Dissipating the heat generated in high-performance electronics using graphitic foam heat-sinks cooled with a dielectric liquid

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

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Design and Realization of High Performance Ceramic Heat Sinks

MCM C/Mixed Technologies and Thick Film Sensors ◽

10.1007/978-94-011-0079-3_11 ◽

1995 ◽

pp. 89-100

Author(s):

E. Gambarte ◽

M. Töpfer ◽

A. Paredes ◽

M. Reill ◽

M. Weickhmann

Keyword(s):

High Performance ◽

Heat Sinks

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Characterization of Exotic Material Heat Sinks for Laser Diode Arrays

MRS Proceedings ◽

10.1557/proc-883-ff3.2 ◽

2005 ◽

Vol 883 ◽

Author(s):

Edward.F. Stephens

Keyword(s):

Laser Diode ◽

High Performance ◽

Critical Role ◽

Cost Effective ◽

Heat Sinks ◽

High Peak Power ◽

Low Duty Cycle ◽

Trade Offs ◽

Duty Cycles ◽

Laser Diode Arrays

AbstractLow duty cycle, high peak power, conductively cooled laser diode arrays have been manufactured for several years by a number of different vendors. Typically these packages have been limited to a few percent duty cycles due to thermal problems that develop in tight bar pitch arrays at higher duty cycles. Traditionally these packages are made from some combination of copper and BeO or Tungsten/copper and BeO. Trade-offs between thermal conductivity and CTE matching are always made when manufacturing these devices. In addition, the manufacturability of the heat sinks plays a critical role in creating a cost effective, high performance solution. In this discussion we examine several different exotic materials that have been manufactured and tested as heat sinks for laser diode arrays.

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High performance liquid cooled aluminium nitride heat sinks

Microelectronics International ◽

10.1108/13565369910250050 ◽

1999 ◽

Vol 16 (1) ◽

pp. 21-26 ◽

Cited By ~ 6

Author(s):

R. Hahn ◽

V. Glaw ◽

A. Ginolas ◽

M. Töpfer ◽

K. Wittke ◽

...

Keyword(s):

High Performance ◽

Aluminium Nitride ◽

Heat Sinks

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Thermodynamic Analysis of Heat and Fluid Flow in a Microchannel With Internal Fins

Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment ◽

10.1115/ht2009-88107 ◽

2009 ◽

Author(s):

Ramesh Narayanaswamy ◽

Tilak T. Chandratilleke ◽

Andrew J. L. Foong

Keyword(s):

Heat Transfer ◽

Fluid Flow ◽

Thermodynamic Analysis ◽

Entropy Generation ◽

High Performance ◽

Numerical Study ◽

Three Dimensional ◽

Heat Sinks ◽

Heat Transfer Fluid ◽

Internal Fins

Efficient cooling techniques are one of the critical design requirements for maintaining reliable operational characteristics of modern, miniaturised high performance electronic components. Microchannel heat sinks form an integral part of most devices used for thermal management in electronic equipment cooling. A microchannel of square cross section, having internal longitudinal fins is considered for analysis. A numerical study is carried out to investigate the fluid flow and heat transfer characteristics. Three-dimensional numerical simulations are performed on the microchannel in the presence of a hydrodynamically developed, thermally developing laminar flow. Further on, a thermodynamic analysis is carried out, for a range of fin heights and thermophysical parameters, in order to obtain the irreversibilities due to heat transfer and fluid flow within the microchannel. An optimum fin height, corresponding to the thermodynamically optimum conditions that minimize the entropy generation rates has been obtained. The effect of the presence of internal fins on the entropy generated due to heat transfer, fluid friction, and the total entropy generation is also provided.

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Optimal design of subcooled triangular microchannel heat sink exchangers with variable heat loads for high performance cooling

Journal of Physics Conference Series ◽

10.1088/1742-6596/2116/1/012052 ◽

2021 ◽

Vol 2116 (1) ◽

pp. 012052

Author(s):

David Olugbenga Ariyo ◽

Tunde Bello-Ochende

Keyword(s):

Heat Sink ◽

High Performance ◽

Flow Boiling ◽

High Heat ◽

Geometric Optimization ◽

Heat Fluxes ◽

Heat Sinks ◽

Subcooled Flow Boiling ◽

Subcooled Flow ◽

Microchannel Heat Sinks

Abstract Deionized water at a temperature of 25 °C was used as the cooling fluid and aluminium as the heat sink material in the geometric optimization and parameter modelling of subcooled flow boiling in horizontal equilateral triangular microchannel heat sinks. The thermal resistances of the microchannels were minimized subject to fixed volume constraints of the heat sinks and microchannels. A computational fluid dynamics (CFD) ANSYS code used for both the simulations and the optimizations was validated by the available experimental data in the literature and the agreement was good. Fixed heat fluxes between 100 and 500 W/cm2 and velocities between 0.1 and 7.0 m/s were used in the study. Despite the relatively high heat fluxes in this study, the base temperatures of the optimal microchannel heat sinks were within the acceptable operating range for modern electronics. The pumping power requirements for the optimal microchannels are low, indicating that they can be used in the cooling of electronic devices.

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