Low-grade waste heat driven desalination with an open loop heat pipe

Energy ◽  
2018 ◽  
Vol 163 ◽  
pp. 221-228 ◽  
Author(s):  
Xiantao Zhang ◽  
Yuxi Liu ◽  
Xinyi Wen ◽  
Changzheng Li ◽  
Xuejiao Hu
Keyword(s):  
Heat Pipe ◽  
Waste Heat ◽  
Open Loop ◽  
Low Grade ◽  
Loop Heat Pipe

Microfabrication and Packaging Issues in the Development of a Planar Silicon Loop Heat Pipe, Using Si02 Fiber Wicks

2006 ◽  
Author(s):  
Praveen S. Medis ◽  
Srinivas Parimi ◽  
Ahmed Shuja ◽  
H. Thurman Henderson ◽  
Junwoo Suh ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Waste Heat ◽  
Open Loop ◽  
Electronic Cooling ◽  
Loop Heat Pipe ◽  
Cooling Device ◽  
Planar Configuration ◽  
Planar Silicon ◽  
External Power ◽  
And Performance

The focus of this work is the physical development and performance of an infinitely expandable planar non-standard MEMS loop heat pipe, targeted for electronic cooling. The composition is principally semiconductor grade silicon, with some glass components, requiring neither internal pumps nor external power, except the waste heat which causes its operation. In as much as modern microelectronics is of a planar configuration, the cooling device surfaces (unlike the classical cylindrical heat pipe) should ideally also be planar. Here the authors report such a compatible planar heat pipe, infinitely expandable in surface area, using inexpensive batch processing and glass (silicon dioxide) fiber as the wick. Preliminary results have demonstrated 42 and 65 W/Cm2 in closed and open loop configurations, respectively. These power dissipating levels greatly exceed that required for most emerging CPU's and other electronics.

Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink

2018 ◽  
Author(s):  
Michael Ozeh ◽  
A. G. Agwu Nnanna
Keyword(s):  
Heat Pipe ◽  
Mobile Devices ◽  
Heat Recovery ◽  
Waste Heat Recovery ◽  
Waste Heat ◽  
Heat Pipes ◽  
Loop Heat Pipe ◽  
Thermoelectric Voltage ◽  
Voltage Generation ◽  
Alternate Source

Powering small electronics like mobile devices off-grid has remained a challenge; hence, there exists a need for an alternate source of powering these devices. This paper examines the efficacy of a novel nanoparticle-immobilized polyethylene wick in maintaining sufficient thermal gradient across a thermoelectric generator to power these devices with energy from waste heat. The work examines several other heat exchangers including heat pipes and loop heat pipe setups. The experimental evidence reveals that the nanoparticle-immobilized polyethylene wick is capable of generating sufficient thermal potential resulting in 5V, which is the minimum voltage required to power small mobile devices. In the opinion of the authors, this is the first ever recorded account of utilizing waste heat to generate enough voltage to power a mobile device. Experiment demonstrated that the nanoparticle-immobilized polyethylene wick showed over 40% thermoelectric voltage generation increment over a plain polyethylene wick and a metal wick in a loop heat pipe setup.

scholarly journals Design of an experimental device for preheating combustion air

2021 ◽  
Vol 345 ◽  
pp. 00021
Author(s):  
Lucia Martvoňová ◽  
Mária Polačiková ◽  
Juraj Drga ◽  
Alexander Backa
Keyword(s):  
Heat Transfer ◽  
Phase Transformation ◽  
Heat Source ◽  
Heat Pipe ◽  
Waste Heat ◽  
Experimental Device ◽  
Loop Heat Pipe ◽  
Air Supply ◽  
Working Medium

The principle of the proposed device is to use part of the waste heat, which otherwise leaves through the chimney unused into the air, to preheat the combustion air. reducing chimney losses and preheating the combustion air will increase the efficiency of the heat source. the device is actually a gravity loop heat pipe with an evaporating part located behind the furnace and a condensing part in the combustion air supply duct. Heat transfer is realized by means of phase transformation of the working medium in the proposed device.

scholarly journals Performance Analysis of a New Waste Heat Recovery System

2015 ◽  
Vol 12 (1) ◽  
Keyword(s):  
Heat Flux ◽  
Heat Pipe ◽  
Heat Recovery ◽  
Waste Heat ◽  
Maximum Energy ◽  
Heat Fluxes ◽  
Low Grade ◽  
Industrial Plants ◽  
Waste Heat Recovery System ◽  
Recovery System

The overall theme of this research is to capture, concentrate and convert some of the waste heat generated at industrial plants to a valuable form of energy. A new system for heat recovery from low grade energy has been built and tested based on a modified heat pipe technology. A single heat pipe used in this research was able to extract 2 kW of energy from waste heat of 250 oC. However a heat pipe can extract 11.5 kW/m2 heat fluxes. The maximum energy extraction by such system from low grad energy can be up to 3 kW. While a heat pipe regardless of its size can have heat flux up to 16.5 kW/m2 from waste heat flow at 250 oC and 12.3 m/s velocity. Also, the system can extract about 1 kW heat or 6.5 kW/m2 heat flux at temperatures as low as 150 oC. However, the system doesn’t function properly at temperatures lower than 150 oC.

scholarly journals Impact of the amount of working fluid in loop heat pipe to remove waste heat from electronic component

