Thermal degradation kinetics of waste printed circuit boards

2018 ◽  
Vol 130 ◽  
pp. 87-94 ◽  
Author(s):  
Raslan A. Alenezi ◽  
Fahad M. Al-Fadhli
2020 ◽  
Vol 38 (8) ◽  
pp. 903-910 ◽  
Author(s):  
Zhitong Yao ◽  
Jingjing Xiong ◽  
Shaoqi Yu ◽  
Weiping Su ◽  
Weihong Wu ◽  
...  

In this study, the pyrolysis behaviour of nonmetal fraction of waste printed circuit boards (NMF-WPCBs) was studied based on five model-free methods and distributed activation energy model (DAEM). The possible decomposition mechanism was further probed using the Criado method. Thermogravimetric analysis indicated that the NMF-WPCBs pyrolysis process could be divided into three stages with temperatures of 37–330°C, 330–380°C and 380–1000°C. The mass loss at different heating rate was determined as 26.85–29.98%, 13.47–24.21% and 20.43–23.36% for these stages, respectively. The activation energy ( Eα) from various model-free methods first increased with degree of conversion ( α) increasing from 0.05 to 0.275, and then decreased beyond this range. The coefficient ( R) from the Flynn–Wall–Ozawa (FWO) method was higher, and the resulting Eα fell into the range of 214.947–565.660 kJ mol−1. For the DAEM method, the average Eα value was determined as 337.044 kJ mol−1, comparable with 329.664 kJ mol−1 from the FWO method. The thermal decomposition kinetics of NMF-WPCBs could be better described by the second-order reaction.


2011 ◽  
Vol 107 (3-4) ◽  
pp. 124-132 ◽  
Author(s):  
Eun-young Kim ◽  
Min-seuk Kim ◽  
Jae-chun Lee ◽  
Jinki Jeong ◽  
B.D. Pandey

2014 ◽  
Vol 13 (10) ◽  
pp. 2601-2607 ◽  
Author(s):  
Jae-chun Lee ◽  
Manoj Kumar ◽  
Min-Seuk Kim ◽  
Jinki Jeong ◽  
Kyoungkeun Yoo

Author(s):  
P. Singh ◽  
G.T. Galyon ◽  
J. Obrzut ◽  
W.A. Alpaugh

Abstract A time delayed dielectric breakdown in printed circuit boards, operating at temperatures below the epoxy resin insulation thermo-electrical limits, is reported. The safe temperature-voltage operating regime was estimated and related to the glass-rubber transition (To) of printed circuit board dielectric. The TG was measured using DSC and compared with that determined from electrical conductivity of the laminate in the glassy and rubbery state. A failure model was developed and fitted to the experimental data matching a localized thermal degradation of the dielectric and time dependency. The model is based on localized heating of an insulation resistance defect that under certain voltage bias can exceed the TG, thus, initiating thermal degradation of the resin. The model agrees well with the experimental data and indicates that the failure rate and truncation time beyond which the probability of failure becomes insignificant, decreases with increasing glass-rubber transition temperature.


Molecules ◽  
2021 ◽  
Vol 26 (6) ◽  
pp. 1597
Author(s):  
Iman Jafari ◽  
Mohamadreza Shakiba ◽  
Fatemeh Khosravi ◽  
Seeram Ramakrishna ◽  
Ehsan Abasi ◽  
...  

The incorporation of nanofillers such as graphene into polymers has shown significant improvements in mechanical characteristics, thermal stability, and conductivity of resulting polymeric nanocomposites. To this aim, the influence of incorporation of graphene nanosheets into ultra-high molecular weight polyethylene (UHMWPE) on the thermal behavior and degradation kinetics of UHMWPE/graphene nanocomposites was investigated. Scanning electron microscopy (SEM) analysis revealed that graphene nanosheets were uniformly spread throughout the UHMWPE’s molecular chains. X-Ray Diffraction (XRD) data posited that the morphology of dispersed graphene sheets in UHMWPE was exfoliated. Non-isothermal differential scanning calorimetry (DSC) studies identified a more pronounced increase in melting temperatures and latent heat of fusions in nanocomposites compared to UHMWPE at lower concentrations of graphene. Thermogravimetric analysis (TGA) and derivative thermogravimetric (DTG) revealed that UHMWPE’s thermal stability has been improved via incorporating graphene nanosheets. Further, degradation kinetics of neat polymer and nanocomposites have been modeled using equations such as Friedman, Ozawa–Flynn–Wall (OFW), Kissinger, and Augis and Bennett’s. The "Model-Fitting Method” showed that the auto-catalytic nth-order mechanism provided a highly consistent and appropriate fit to describe the degradation mechanism of UHMWPE and its graphene nanocomposites. In addition, the calculated activation energy (Ea) of thermal degradation was enhanced by an increase in graphene concentration up to 2.1 wt.%, followed by a decrease in higher graphene content.


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