Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate

2016 ◽  
Vol 122 (4) ◽  
Author(s):  
Xiaowu Hu ◽  
Tao Xu ◽  
Xiongxin Jiang ◽  
Yulong Li ◽  
Yi Liu ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Cooling Rate ◽  
Thermal Aging ◽  
Growth Behavior ◽  
Sac305 Solder ◽  
Cu Substrate ◽  
Interfacial Intermetallic Compound

Effect of Ni concentration on solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu substrates

2019 ◽  
Vol 33 (01) ◽  
pp. 1850425 ◽  
Author(s):  
Hongming Cai ◽  
Yang Liu ◽  
Shengli Li ◽  
Hao Zhang ◽  
Fenglian Sun ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Diffusion Barrier ◽  
Graphene Layer ◽  
Solder Joints ◽  
Cu Substrate ◽  
Ni Content ◽  
Increasing Trend ◽  
Cu Substrates ◽  
Interfacial Intermetallic Compound ◽  
Positive Effect

In this paper, solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu (G-Cu) substrates were studied. As Ni content increases in the solder, the solderability improves gradually on both the Cu and G-Cu substrates. The solderability of SAC0705-xNi is better on G-Cu substrate than that on Cu substrate. The increasing Ni content in the solder has a positive effect on the microstructure refinement of both the kinds of substrates. Such effect is more significant on G-Cu substrate than that on Cu substrate. With the increase of Ni content, the thickness of the interfacial intermetallic compound (IMC) shows an increasing trend first and then decreasing trend on the two kinds of substrates. Since the graphene layer works as a diffusion barrier, the IMC on G-Cu is thinner than that on Cu substrate. The addition of Ni leads to the strengthening of the microstructure and thus increases the hardness of the solder bulks.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

2016 ◽  
Vol 700 ◽  
pp. 123-131 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Isothermal Aging ◽  
Composite Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Interfacial Imcs ◽  
Planar Shape ◽  
Interfacial Intermetallic Compound

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

Solderability and Interfacial Intermetallic Compound (IMC) Growth of Sn-Cu-Ni Solder with Additions of Germanium

2016 ◽  
Vol 857 ◽  
pp. 8-12
Author(s):  
Fatin Afeeqa Mohd Sobri ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Che Mohd Ruzaidi Ghazali ◽  
Pavithiran Narayanan
Keyword(s):  
Intermetallic Compound ◽  
Aging Time ◽  
Thermal Aging ◽  
Maximum Force ◽  
Wetting Time ◽  
Interfacial Intermetallic Compound

The wettability of Sn-Cu-Ni with Germanium (Ge) additions of 0 ppm, 10 ppm, 60 ppm, 100 ppm and 200 ppm were investigated with Gen3 machine. The range of the wettability shows the lowest and the highest reading of wetting time and maximum force. Three different conditions were investigated which consist of as soldered, reflowed and aged. Further interfacial IMC observation was done for 0 ppm and 60 ppm of Ge to investigate the growth of interfacial IMC after thermal aging. From the measurement, the thickness of IMC for 0 ppm Ge is 2.075μm, 3.936μm and 4.502μm with aging time at 24,120 and 240 hours respectively. While for 60 ppm Ge, the IMC thickness are much lower with 1.8μm, 3.11μm and 4.154μm at the same aging time with 0ppm Ge. The results indicate that 60 ppm of Ge in Sn-Cu-Ni has the lowest wetting time, higher maximum force and slow IMC growth.

Effect of Ni Addition on the Formation and Growth of Intermetallic Compound at Eutectic SnBi/Cu Interface

2010 ◽  
Vol 160-162 ◽  
pp. 709-714
Author(s):  
Tian You Kang ◽  
Yu Yan Xiu ◽  
Bo Xu ◽  
Chun Zhong Liu ◽  
Wei Ping Tong
Keyword(s):  
Growth Rate ◽  
Intermetallic Compound ◽  
Solder Alloy ◽  
Aging Process ◽  
Growth Behavior ◽  
Cu Substrate ◽  
Diffusion Controlled ◽  
Ni Addition ◽  
Cu3sn Layer

The reactions between Cu and the eutectic SnBi (Sn58wt.%Bi) solder alloy with and without 1wt.%Ni addition were investigated in this paper. After as-reflowed process, the IMCs formed in the Sn58wt.%Bi/Cu and Sn58wt.%Bi1wt.%Ni/Cu joints were Cu6Sn5 and (CuNi)6Sn5, respectively. During aging process, the thickness of the IMC layers formed at each solder/Cu joint increased, and a new layer Cu3Sn formed adjacent to the Cu substrate. It was found that 1wt.%Ni addition in Sn58wt.%Bi solder alloy could slightly enhance the growth rate of the total IMC layer, but effectively reduce the growth rate of Cu3Sn layer during aging process. The growth behavior of IMC layer for each joint followed the diffusion-controlled mechanism during aging.

Microstructure, Wettability and IMC Formation of Low-Ag SAC Solder on Cu Substrate

2014 ◽  
Vol 1024 ◽  
pp. 223-226
Author(s):  
Maslinda Kamarudin ◽  
Mohd Sharif Nurulakmal ◽  
Abu Seman Anasyida
Keyword(s):  
Solder Joint ◽  
Grain Boundaries ◽  
Thermal Aging ◽  
Detrimental Effect ◽  
Bulk Solder ◽  
Solder Alloys ◽  
Sac305 Solder ◽  
Cu Substrate ◽  
Solder Microstructure ◽  
Sac Solder

This Paper Reports the Microstructure, IMC Evaluation and Wettability of Low-Ag Sn-Ag-Cu(SAC) (0.3 Wt% Ag and 0.5 Wt% Ag) and SAC305 Solder Alloys in Reflowed and Agedconditions. Reflow was Done at 250°C and Thermal Aging at 150°C For100 Hours. Microstructure of Bulk Solder and the IMC Formed at Interfacebetween Solder and Cu Substrate were Observed Using SEM Equipped with EDX. Microstructureobservation Showed Finer β-Sn Dendrites at 0.3%Ag Indicating a Possiblerefining Effect of Lower Ag on Bulk Solder Microstructure. SEM Result Showedfiner Ag3Sn Distributed in the Solder but the IMC Thickness of Bothreflowed and Aged Solder Joint Seems to Increase with Decreasing Ag Content.This could be due to Finer β-Sn Dendrites which Provide more Diffusion Paththrough Grain Boundaries and Increase IMC Thickness. Similarly, Lower Ag Content Appears to have Detrimental Effect on Wettability and Wetting Angle Ofsolder Joint.

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