Highly thermally conductive POSS-g-SiCp/UHMWPE composites with excellent dielectric properties and thermal stabilities

2015 ◽  
Vol 78 ◽  
pp. 95-101 ◽  
Author(s):  
Junwei Gu ◽  
Yongqiang Guo ◽  
Zhaoyuan Lv ◽  
Wangchang Geng ◽  
Qiuyu Zhang
Keyword(s):  
Dielectric Properties ◽  
Thermal Stabilities ◽  
Thermally Conductive ◽  
Uhmwpe Composites

Ideal dielectric thermally conductive bismaleimide nanocomposites filled with polyhedral oligomeric silsesquioxane functionalized nanosized boron nitride

RSC Advances ◽  
2016 ◽  
Vol 6 (42) ◽  
pp. 35809-35814 ◽  
Author(s):  
Junwei Gu ◽  
Chaobo Liang ◽  
Jing Dang ◽  
Wencai Dong ◽  
Qiuyu Zhang
Keyword(s):  
Dielectric Properties ◽  
Boron Nitride ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Thermal Stabilities ◽  
Thermally Conductive ◽  
Oligomeric Silsesquioxane ◽  
Ideal Dielectric ◽  
Diallylbisphenol A

NH2–POSS functionalized nanosized boron nitride fillers were performed to fabricate thermally conductive bismaleimide/diallylbisphenol A (BMI/DABA) nanocomposites combining excellent dielectric properties and outstanding thermal stabilities.

Preparation and Properties of Silicon-Containing Arylacetylene Resins with Octa(maleimidophenyl)silsesquioxane

2012 ◽  
Vol 557-559 ◽  
pp. 1152-1156
Author(s):  
Yan Zhou ◽  
Fu Wei Huang ◽  
Fa Rong Huang ◽  
Lei Du
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Thermal Polymerization ◽  
Curing Process ◽  
Thermal Stabilities ◽  
Curing Reaction ◽  
Air Atmosphere ◽  
Ft Ir ◽  
Dsc Analyses

Modified silicon-containing arylacetylene resins (DMSEPE-OMPS) were prepared from poly(dimethylsilyleneethynylenephenyleneethynylene) (DMSEPE) and Octa(maleimidophenyl)- silsesquioxane (OMPS). The curing reaction of DMSEPE-OMPS resin was studied by FT-IR and DSC techniques. Thermal stability and dielectric properties of cured DMSEPE-OMPS resins were determined. FT-IR and DSC analyses indicate that thermal polymerization of DMSEPE-OMPS resin occurs in the curing process. Thermal stabilities of cured DMSEPE-OMPS resins under N2 and air atmosphere decrease gradually with the increment of OMPS components. The incorporation of OMPS can obviously reduce dielectric constant of DMSEPE-OMPS resins.

Improved Thermal Conductivity and Mechanical Property of PTFE Reinforced with Al2O3

NANO ◽  
2019 ◽  
Vol 14 (05) ◽  
pp. 1950064 ◽  
Author(s):  
Min Chao ◽  
Changjuan Guo ◽  
Ailing Feng ◽  
Zhengyong Huang ◽  
Qingli Yang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Mechanical Property ◽  
Dielectric Properties ◽  
Thermal Conductance ◽  
High Thermal Conductivity ◽  
Mass Content ◽  
Thermal Stabilities ◽  
Cold Pressing ◽  
Sintering Method

To achieve polymer-based composites for electronic packaging with high thermal conductivity, Al2O3 nanoplatelets were introduced into polytetrafluoroethylene (PTFE) matrix via a cold pressing and sintering method. The effect of mass content of the Al2O3 platelets on the morphology, mechanical properties, thermal conductivity and dielectric properties of the composites was investigated. The results revealed that the Al2O3/PTFE nanocomposites exhibited higher thermal conductivities, better thermal stabilities, enhanced mechanical properties with considerable dielectric properties. The largest thermal conductivity of the Al2O3/PTFE nanocomposites filled with 25[Formula: see text]wt.% Al2O3 platelets was 0.461[Formula: see text]W[Formula: see text]m[Formula: see text][Formula: see text]K[Formula: see text], increased by 85% compared with that of pure PTFE. The improved thermal conductivity of Al2O3/PTFE can be attributed to the formation of effective thermal conductance network within the PTFE matrix due to the interconnectivity of Al2O3 platelets.

Improving dielectric properties and thermal conductivity of polymer composites with CaCu3Ti4O12 and β-SiC hybrid fillers

2015 ◽  
Vol 08 (03) ◽  
pp. 1540011 ◽  
Author(s):  
Xin Ouyang ◽  
Peng Cao ◽  
Weijun Zhang ◽  
Zhaohui Huang ◽  
Wei Gao
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Response ◽  
Interfacial Polarization ◽  
Melt Blending ◽  
Hybrid Fillers ◽  
Different Types ◽  
Thermally Conductive ◽  
Sic Whiskers

In this paper, we report a series of homogeneous polymeric composites with enhanced dielectric properties and thermal conductivity. The composites were constituted of polyvinylidene fluorides (PVDFs) matrix and CaCu 3 Ti 4 O 12 (CCTO) monolithic or CCTO/β- SiC hybrid fillers, and prepared by simple melt blending and hot moulding technique. The influence of different types of fillers and their composition on the dielectric response and thermal conductivity of the obtained composites was studied. Results show that hybrid loading is preferred and a reasonable combination of thermal conductivity (0.80 W⋅m-1⋅K-1), dielectric constant (∼50) and dielectric loss (∼0.07) at 103 Hz was achieved in the PVDF composite containing 40 vol.% CCTO and 10 vol.% β- SiC . The strong dipolar and interfacial polarization derived from the fillers are responsible for the enhancement of the dielectric constant, while the formation of thermally conductive networks/chains by β- SiC whiskers contributes to the improved thermal conductivity.

Thermally conductive and electrically insulating alumina-coated graphite/phthalonitrile composites with thermal stabilities

2021 ◽  
Vol 202 ◽  
pp. 108558
Author(s):  
Xianyuan Liu ◽  
Zilong Wang ◽  
Jinsong Sun ◽  
Zehua Zhao ◽  
Shuyi Zhan ◽  
...  
Keyword(s):  
Thermal Stabilities ◽  
Thermally Conductive
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