2014 ◽  
Vol 67 ◽  
pp. 02109 ◽  
Author(s):  
Martin Smitka ◽  
Z. Kolková ◽  
Patrik Nemec ◽  
M. Malcho
Keyword(s):  
Heat Pipe ◽  
Waste Heat ◽  
Electronic Component ◽  
Working Fluid ◽  
Loop Heat Pipe

scholarly journals Measurement of Heat Output of a Loop Heat Pipe with Radiation Heating

2019 ◽  
Author(s):  
Peter Hrabovský
Keyword(s):  
Heat Transfer ◽  
Heat Source ◽  
Heat Pipe ◽  
Waste Heat ◽  
Cooling System ◽  
Working Environment ◽  
Heat Output ◽  
Loop Heat Pipe ◽  
Pipe Material ◽  
Heat Transfer Medium

The paper focuses on the ways of heat transfer due to the phase-phase change from liquid to gaseous and vice versa. Described herein are heat transfer devices through a heat pipe and methods for transferring heat from a heat source to a point of consumption. A heat pipe is a device described in the literature as a material with more than 100 times higher thermal conductivity than copper. A heat pipe is an energy-efficient device without the need for an electrically powered element (circulation pump). The aim of this experiment is to construct a loop heat pipe device. Construction of the cooling circuit and ensuring sufficient cooling capacity by external cooling sources. Construction of a heating circuit in the form of a heat source and its regulation of heat output. Another objective is to measure the input and output parameters of the device and to calculate the resulting heat output of the loop heat pipe. The device itself is a cooling system for the removal of generated or waste heat from technological elements such as: electrical transformers, biomass and fossil fuel combustion processes, cooling of high-performance computer workstations, etc. Another objective is to select a suitable heat transfer medium. The right choice guarantees the optimal use of the loop heat pipe device in the optimum temperature working environment while minimizing the formation of non-condensable gases generated by the chemical reactions of the loop heat pipe material itself and the heat transfer medium. This selection greatly affects the cooling performance of the device.

Integrating Coherent Porous Silicon as a Wicking Structure in the MEMS Based Fabrication of a Vertically Wicking Micro-Columnated Loop Heat Pipe

2011 ◽  
Author(s):  
Navdeep S. Dhillon ◽  
Chris Hogue ◽  
Matthew W. Chan ◽  
Jim C. Cheng ◽  
Albert P. Pisano
Keyword(s):  
Thin Film ◽  
Porous Silicon ◽  
Heat Pipe ◽  
Electrochemical Etching ◽  
Open Loop ◽  
Loop Heat Pipe ◽  
Wafer Level ◽  
Condenser Section ◽  
Thin Film Evaporation ◽  
Film Evaporation

System design, component-wise fabrication and experimental thin-film evaporation results are presented for a vertically wicking micro-columnated loop heat pipe. Designed for fabrication using a three-layer wafer stack, this MEMS phase change device has components etched on both sides of the middle silicon wafer that are sealed by thinner top and bottom capping wafers. A coherent porous silicon (CPS) based dual-scale micro-columnated wick design uses a primary wick for capillary pumping and a secondary surface-micro-textured wick for thin-film liquid evaporation. For etching CPS, a Teflon based wafer-level electrochemical etching setup is implemented and results from a preliminary die-level etching study are reported. The main device components, which include the fluid transport channels, the condenser section and the columnated vapor chamber in a non-CPS base, are fabricated on silicon wafers using standard MEMS fabrication techniques. Thermal experiments are performed to study the phenomena of thin-film evaporation in a columnated open-loop micro evaporator.

Operating Ranges of the Planar Loop Heat Pipe Under Non-Vacuum Conditions

2005 ◽  
Author(s):  
Junwoo Suh ◽  
Ahmed Shuja ◽  
Praveen Medis ◽  
Srinivas Parimi ◽  
Frank M. Gerner ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Heat Dissipation ◽  
Energy Transport ◽  
Technical Conference ◽  
Open Loop ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Two Phase ◽  
Vapor Line ◽  
Compensation Chamber

As the trend of high throughput in small packages continues, the heat dissipation becomes a very critical design issue in electronic devices and spacecrafts. The two phase loop heat pipe utilizes the latent heat of working fluid. It consists of an evaporator, compensation chamber, condenser, and liquid and vapor line. The primary wick used as a core part to circulate the working fluid is located in the evaporator. The planar loop heat pipe uses coherent porous silicon (CPS) wick as opposed to the conventional cylindrical configuration, which uses a sintered amorphous metal wick. The clear evaporator machined from Pyrex glass and transparent silicone tubes were utilized to monitor the complex phenomena which occur in the evaporator. Tests were conducted under the non-vacuum condition without a secondary wick. DI-water was used as a working fluid. Like an open loop test previously conducted, there was an operating range in which the liquid could be properly pumped from the compensation chamber to the vapor line under the pumping motion. In this device, more than 6 Watts could be convected from the evaporator to the ambient. Therefore circulation was not observed until powers greater than 6 Watts. There was a circulation of working fluid occurring due to energy transport within the loop when the input power was from 7.94 Watts to 17.6 Watts. The quantity of heat transportation to the loop was calculated by acquiring the empirical heat transfer coefficient. From this calculation it was found that, roughly, 12.1 Watts was transported to the loop and 5.51 Watts was convected to the ambient from the evaporator itself when the applied power was 15.27 Watts.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

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