiber reinforcement (with a potential for 800 W/mK when utilizing a K = 1100 W/mK P130 fiber) and thermal expansion that can be matched to chip materials. The process consists of utilizing a hollow cathode sputtering process to deposit a bonding layer followed by copper on spread graphite fibers, which are then consolidated into composites with architectures to achieve desired thermal conductivity and thermal expansion. The copper thickness determines graphite fiber loading up to 80 %. In heat sink applications, where the electrical conductivity of the graphite fiber reinforced copper composite is a problem, processing has been developed for applying electrically insulating diamond film, which has high thermal conductivity and acts as a heat spreader.


Author(s):  
E. A. Nikolaeva ◽  
A. N. Timofeev ◽  
K. V. Mikhaylovskiy

This article describes the results of the development of a high thermal conductivity carbon fiber reinforced polymer based on carbon fiber from pitch and an ENPB matrix modified with a carbon powder of high thermal conductivity. Data of the technological scheme of production and the results of determining the physicomechanical and thermophysical characteristics of carbon fiber reinforced polymer are presented. 


RSC Advances ◽  
2017 ◽  
Vol 7 (38) ◽  
pp. 23355-23362 ◽  
Author(s):  
Tao Huang ◽  
Xiaoliang Zeng ◽  
Yimin Yao ◽  
Rong Sun ◽  
Fanling Meng ◽  
...  

In recent decades, significant attention has been focused on developing composite materials with high thermal conductivity utilizing h-BN, which has outstanding thermal conductivity.


2021 ◽  
Vol 36 (5) ◽  
pp. 980-985
Author(s):  
Chong Ye ◽  
Huang Wu ◽  
Shi-peng Zhu ◽  
Zhen Fan ◽  
Dong Huang ◽  
...  

Author(s):  
Kerry E. Robinson

In an effort to develop a low-cost high thermal conductivity carbon fiber, ribbon-shaped fibers were meltspun from a liquid crystalline, mesophase pitch precursor. Initial tests indicated that the ribbon-shaped fibers could be processed more easily and exhibited improved thermal conductivities when compared to commercial round fibers. Evidently, it is the more linear, polycrystalline structure within these fibers that accounts for their improved thermal conductivities. Thus, studies using scanning electron microscopy (SEM) and transmission electron microscopy (TEM) were conducted to fully analyze the transverse and longitudinal structure of these high thermal conductivity fibers.Ribbon-shaped fibers, melt-spun from a synthetic mesophase pitch and then heat treated, were tested to determine their tensile strengths, tensile moduli and thermal conductivities. A Jeol JSM-I C848 SEM at an accelerating voltage of 20 kV was used to obtain general structural information, such as extent and texture of lamellar organization of the graphitic layers within the fibers, and the microstructure of the fibers was studied by TEM.


Carbon ◽  
2011 ◽  
Vol 49 (11) ◽  
pp. 3622-3630 ◽  
Author(s):  
Abhay Yadav ◽  
Rajeev Kumar ◽  
Gopal Bhatia ◽  
G.L. Verma

Sign in / Sign up

Export Citation Format

Share Document