An on-line inspection method for abrasive distribution uniformity of electroplated diamond wire saw

2021 ◽  
Vol 71 ◽  
pp. 290-297
Author(s):  
Yukang Zhao ◽  
Wenbo Bi ◽  
Peiqi Ge
2021 ◽  
Vol 133 ◽  
pp. 105939
Author(s):  
Pengcheng Gao ◽  
Baimei Tan ◽  
Fan Yang ◽  
Hui Li ◽  
Na Bian ◽  
...  

2021 ◽  
Vol 270 ◽  
pp. 118823
Author(s):  
Guangyu Chen ◽  
Yan Li ◽  
Wang Sheng ◽  
Liuqing Huang ◽  
Lizhi Tang ◽  
...  

2021 ◽  
Vol 36 (4) ◽  
pp. 21-32
Author(s):  
Arezou Rasti ◽  
Hamid Ranjkesh Adarmanabadi ◽  
Mohammad Reza Sahlabadi

Nowadays, most mining and quarrying industries utilize a diamond wire saw machine for bench cutting operations. This method uses a metal wire or cable assembled by diamond beads to cut the hard stone into large blocks. Many parameters classified into controllable and uncontrollable parameters affect the performance of the diamond wire saw cutting method. The uncontrollable parameters are related to rock engineering properties, and controllable parameters are related to operational aspects and machine performance. The diamond wire sawing process’s production rate is one of the most critical parameters influencing the design optimization and quarrying cost estimation. The cutting rate and wear rate of diamond beads are the most important factors to evaluate quarries’ production performance. This study aims to determine the effects of different controllable and uncontrollable parameters on different quarries’ production rates. Rock engineering properties like strength, hardness, and abrasivity, and operational aspects, such as cutting angle and drive wheel diameters, are considered as the main factors affecting the production performance of the diamond wire saw method. To discover the influence of these parameters, a detailed investigation in ten quarry operations was carried out. The relation between cutting rate and diamond bead wear with different parameters is estimated. It was observed that different controllable and uncontrollable parameters could increase or decrease the cutting rate and diamond bead wearing. Furthermore, using simple and multiple regression analysis, performance prediction of the cutting rate and wearing of diamond beads was developed, and the best equations were proposed.


2010 ◽  
Vol 431-432 ◽  
pp. 265-268 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge

Based on reciprocating electroplated diamond wire saw (REDWS) slicing experiments, a study on REDWS machining brittle-ductile transition of single crystal silicon was introduced. The machined surfaces and chips were observed by using Scanning Electron Microscope (SEM), and some experimental evidences of the change of material removal mode had been obtained. The experimental results indicate there is a close relationship between material removal mode and the ratio r value of ingot feed speed and wire speed, through controlling and adjusting the r value, the material removal mode can be complete brittle, partial ductile and near-ductile removal.


1977 ◽  
Vol 18 (78) ◽  
pp. 143-144 ◽  
Author(s):  
T.E. Osterkamp

Abstract A diamond wire saw was modified for cutting thin sections of frozen soil and suitable operating conditions were determined experimentally. It was found that a lubricated wire, 0.34 mm in diameter, operaied at cutting velocities of 100-300 mm s-1 and cutting forces 0.02-0.1 kg produced smooth cut surfaces un thin sections 0.4-0.5 mm in thickness. The; temperature and wire size were not critical operating parameters and the wire tensions recommended by the manufacturer were satisfactory. A method of mounting the thin sections is also described.


2016 ◽  
Vol 91 (1-4) ◽  
pp. 1347-1354 ◽  
Author(s):  
Wu Qin ◽  
Liu Zhidong ◽  
Shen Lida ◽  
Yue Weidong ◽  
Zhang Bin

2007 ◽  
Vol 359-360 ◽  
pp. 450-454 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge ◽  
Zhi Jian Hou

The physical model of fixed-abrasive diamond wire-sawing monocrystalline silicon was founded to analyze the elastic deformation of the wire, supposing that every grit was connected to the surface of the wire by a spring. Ignoring lateral vibration of the wire, the geometrical model of wire-sawing was founded; the average cut depth of single grit was calculated theoretically. Based the indentation fracture mechanics and investigations on brittle-ductile transition of machining monocrystalline silicon, the removal mechanism and surface formation was studied theoretically. It shows that in the case of wire-sawing velocity of 10m/s or higher, infeed velocity of 0.20mm/s and diamond grain size of 64μm or smaller, the chip formation and material removal is in a brittle regime mainly, but the silicon wafer surface formation is sawed in a ductile regime. The size of the abrasives, the wire-saw velocity and infeed velocity can influence the sawing process obviously.


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