Dual functional jute fabric biocomposite with chitosan and phosphorylated nano-cellulose (antimicrobial and thermal stability)

The reinforcement of PLA matrix with natural fibers aims to generate the sustainable biocomposites. Kenaf fiber (KF) and bacterial cellulose (BC) were employed to reinforce and diminish the usage of PLA matrix. Particularly, BC is nano-cellulose which was anticipated to increased interfacial area and therefore low volume fractions of additives. That was consequently to attain mechanical property improvement. Thus, the incorporation of KF and BC reinforced PLA composites was investigated. The extrusion method was utilized and materials were mixed outside prior to adding. The specimens were examined mechanical testing, Dynamic Mechanical Analysis (DMA), Differential Scanning Calorimetry (DSC), Thermo Gravimetric Analysis (TGA) and Scanning Electron Microscopes (SEM). The mechanical study revealed that the increment of elastic modulus increased concomitantly with the augmentation of KF content. Interestingly, PLA/KF/BC sample at ratio of 60/39/1 wt.% was efficiently to maintain tensile and flexural strength comparing to 50% reduction of without BC sample with equal fiber volume. Therefore, it could recognize that mechanical properties was improved by using low amount of nano-cellulose. This would be a high aspect ratio of BC that capable to connect between PLA matrix and KF which enhanced a large contact surface and therefore excellent coherence. The temperature dependence of storage, loss and tan delta was determined by DMA. A decrease of storage modulus was consistent with increasing of temperature, result from softening of the composites. Loss modulus was increased approximately at Tg which related to storage modulus cause. In addition, the tan delta peaks of PLA and composites were around 60°C and it did not significantly shift when emerged of fiber. DSC of both composites indicated an influence of fiber on the crystallization and enthalpy. On the other hand, glass transition and melting temperature did not significantly affect. The composites exhibited a small reduction of thermal stability when examined by TGA analysis. Notwithstanding, BC showed an improvement of thermal stability of PLA/KF/BC sample at 40 wt.% total fiber content. The linkage of BC between PLA matrix and KF was monitored by SEM.

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Achieving a Stable Solid Electrolyte Interphase and Enhanced Thermal Stability by a Dual-Functional Electrolyte Additive toward a High-Loading LiNi0.8Mn0.1Co0.1O2 /Lithium Pouch Battery

ACS Applied Materials & Interfaces ◽

10.1021/acsami.1c17209 ◽

2021 ◽

Author(s):

Hang Li ◽

Zhipeng Wen ◽

Dongzheng Wu ◽

Weijie Ji ◽

Zheng He ◽

...

Keyword(s):

Thermal Stability ◽

Solid Electrolyte ◽

Solid Electrolyte Interphase ◽

High Loading ◽

Electrolyte Additive ◽

Dual Functional

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Extraction and Characterization of Nanocellulose from Eragrostis Teff Straw

10.21203/rs.3.rs-296990/v1 ◽

2021 ◽

Author(s):

Ebise Getacho Bacha ◽

Hundessa Dessalegn Demsash

Keyword(s):

Thermal Stability ◽

Particle Size ◽

Fourier Transform ◽

Infrared Spectroscopy ◽

Fourier Transform Infrared Spectroscopy ◽

Alkaline Hydrolysis ◽

Thermogravimetry Analysis ◽

Hydrolysis Process ◽

Nano Cellulose

Abstract This work presents the extraction and characterization of nanocellulose from agricultural waste (Eragrostis Teff) straw. The proximate analysis of the straw was done with three triplicates and the average value was recorded. The moisture, ash, volatile matter, and fixed carbon content were 6.4%, 5.1%, 74.2%, and 15.6%, respectively. The extractives, lignin, hemicellulose, and cellulose content were found to be 8.5%, 17.5%, 29.5%, 36.5%, respectively. The cellulose was extracted from teff straw by hot water treatment, acid-chlorite delignification, and alkaline hydrolysis process respectively. The values of process parameters such as temperature, time, and sodium hydroxide concentration for alkaline hydrolysis were 57.6 \(℃\) , 1hour, and 4(w/v) % respectively to obtain a cellulose yield of 78.7%. The nano cellulose particles were extracted from the cellulose by acid hydrolysis process (48%v/v sulfuric acid) at 35\(℃\) for 30 min and the yield was 42.8%. The characterization of nano cellulose was done by using Fourier-transform infrared spectroscopy, dynamic light scattering, x-ray diffraction, and thermogravimetry analysis/ derivative thermogravimetry analysis to determine the functional group, particle size distribution, crystallinity, and thermal stability respectively. The Fourier-transform infrared spectroscopy result shows that the reduction and total removal of lignin, hemicellulose, and other amorphous parts found in teff straw. The average particle size was found to be 101.6 nm with a polydispersity index of 0.047. The crystallinity index of teff straw and nano cellulose was 47.7 and 77.1% respectively. The thermogravimetry analysis shows the thermal stability of the nanocellulose sample was lower than that of cellulose and teff straw samples.

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The Ordered Phase Formation in Ti-Al-Ga Alloys

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100069193 ◽

1970 ◽

Vol 28 ◽

pp. 440-441

Author(s):

Shiro Fujishiro ◽

Harold L. Gegel

Keyword(s):

Thermal Stability ◽

High Temperature ◽

Titanium Alloys ◽

Growth Kinetics ◽

Stoichiometric Composition ◽

Good Potential ◽

Alpha Titanium ◽

Cold Rolled ◽

Kinetics Of ◽

Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

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Microstructure studies of tungsten silicide schottky contacts on Gaas

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100126445 ◽

1987 ◽

Vol 45 ◽

pp. 328-329

Author(s):

Yih-Cheng Shih ◽

E. L. Wilkie

Keyword(s):

Thermal Stability ◽

Field Effect Transistors ◽

Schottky Contact ◽

Schottky Contacts ◽

Excellent Thermal Stability ◽

Barrier Heights ◽

Gaas Substrates ◽

Film Adhesion ◽

Threshold Voltages ◽

Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

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Evolution of the microstructure of Cu(Ti)/SiO2 layers annealed in NH3

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100138634 ◽

1995 ◽

Vol 53 ◽

pp. 452-453

Author(s):

J. Liu ◽

N. D. Theodore ◽

D. Adams ◽

S. Russell ◽

T. L. Alford ◽

...

Keyword(s):

Thermal Stability ◽

Titanium Nitride ◽

Large Scale ◽

Standard Procedure ◽

Alloy Film ◽

Electron Beam Evaporation ◽

Copper Metallization ◽

Nominal Composition ◽

Ti Alloy ◽

Thermally Grown

Copper-based metallization has recently attracted extensive research because of its potential application in ultra-large-scale integration (ULSI) of semiconductor devices. The feasibility of copper metallization is, however, limited due to its thermal stability issues. In order to utilize copper in metallization systems diffusion barriers such as titanium nitride and other refractory materials, have been employed to enhance the thermal stability of copper. Titanium nitride layers can be formed by annealing Cu(Ti) alloy film evaporated on thermally grown SiO2 substrates in an ammonia ambient. We report here the microstructural evolution of Cu(Ti)/SiO2 layers during annealing in NH3 flowing ambient.The Cu(Ti) films used in this experiment were prepared by electron beam evaporation onto thermally grown SiO2 substrates. The nominal composition of the Cu(Ti) alloy was Cu73Ti27. Thermal treatments were conducted in NH3 flowing ambient for 30 minutes at temperatures ranging from 450°C to 650°C. Cross-section TEM specimens were prepared by the standard procedure.

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