3D printed micro-jet impingement cooling for thermal management of ultra-high power GaN transistors

Author(s):  
G. Zhang ◽  
J.W. Pomeroy ◽  
M. E. Navarro ◽  
H. Cao ◽  
M. Kuball ◽  
...  
2014 ◽  
Vol 136 (1) ◽  
Author(s):  
Sun-Min Kim ◽  
Kwang-Yong Kim

Optimization of a hybrid double-side jet impingement cooling system for high-power light emitting diodes (LEDs) was performed using a hybrid multi-objective evolutionary approach and three-dimensional numerical analysis for steady incompressible laminar flow and conjugate heat transfer using Navier–Stokes equations. For optimization, two design variables, i.e., ratios of the diameter of jet holes and the distance from the exit of upper impinging hole to chips to thickness of substrate were chosen out of the various geometric parameters affecting the performance of the cooling system. To evaluate cooling performance and pressure loss of the system, two objective functions, viz., the ratio of the maximum temperature to average temperature on the chips and pressure coefficient, were selected. Surrogate modeling of the objective functions was performed using response surface approximation. The Pareto-optimal solutions were obtained using a multi-objective evolutionary algorithm, and performances of three representative Pareto-optimal designs were discussed compared to a reference design. In the optimal designs, higher level of uniform cooling was generally achieved with higher pressure coefficient. The Pareto-sensitivity analysis between the objective function and design variable was also performed.


2019 ◽  
Vol 34 (7) ◽  
pp. 6601-6612 ◽  
Author(s):  
Tiwei Wei ◽  
Herman Oprins ◽  
Vladimir Cherman ◽  
Jun Qian ◽  
Ingrid De Wolf ◽  
...  

Author(s):  
W. Kinzy Jones ◽  
Surya Kappagantula ◽  
Marc Zampino

With power densities near 200 W/cm2 for devices, new methods for thermal management from the heat generation at the die to heat removal to the ambient must be addressed. Signal interconnect and thermal management are often decoupled, with the I/Os from the substrate to the chip through flip chip solder balls and heat removed through the backside of the chip. However, interconnect substrates could provide both first level interconnect and fluid cooling thermal management. Providing micro channels in the same dimension as the interconnect pitch in the substrate allows for new and novel cooling methods to be integrated at the lowest level of chip assembly. X-Y micro channels less than 2 5 m wide and Z dimension channels 4 5 m wide were fabricated within the LTCC substrate. The integrated micro channels allow for direct jet impingement cooling. Initial thermal testing using single jet impingement demonstrated over a 200X reduction in thermal impedance.


Author(s):  
Cristina H. Amon ◽  
S. C. Yao

This presentation describes the development of EDIFICE: Embedded Droplet Impingement For Integrated Cooling of Electronics. The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes over 100 W/cm2, employing latent heat of vaporization of dielectric fluids. Micro-manufacturing and MEMS (Micro Electro-Mechanical Systems) will be discussed as enabling technologies for innovative cooling schemes recently proposed. Micro-spray nozzles are fabricated to produce 50–100 micron droplets coupled with surface texturing on the backside of the chip to promote droplet spreading and effective evaporation. A novel feature to enable adaptive on-demand cooling is MEMS sensing (on-chip temperature, remote IR temperature and ultrasonic dielectric film thickness) and MEMS actuation. EDIFICE is integrated within the electronics package and fabricated using advanced micro-manufacturing technologies (e.g., Deep Reactive lon Etching (DRIE) and CMOS CMU-MEMS). The development of EDIFICE involves modeling, CFD simulations, and physical experimentation on test beds. This lecture will then examine jet impingement cooling of EDIFICE with a dielectric coolant and the influence of fluid properties, micro spray characteristics, and surface evaporation. The development of micro nozzles, micro-structured surface texturing, and the system integration of the evaporator is discussed. Results of a prototype testing of swirl nozzles with dielectric fluid HFE-7200 on a notebook PC are presented. This paper also reviews liquid and evaporative cooling research applied to thermal management of electronics. It outlines the challenges to practical implementation and future research needs.


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