Subsurface damage and phase transformation in laser-assisted nanometric cutting of single crystal silicon

Molecular dynamics (MD) simulation can play a significant role in addressing a number of machining problems at the atomic scale. This simulation, unlike other simulation techniques, can provide new data and insights on nanometric machining; which cannot be obtained readily in any other theory or experiment. In this paper, some fundamental problems of mechanism are investigated in the nanometric cutting with the aid of molecular dynamics simulation, and the single-crystal silicon is chosen as the material. The study showed that the purely elastic deformation took place in a very narrow range in the initial stage of process of nanometric cutting. Shortly after that, dislocation appeared. And then, amorphous silicon came into being under high hydrostatic pressure. Significant change of volume of silicon specimen is observed, and it is considered that the change occur attribute to phase transition from a diamond silicon to a body-centered tetragonal silicon. The study also indicated that the temperature distributing of silicon in nanometric machining exhibited similarity to conventional machining.

Download Full-text

Nanometric cutting of single crystal silicon surfaces modified by ion implantation

CIRP Annals ◽

10.1016/j.cirp.2011.03.057 ◽

2011 ◽

Vol 60 (1) ◽

pp. 527-530 ◽

Cited By ~ 52

Author(s):

F.Z. Fang ◽

Y.H. Chen ◽

X.D. Zhang ◽

X.T. Hu ◽

G.X. Zhang

Keyword(s):

Ion Implantation ◽

Single Crystal ◽

Single Crystal Silicon ◽

Silicon Surfaces ◽

Crystal Silicon ◽

Nanometric Cutting

Download Full-text

Experimental study on size effect of tool edge and subsurface damage of single crystal silicon in nano-cutting

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-018-2310-5 ◽

2018 ◽

Vol 98 (5-8) ◽

pp. 1093-1101 ◽

Cited By ~ 15

Author(s):

Bing Liu ◽

Fengzhou Fang ◽

Rui Li ◽

Zongwei Xu ◽

Yanshu Liang

Keyword(s):

Experimental Study ◽

Size Effect ◽

Single Crystal ◽

Single Crystal Silicon ◽

Subsurface Damage ◽

Crystal Silicon ◽

Tool Edge

Download Full-text

Lubricating effect of graphene during ultra-precision mechanical polishing by atomic scale simulation

Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture ◽

10.1177/09544054211056420 ◽

2021 ◽

pp. 095440542110564

Author(s):

Houfu Dai ◽

Weilong Wu ◽

Yang Hu

Keyword(s):

Friction Coefficient ◽

Potential Energy ◽

Single Crystal ◽

Solid Lubricant ◽

Single Crystal Silicon ◽

Subsurface Damage ◽

Crystal Silicon ◽

Energy Stress ◽

Three Body ◽

Diamond Abrasive

As a new two-dimensional material with unique friction and wear properties, graphene often serves as a solid lubricant. In order to better understand the lubrication effect of graphene in the process of three-body polishing of single crystal silicon with diamond abrasive, a molecular dynamics model of this process was established in this study. Further, the changes of coordination number, friction coefficient, temperature, potential energy, stress, and surface/subsurface damage in the process of three-body polishing were analyzed in detail. The results showed that graphene lubrication could enhance the heat dissipation and reduce the number of defect atoms, friction coefficient, potential energy, stress, and chips. Therefore, less subsurface damage and material resistance were observed in the workpiece with graphene lubrication during machining. In general, graphene can be used as a high-quality solid lubricant in the three-body polishing of single crystal silicon using diamond abrasive because of its excellent lubricating effect.

Download Full-text