Comparison on failure behavior of three-dimensional woven carbon/carbon composites joints subjected to out-of-plane loading at room and high temperature

2020 ◽  
pp. 100567
Author(s):  
Yanfeng Zhang ◽  
Zhengong Zhou ◽  
Shidong Pan ◽  
Zhiyong Tan
Keyword(s):  
High Temperature ◽  
Three Dimensional ◽  
Failure Behavior ◽  
Carbon Composites ◽  
Out Of Plane

Tensile Strength Prediction of Out-of-Plane Composite Joints for Integrated Composite Cabins

2014 ◽  
Vol 620 ◽  
pp. 429-432
Author(s):  
Xiao Hong Zhou ◽  
Dong Hua Zhang ◽  
Long Wei Zhou
Keyword(s):  
Damage Model ◽  
Three Dimensional ◽  
Failure Behavior ◽  
Displacement Curve ◽  
Material Degradation ◽  
Degradation Model ◽  
Composite Joint ◽  
Axial Tensile ◽  
Out Of Plane ◽  
Progressive Damage Model

The failure of an adhesive-bonded and bolted composite joint under axial tensile loading is investigated. A progressive damage model consisting of a three dimensional FEM accompanying with a three dimensional maximum stress failure criterion and corresponding material degradation model is established to predict the failure behavior of the joint. The predicted failure load and load-displacement curve are validated by the experimental results is obtained. Moreover, the result shows that the discontinuity between two L-shaped laminates is the weak spot and required to be strengthened.

Influence of stitching on the out-of-plane behavior of composite materials – A mechanistic review

2021 ◽  
pp. 002199832110092
Author(s):  
Daniel A Drake ◽  
Rani W Sullivan ◽  
Andrew E Lovejoy ◽  
Stephen B Clay ◽  
Dawn C Jegley
Keyword(s):  
High Temperature ◽  
Composite Laminates ◽  
Polymer Matrix Composites ◽  
Three Dimensional ◽  
Cost Effective ◽  
Test Methods ◽  
Sandwich Composites ◽  
Fiber Reinforced Polymer Composites ◽  
Out Of Plane ◽  
The Impact

Fiber-reinforced polymer composites are widely used in the aerospace industry due to their high stiffness and strength-to-weight ratios. However, their applicability can be limited by their relatively low interlaminar properties when compared to metallic alternatives. Through-thickness reinforcement approaches, such as stitching, z-pinning, needling, tufting, and three-dimensional weaving, have been developed in recent decades to enhance the interlaminar properties of composites. Stitching is considered to be an efficient and cost-effective method to reinforce composites in the through-thickness direction. Additionally, stitch parameters (stitch density, linear thread density, thread material, pretension, etc.) highly influence the in-plane and out-of-plane properties. This paper summarizes results from over one hundred papers on the influence of stitch parameters on fracture energy, interlaminar strength, and impact characteristics of stitched composite laminates, sandwich composites, and high-temperature composites. Much of the research on the influence of stitch parameters has focused on thermoset polymer matrix composites (PMCs), while fewer studies have investigated the impact of stitch parameters on high temperature or sandwich composites. Modification of existing and new test methods have been developed to adequately measure the effectiveness of stitching on the out-of-plane behavior of PMC panels. Results demonstrate that out-of-plane properties of PMCs are highly dependent on stitch parameters and can be enhanced by through-thickness stitching.

High temperature compressive behavior of three-dimensional five-directional braided composites

2018 ◽  
Vol 60 (7-8) ◽  
pp. 772-776 ◽  
Author(s):  
Jiayi Liu ◽  
Junmeng Zhou ◽  
Yu Wang ◽  
Jie Mei ◽  
Jialin Liu
Keyword(s):  
High Temperature ◽  
Three Dimensional ◽  
Compressive Behavior ◽  
Braided Composites

Three-Dimensional Atomic Structure of Supported Au Nanoparticles at High Temperature

Nanoscale ◽  
2021 ◽  
Author(s):  
Pei Liu ◽  
Ece Arslan Imran ◽  
Annick De Backer ◽  
Annelies de Wael ◽  
Ivan Lobato ◽  
...  
Keyword(s):  
High Temperature ◽  
Atomic Structure ◽  
Au Nanoparticles ◽  
Elevated Temperatures ◽  
Three Dimensional

Au nanoparticles (NPs) deposited on CeO2 are extensively used as thermal catalysts since the morphology of the NPs is expected to be stable at elevated temperatures. Although it is well...

