Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification
2013 ◽
Vol 566
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pp. 239-245
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2013 ◽
Vol 42
(3)
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pp. 492-501
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2008 ◽
Vol 18
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pp. 814-818
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2014 ◽
Vol 55
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pp. 450-455
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2010 ◽
Vol 2010
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pp. 000314-000318
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2013 ◽
Vol 22
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pp. 2359-2365
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2014 ◽
Vol 593
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pp. 79-84
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2017 ◽
Vol 701
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pp. 187-195
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2003 ◽
Vol 18
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pp. 1528-1534
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