Characterization of Interfacial Adhesion of Cu-Cu Bonding Fabricated by Thermo-Compression Bonding Process

2010 ◽  
Vol 34 (7) ◽  
pp. 929-933
Author(s):  
Kwang-Seop Kim ◽  
Hee-Jung Lee ◽  
Hee-Yeoun Kim ◽  
Jae-Hyun Kim ◽  
Seung-Min Hyun ◽  
...  
2019 ◽  
pp. 089270571987822
Author(s):  
Saud Aldajah ◽  
Mohammad Y Al-Haik ◽  
Waseem Siddique ◽  
Mohammad M Kabir ◽  
Yousef Haik

This study reveals the enhancement of mechanical and thermal properties of maleic anhydride-grafted polypropylene (PP- g-MA) with the addition of nanocrystalline cellulose (NCC). A nanocomposite was manufactured by blending various percentages of PP, MA, and NCC nanoparticles by means of a twin-screw extruder. The influence of varying the percentages of NCC on the mechanical and thermal behavior of the nanocomposite was studied by performing three-point bending, nanoindentation, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), scanning electron microscopy (SEM), and Fourier-transform infrared (FTIR) spectroscopy tests. The novelty of this study stems on the NCC nanoparticles and their ability to enhance the mechanical and thermal properties of PP. Three-point bending and nanoindentation tests revealed improvement in the mechanical properties in terms of strength, modulus, and hardness of the PP- g-MA nanocomposites as the addition of NCC increased. SEM showed homogeneity between the mixtures which proved the presence of interfacial adhesion between the PP- g-MA incorporated with NCC nanoparticles that was confirmed by the FTIR results. DSC and TGA measurements showed that the thermal stability of the nanocomposites was not compromised due to the addition of the coupling agent and reinforced nanoparticles.


2009 ◽  
Vol 1240 ◽  
Author(s):  
Ji-Ye Kang ◽  
Su-Mi Eo ◽  
Loon-Seng Tan ◽  
Jong-Beom Baek

AbstractSingle-walled carbon nanotube (SWCNT) and multi-walled carbon nanotube (MWCNT) were functionalized with 3,4-diaminobenzoic acid via “direct” Friedel-Crafts acylation reaction in PPA/P2O5 to afford ortho-diamino-functionalized SWCNT (DIF-SWCNT) and MWCNT (DIF-MWCNT). The resultant DIF-SWCNT and DIF-MWCNT showed improved solubility and dispersibility. To improve interfacial adhesion between CNT and polymer matrix, the grafting of ABPBI onto the surface of DIF-SWCNT (10 wt%) or DIF-MWCNT (10 wt%) was conducted by simple in-situ polymerization of AB monomer, 3,4-diaminobenzoic acid dihydrochloride, in PPA. The resultant ABPBI-g-MWCNT and ABPBI-g-SWCNT showed improved the mechanical and electrical properties.


2017 ◽  
Vol 37 (6) ◽  
pp. 547-557 ◽  
Author(s):  
Sekaran Sathees Kumar ◽  
Ganesan Kanagaraj

Abstract In this paper, the combined effect of different weight percentages of silicon carbide (SiC) and graphite (Gr) reinforcement on the mechanical properties of polyamide (PA6) composite is studied. Test specimens of pure PA6, 85 wt% PA6+10 wt% SiC+5 wt% Gr and 85 wt% PA6+5 wt% SiC+10 wt% Gr are prepared using an injection molding machine. The tensile, impact, hardness, morphology and thermal properties of the injection molded composites were investigated. The obtained results showed that mechanical properties, such as tensile and impact strength and modulus of the PA6 composites, were significantly higher than the pure PA6, and hybridization with silicon carbide and graphite further enhanced the performance properties, as well as the thermal resistance of the composites. The tensile fracture morphology and the characterization of PA6 polymer composites were observed by scanning electron microscope (SEM) and Fourier transform infrared spectroscopic methods. SEM observation of the fracture surfaces showed the fine dispersion of SiC and Gr for strong interfacial adhesion between fibers and matrix. The individual and combined reinforcing effects of silicon carbide and graphite on the mechanical properties of PA6 hybrid composites were compared and interpreted in this study. Improved mechanical properties were observed by the addition of small amount of SiC and Gr concurrently reinforced with the pure PA6. Finally, thermogravimetric analysis showed that the heat resistance of the composites tended to increase with increasing silicon carbide and graphite content simultaneously.


2010 ◽  
Vol 3 (2) ◽  
pp. 70-73 ◽  
Author(s):  
Sentot Budi Rahardjo

Cu (II) complexs with 1,4,8-tris(2-hidroxymethyl)-11-methyl-1,4,8,11-tetraazacyclotetradecane (L) have been synthesized with chemical formula of [CuL](ClO4) (experimental Cu = 32.7 %, H = 6.4%, theoritical Cu = 32.6 %, H = 6.4 %). