Structural and photoluminescent properties of low temperature InAs buffer layer grown by MOVPE on GaAs substrates

2014 ◽  
Vol 396 ◽  
pp. 54-60
Author(s):  
Ph. Komninou ◽  
P. Gladkov ◽  
Th. Karakostas ◽  
J. Pangrác ◽  
O. Pacherová ◽  
...  
2009 ◽  
Vol 48 (8) ◽  
pp. 080208 ◽  
Author(s):  
Qixin Guo ◽  
Yusuke Sueyasu ◽  
Tooru Tanaka ◽  
Mitsuhiro Nishio ◽  
Juncheng Cao

CrystEngComm ◽  
2014 ◽  
Vol 16 (47) ◽  
pp. 10774-10779 ◽  
Author(s):  
Fangliang Gao ◽  
Lei Wen ◽  
Jingling Li ◽  
Yunfang Guan ◽  
Shuguang Zhang ◽  
...  

The effects of the thickness of the large-mismatched amorphous In0.6Ga0.4As buffer layer on the In0.3Ga0.7As epi-films grown on the GaAs substrate have been systematically investigated.


2005 ◽  
Author(s):  
Deping Xiong ◽  
Qi Wang ◽  
Aiguang Ren ◽  
Hui Huang ◽  
Yongqing Huang ◽  
...  

2015 ◽  
Vol 45 (2) ◽  
pp. 859-866 ◽  
Author(s):  
Wei-Ching Huang ◽  
Chung-Ming Chu ◽  
Chi-Feng Hsieh ◽  
Yuen-Yee Wong ◽  
Kai-wei Chen ◽  
...  

1999 ◽  
Vol 562 ◽  
Author(s):  
K. Attenborough ◽  
M. Cerisier ◽  
H. Boeve ◽  
J. De Boeck ◽  
G. Borghs ◽  
...  

ABSTRACTWe have studied the magnetic and structural properties of thin electrodeposited Co and Cu layers grown directly onto (100) n-GaAs and have investigated the influence of a buffer layer. A dominant fourfold anisotropy with a uniaxial contribution is observed in 10 nm Co electrodeposited films on GaAs. An easy axis is observed in the [001] GaAs direction with two hard axes of differing coercivities parallel to the [011] and [011] directions. For thicker films the easy axes in the [001] direction becomes less pronounced and the fourfold anisotropy becomes less dominant. Co films of similar thicknesses deposited onto an electrodeposited Cu buffer layer were nearly isotropic. From X-ray diffraction 21 nm Co layers on GaAs were found to be hcp with the c-axis tending to be in the plane of the film. The anisotropy is ascribed to the Co/GaAs interface and is held responsible for the unique spin-valve properties seen recently in electrodeposited Co/Cu films.


1990 ◽  
Vol 119 (2) ◽  
pp. K155-K158 ◽  
Author(s):  
Š. Chromik ◽  
V. Štrbík ◽  
Š. Beňačka ◽  
R. Adam ◽  
M. Jergel

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