Experimental investigation on thermal management of a photovoltaic module using water-jet impingement cooling

2021 ◽  
Vol 228 ◽  
pp. 113686
Author(s):  
Mohammad Javidan ◽  
Ali Jabari Moghadam
Author(s):  
Qiang Li ◽  
Yimin Xuan ◽  
Feng Yu ◽  
Junjie Tan

An experimental investigation was performed to study the heat transfer and flow features of Cu-water nanofluids (Cu particles with 26 nm diameter) in a submerged jet impingement cooling system. Three particular nozzle-to-heated surface distances (2, 4 and 6 mm) and four particle volume fractions (1.5%, 2.0%, 2.5% and 3.0%) are involved in the experiment. The experimental results reveal that the suspended nanoparticles increase the heat transfer performance of the base liquid in the jet impingement cooling system. Within the range of experimental parameters considered, it has been found that highest surface heat transfer coefficients can be achieved using a nozzle-to-surface distance of 4 mm and the nanofluid with 3.0% particle volume fraction. In addition, the experiments show that the system pressure drop of the dilute nanofluids is almost equal to that of water under the same entrance velocity.


Author(s):  
W. Kinzy Jones ◽  
Surya Kappagantula ◽  
Marc Zampino

With power densities near 200 W/cm2 for devices, new methods for thermal management from the heat generation at the die to heat removal to the ambient must be addressed. Signal interconnect and thermal management are often decoupled, with the I/Os from the substrate to the chip through flip chip solder balls and heat removed through the backside of the chip. However, interconnect substrates could provide both first level interconnect and fluid cooling thermal management. Providing micro channels in the same dimension as the interconnect pitch in the substrate allows for new and novel cooling methods to be integrated at the lowest level of chip assembly. X-Y micro channels less than 2 5 m wide and Z dimension channels 4 5 m wide were fabricated within the LTCC substrate. The integrated micro channels allow for direct jet impingement cooling. Initial thermal testing using single jet impingement demonstrated over a 200X reduction in thermal impedance.


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