Phase selection during calcium silicide formation for layered and powder growth

AbstractWe comparatively studied the formation of ultra thin Co silicides, Co2Si, CoSi and CoSi2, with/without a Ti-capped and Ti-mediated layer by using rapid thermal annealing in a N2 ambient. Four-point-probe sheet resistance measurements and plan-view electron diffraction were used to characterize the silicides as well as the epitaxial characteristics of CoSi2 with Si. We found that the formation of the Co silicides and their existing duration are strongly influenced by the presence of a Ti-capped and Ti-mediated layer. A Ti-capped layer promotes significantly CoSi formation but suppresses Co2Si, and delays CoSi2, which advantageously increases the silicidation-processing window. A Ti-mediated layer acting as a diffusion barrier to the supply of Co suppresses the formation of both Co2Si and CoSi but energetically favors directly forming CoSi2. Plan-view electron diffraction studies indicated that both a Ti-capped and Ti-mediated layer could be used to form ultra thin epitaxial CoSi2 silicide.

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Impacts of Sample Preparation Methodology on TEM Failure Analysis of Advanced Semiconductor Devices

ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2011p0301 ◽

2011 ◽

Author(s):

Yongkai Zhou ◽

Jie Zhu ◽

Han Wei Teo ◽

ACT Quah ◽

Lei Zhu ◽

...

Keyword(s):

Sample Preparation ◽

Failure Analysis ◽

Case Studies ◽

Thickness Measurement ◽

Interface Roughness ◽

Silicide Formation ◽

Cross Sectional ◽

Inspection Method ◽

Low Mass

Abstract In this paper, two failure analysis case studies are presented to demonstrate the importance of sample preparation procedures to successful failure analyses. Case study 1 establishes that Palladium (Pd) cannot be used as pre-FIB coating for SiO2 thickness measurement due to the spontaneously Pd silicide formation at the SiO2/Si interface. Platinum (Pt) is thus recommended, in spite of the Pt/SiO2 interface roughness, as the pre-FIB coating in this application. In the second case study, the dual-directional TEM inspection method is applied to characterize the profile of the “invisible” tungsten residue defect. The tungsten residue appears invisible in the planeview specimen due to the low mass-thickness contrast. It is then revealed in the cross-sectional TEM inspection.

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X-ray photoemission spectromicroscopy of titanium silicide formation in patterned microstructures

10.2172/603492 ◽

1997 ◽

Author(s):

S Singh ◽

H Solak ◽

F Cerrina

Keyword(s):

Titanium Silicide ◽

Silicide Formation ◽

X Ray

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Laser thermal processing for shallow junction and silicide formation

10.1117/12.323992 ◽

1998 ◽

Cited By ~ 10

Author(s):

Somit Talwar ◽

Gaurav Verma ◽

Kurt H. Weiner ◽

Carol Gelatos

Keyword(s):

Thermal Processing ◽

Silicide Formation ◽

Shallow Junction ◽

Laser Thermal Processing

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Study on the Phase Selection and Debye Temperature of Hyper-Peritectic Al-Ni Alloy under High Pressure

Metals ◽

10.3390/met11010084 ◽

2021 ◽

Vol 11 (1) ◽

pp. 84

Author(s):

Xiaohong Wang ◽

Zhipeng Chen ◽

Duo Dong ◽

Dongdong Zhu ◽

Hongwei Wang ◽

...

Keyword(s):

High Pressure ◽

Ambient Pressure ◽

Competitive Growth ◽

Phase Selection ◽

Debye Temperatures ◽

Ni Alloy ◽

Temperature Heat ◽

Low Temperature Heat Capacity ◽

New Phase ◽

Selection Of

The phase selection of hyper-peritectic Al-47wt.%Ni alloy solidified under different pressures was investigated. The results show that Al3Ni2 and Al3Ni phases coexist at ambient pressure, while another new phase α-Al exists simultaneously when solidified at high pressure. Based on the competitive growth theory of dendrite, a kinetic stabilization of metastable peritectic phases with respect to stable ones is predicted for different solidification pressures. It demonstrates that Al3Ni2 phase nucleates and grows directly from the undercooled liquid. Meanwhile, the Debye temperatures of Al-47wt.%Ni alloy that fabricated at different pressures were also calculated using the low temperature heat capacity curve.

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