WITHDRAWN: Chemical coagulation/floculation treatment of chemical mechanical polishing (CMP) wastewater from photovoltaic industry

2008 ◽  
Author(s):  
M. Bouiri ◽  
M. Hachemi ◽  
A. Maallemi
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Chemical Coagulation

scholarly journals A pilot plant study using ceramic membrane microfiltration, carbon adsorption and reverse osmosis to treat CMP (chemical mechanical polishing) wastewater

2004 ◽  
Vol 4 (1) ◽  
pp. 111-118 ◽  
Author(s):  
R. Lo ◽  
S.-L. Lo
Keyword(s):  
Reverse Osmosis ◽  
Chemical Mechanical Polishing ◽  
Pilot Plant ◽  
Treatment Process ◽  
Ceramic Membrane ◽  
Scale Up ◽  
Mechanical Polishing ◽  
Chemical Coagulation ◽  
Sedimentation Process ◽  
Carbon Adsorption

Currently, most semi-conductor plants adopt the conventional chemical coagulation and sedimentation process to treat chemical mechanical polishing (CMP) wastewater. This treatment process consumes a large quantity of coagulants, and its optimum pH operation range is rather narrow. This treatment process produces huge amounts of sludge and is hard to operate due to the unstable characteristics of the abrasive slurry of CMP wastewater. The purpose of this research is to establish a pilot plant which consists of chemical pretreatment, ceramic membrane microfiltration, carbon filtration and reverse osmosis system, which will allow the reclamation of the CMP wastewater. Actual CMP wastewater was sampled and treated in the pilot plant. The results of the pilot tests demonstrated the viability of the treatment scheme and provided data for scale-up calculations. Cost per ton of CMP wastewater reclaimed was calculated using the operating data established, and compared with the conventional chemical coagulation and sedimentation process.

scholarly journals Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

2021 ◽  
Vol 11 (10) ◽  
pp. 4358
Author(s):  
Hanchul Cho ◽  
Taekyung Lee ◽  
Doyeon Kim ◽  
Hyoungjae Kim
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Shape Error ◽  
Profile Shape ◽  
Conditioning Process ◽  
Polishing Pad ◽  
Simulation Based ◽  
Diamond Conditioner ◽  
Pad Conditioning ◽  
Good Agreement

The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures. In particular, the uniformity of the polishing pad corresponding to the tool directly affects the polishing uniformity and wafer shape. In this study, the profile shape of a CMP pad was predicted through a kinematic simulation based on the trajectory density of the diamond abrasives of the diamond conditioner disc. The kinematic prediction was found to be in good agreement with the experimentally measured pad profile shape. Based on this, the shape error of the pad could be maintained within 10 μm even after performing the pad conditioning process for more than 2 h, through the overhang of the conditioner.

scholarly journals Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing

2021 ◽  
Author(s):  
Peili Gao ◽  
Tingting Liu ◽  
Zhenyu Zhang ◽  
Fanning Meng ◽  
Run-Ping Ye ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Ordered Mesoporous ◽  
Mesoporous Structures

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

Effects of Slurry pH on Chemical and Mechanical Actions during Chemical Mechanical Polishing of YAG

2021 ◽  
pp. 150359
Author(s):  
Qing Mu ◽  
Zhuji Jin ◽  
Xiaolong Han ◽  
Ying Yan ◽  
Zili Zhang ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing
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