In the present study, novel AlCoCrNi high entropy nitride (HEN) films were deposited on Si substrate by a reactive direct current magnetron sputtering system. In order to investigate the influence of sputtering parameters on the microstructure and mechanical properties of the film, nitrogen flow ratio (RN: 25–100%) and process pressure (1.33 × 10−1–1.33 Pa) were controlled, respectively. All the films were identified as an amorphous phase with composition of near equiatomic ratios, regardless of the conditions of nitrogen flow ratios and process pressures. However, the limited mechanical properties were found for the films deposited under different nitrogen flow ratios with retaining the process pressure of 1.33 Pa. To enhance the mechanical properties of the AlCoCrNi HEN film, process pressure was adjusted. From the transmission electron microscopy (TEM) observation, the structure of the film deposited at the process pressure of 1.33 Pa is identified as a porous and open structure with a number of density-deficient boundary and nano-scale voids. On the other hand, densified morphology of the film was observed at pressure of 1.33 × 10−1 Pa. As a result, the hardness, elastic modulus, and H/E were improved up to 16.8, 243 GPa, and 0.0692, respectively.
Structural and Mechanical Properties of AlCoCrNi High Entropy Nitride Films: Influence of Process Pressure
