Effect of temperature and dissolved oxygen on the growth kinetics of Pseudomonas putida F1 growing on benzene and toluene

Chemosphere ◽  
2004 ◽  
Vol 54 (8) ◽  
pp. 1255-1265 ◽  
Author(s):  
Gunaseelan Alagappan ◽  
Robert M. Cowan
2020 ◽  
Vol 307 ◽  
pp. 26-30
Author(s):  
Azman Jalar ◽  
Maria Abu Bakar ◽  
Mohd. Zulhakimi Ab. Razak ◽  
Norliza Ismail

Evaluating the growth kinetics is one of the most important characteristic in assessing the quality and reliability of metallurgical joining, especially in electronics packaging such as soldering and wire bonding technology. The growth kinetics is normally assessed using Arrhenius equation that involves diffusion activities due to thermally activated process. The well-known factors of thermal and time together with generally accepted growth exponent have been widely used for this assessment. The intermetallic compound layer which is the by-product of metallurgical reaction during soldering process has been exposed to high temperature to accelerate its growth. The cross-section of the joining was observed using optical microscope to quantify the layer of intermetallic compound. Morphological effect and shape factor of the layer have been analysed in complement with the effect of temperature and time on the growth behaviour. Directional growth and irregularities shape of the intermetallic layer show some inconsistency on the selection of growth exponent. The effect of initial size of intermetallic layer must also be considered in this assessment. This study suggests that the morphological effect must be analysed prior to the selection the growth exponent in assessing growth behaviour and kinetics of intermetallic layer in metallurgical joining.


1997 ◽  
Vol 25 (5) ◽  
pp. 363-366 ◽  
Author(s):  
V. Guérin-Faublée ◽  
S. Charles ◽  
M. Chomarat ◽  
J.-P. Flandrois

2014 ◽  
Vol 586 ◽  
pp. 66-71 ◽  
Author(s):  
Dong-Geun Lee ◽  
Chenglin Li ◽  
Yongtai Lee ◽  
Xujun Mi ◽  
Wenjun Ye

1997 ◽  
Vol 47 (5) ◽  
pp. 610-614 ◽  
Author(s):  
Ş. Şeker ◽  
H. Beyenal ◽  
B. Salih ◽  
A. Tanyolaç

Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization


1998 ◽  
Vol 536 ◽  
Author(s):  
E. M. Wong ◽  
J. E. Bonevich ◽  
P. C. Searson

AbstractColloidal chemistry techniques were used to synthesize ZnO particles in the nanometer size regime. The particle aging kinetics were determined by monitoring the optical band edge absorption and using the effective mass model to approximate the particle size as a function of time. We show that the growth kinetics of the ZnO particles follow the Lifshitz, Slyozov, Wagner theory for Ostwald ripening. In this model, the higher curvature and hence chemical potential of smaller particles provides a driving force for dissolution. The larger particles continue to grow by diffusion limited transport of species dissolved in solution. Thin films were fabricated by constant current electrophoretic deposition (EPD) of the ZnO quantum particles from these colloidal suspensions. All the films exhibited a blue shift relative to the characteristic green emission associated with bulk ZnO. The optical characteristics of the particles in the colloidal suspensions were found to translate to the films.


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