Jet Impingement Cooling Using Micro Channels in Low Temperature Cofire Ceramic (LTCC) Substrates

2005 ◽  
Author(s):  
W. Kinzy Jones ◽  
Surya Kappagantula ◽  
Marc Zampino
Keyword(s):  
Thermal Management ◽  
Flip Chip ◽  
Heat Removal ◽  
Jet Impingement ◽  
Thermal Testing ◽  
Thermal Impedance ◽  
Impingement Cooling ◽  
Micro Channels ◽  
Solder Balls ◽  
Single Jet

With power densities near 200 W/cm2 for devices, new methods for thermal management from the heat generation at the die to heat removal to the ambient must be addressed. Signal interconnect and thermal management are often decoupled, with the I/Os from the substrate to the chip through flip chip solder balls and heat removed through the backside of the chip. However, interconnect substrates could provide both first level interconnect and fluid cooling thermal management. Providing micro channels in the same dimension as the interconnect pitch in the substrate allows for new and novel cooling methods to be integrated at the lowest level of chip assembly. X-Y micro channels less than 2 5 m wide and Z dimension channels 4 5 m wide were fabricated within the LTCC substrate. The integrated micro channels allow for direct jet impingement cooling. Initial thermal testing using single jet impingement demonstrated over a 200X reduction in thermal impedance.

Multiphase Submerged Jet Impingement Cooling Utilizing Nanostructured Plates

2012 ◽  
Author(s):  
Ebru Demir ◽  
Ali Kosar ◽  
Turker Izci ◽  
Osman Yavuz Perk ◽  
Muhsincan Sesen ◽  
...  
Keyword(s):  
Cooling System ◽  
Electronic Devices ◽  
Control Sample ◽  
Heat Removal ◽  
Jet Impingement ◽  
Impinging Jets ◽  
Copper Plate ◽  
Impingement Cooling ◽  
Surface Morphologies ◽  
Aluminum Base

An experimental setup is designed to simulate the heat dissipated by electronic devices and to test the effects of nanostructured plates in enhancing the heat removal performance of jet impingement systems in such cooling applications under boiling conditions. Prior experiments conducted in single phase have shown that such different surface morphologies are effective in enhancing the heat transfer performance of jet impingement cooling applications. In this paper, results of the most recent experiments conducted using multiphase jet impingement cooling system will be presented. Distilled water is propelled into four microtubes of diameter 500 μm that provide the impinging jets to the surface. Simulation of the heat generated by miniature electronic devices is simulated through four aluminum cartridge heaters of 6.25 mm in diameter and 31.75 mm in length placed inside an aluminum base. Nanostructured plates of size 35mm×30mm and different surface morphologies are placed on the surface of the base and two thermocouples are placed to the surface of the heating base and the base is submerged into deionized water. Water jets generated using microtubes as nozzles are targeted to the surface of the nanostructured plate from a nozzle to surface distance of 1.5 mm and heat removal characteristics of the system is studied for a range of flow rates and heat flux, varying between 107.5–181.5 ml/min and 1–400000 W/m2, respectively. The results obtained using nanostructured plates are compared to the ones obtained using a plain surface copper plate as control sample and reported in this paper.

Electronic Cooling Using Synthetic Jets

2005 ◽  
Author(s):  
Anna A. Pavlova ◽  
Michael Amitay
Keyword(s):  
Reynolds Number ◽  
Heated Surface ◽  
Low Frequency ◽  
Heat Removal ◽  
Jet Impingement ◽  
Constant Heat Flux ◽  
Synthetic Jet ◽  
Synthetic Jets ◽  
Impingement Cooling ◽  
Jet Cooling

Efficiency of synthetic jet impingement cooling and the mechanisms of heat removal from a constant heat flux surface were investigated experimentally. The effects of jet’s formation frequency and Reynolds number at different nozzle-to-surface distances were investigated and compared to steady jet cooling. It was found that synthetic jets are up to three times more effective than steady jets at the same Reynolds number. For smaller distances, high formation frequency (f = 1200 Hz) synthetic jets remove heat better than low frequency (f = 420 Hz) jets, whereas low frequency jets are more effective at larger distances, with an overlapping region. Using PIV, it was shown that at small distances between the synthetic jet and the heated surface, the higher formation frequency jet is associated with accumulation of vortices before they impinge on the surface. For the lower frequency jet, the wavelength between coherent structures is so large that vortex rings impinge on the surface separately.

Thermal Management in High-Density, Stacked-Die, Multi-chip Modules

2006 ◽  
Vol 968 ◽  
Author(s):  
Thomas Marinis ◽  
Dariusz Pryputniewicz ◽  
Caroline Kondoleon ◽  
Jason Haley
Keyword(s):  
Thermal Management ◽  
Heat Removal ◽  
High Density ◽  
Base Layer ◽  
Copper Metallization ◽  
Thermal Impedance ◽  
Passive Components ◽  
Module Design ◽  
Higher Power ◽  
Module Performance

ABSTRACTVery high density multi-chip modules are being manufactured by tiling an alumina substrate with IC chips and passive components, laminating a film of Kapton over them, laser drilling vias to their I/O pads, and interconnecting them with photo patterned, copper metallization. Additional layers of components and interconnects are added on top of the base layer, as needed, to allow greater integration of large circuits. Current products are typically two layers of chips and seven layers of interconnect. As higher power applications have emerged and the power density of IC chips has increased, thermal management has become a significant factor impacting module design. We have been conducting a thermal modeling effort to map the design space for this technology. Our principal objective is to define and evaluate low thermal impedance (heat removal) configurations for a given chip set. A second objective is to determine what gains in module performance might be realized by improvements in material properties or changes in the relative thicknesses of dielectric and metal layers.

MEMS-Based Spatial and Temporal Thermal Management of High Heat Flux Electronics

2003 ◽  
Author(s):  
Cristina H. Amon ◽  
S. C. Yao
Keyword(s):  
Thermal Management ◽  
Surface Texturing ◽  
Jet Impingement ◽  
Heat Fluxes ◽  
Dielectric Fluid ◽  
Practical Implementation ◽  
High Heat Flux ◽  
Droplet Impingement ◽  
Micro Manufacturing ◽  
Impingement Cooling

This presentation describes the development of EDIFICE: Embedded Droplet Impingement For Integrated Cooling of Electronics. The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes over 100 W/cm2, employing latent heat of vaporization of dielectric fluids. Micro-manufacturing and MEMS (Micro Electro-Mechanical Systems) will be discussed as enabling technologies for innovative cooling schemes recently proposed. Micro-spray nozzles are fabricated to produce 50–100 micron droplets coupled with surface texturing on the backside of the chip to promote droplet spreading and effective evaporation. A novel feature to enable adaptive on-demand cooling is MEMS sensing (on-chip temperature, remote IR temperature and ultrasonic dielectric film thickness) and MEMS actuation. EDIFICE is integrated within the electronics package and fabricated using advanced micro-manufacturing technologies (e.g., Deep Reactive lon Etching (DRIE) and CMOS CMU-MEMS). The development of EDIFICE involves modeling, CFD simulations, and physical experimentation on test beds. This lecture will then examine jet impingement cooling of EDIFICE with a dielectric coolant and the influence of fluid properties, micro spray characteristics, and surface evaporation. The development of micro nozzles, micro-structured surface texturing, and the system integration of the evaporator is discussed. Results of a prototype testing of swirl nozzles with dielectric fluid HFE-7200 on a notebook PC are presented. This paper also reviews liquid and evaporative cooling research applied to thermal management of electronics. It outlines the challenges to practical implementation and future research needs.

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