Numerical and experimental investigation for enhancing the energy absorption capacity of the novel three-dimensional printed sandwich structures

2021 ◽  
pp. 146442072199749
Author(s):  
H Geramizadeh ◽  
S Dariushi ◽  
S Jedari Salami
Keyword(s):  
Energy Absorption ◽  
Sandwich Structures ◽  
Three Dimensional ◽  
Absorption Capacity ◽  
The Novel ◽  
Energy Absorption Capacity ◽  
Fused Deposition ◽  
Honeycomb Sandwich ◽  
Out Of Plane ◽  
Vertical Walls

The current study focuses on designing the optimal three-dimensional printed sandwich structures. The main goal is to improve the energy absorption capacity of the out-of-plane honeycomb sandwich beam. The novel Beta VI and Alpha VI were designed in order to achieve this aim. In the Beta VI, the connecting curves (splines) were used instead of the four diagonal walls, while the two vertical walls remained unchanged. The Alpha VI is a step forward on the Beta VI, which was promoted by filleting all angles among the vertical walls, created arcs, and face sheets. The two offered sandwich structures have not hitherto been provided in the literature. All models were designed and simulated by the CATIA and ABAQUS, respectively. The three-dimensional printer fabricated the samples by fused deposition modeling technique. The material properties were determined under tensile, compression, and three-point bending tests. The results are carried out by two methods based on experimental tests and finite element analyses that confirmed each other. The achievements provide novel insights into the determination of the adequate number of unit cells and demonstrate the energy absorption capacity of the Beta VI and Alpha VI are 23.7% and 53.9%, respectively, higher than the out-of-plane honeycomb sandwich structures.

Preparation, microstructure and properties of three-dimensional carbon/carbon composites with high thermal conductivity

Carbon ◽  
2021 ◽  
Vol 174 ◽  
pp. 758-759
Author(s):  
Bao-liu Li ◽  
Jian-guang Guo ◽  
Bing Xu ◽  
Hui-tao Xu ◽  
Zhi-jun Dong ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Three Dimensional ◽  
High Thermal Conductivity ◽  
Carbon Composites ◽  
Microstructure And Properties

scholarly journals In-Process Measurement of Three-Dimensional Deformations Based on Speckle Photography

2021 ◽  
Vol 11 (11) ◽  
pp. 4981
Author(s):  
Andreas Tausendfreund ◽  
Dirk Stöbener ◽  
Andreas Fischer
Keyword(s):  
Evaluation Method ◽  
Process Analysis ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Machining Process ◽  
Image Correlation ◽  
Speckle Photography ◽  
Process Measurement ◽  
Out Of Plane ◽  
Plane Deformations

In the concept of the process signature, the relationship between a material load and the modification remaining in the workpiece is used to better understand and optimize manufacturing processes. The basic prerequisite for this is to be able to measure the loads occurring during the machining process in the form of mechanical deformations. Speckle photography is suitable for this in-process measurement task and is already used in a variety of ways for in-plane deformation measurements. The shortcoming of this fast and robust measurement technique based on image correlation techniques is that out-of-plane deformations in the direction of the measurement system cannot be detected and increases the measurement error of in-plane deformations. In this paper, we investigate a method that infers local out-of-plane motions of the workpiece surface from the decorrelation of speckle patterns and is thus able to reconstruct three-dimensional deformation fields. The implementation of the evaluation method enables a fast reconstruction of 3D deformation fields, so that the in-process capability remains given. First measurements in a deep rolling process show that dynamic deformations underneath the die can be captured and demonstrate the suitability of the speckle method for manufacturing process analysis.

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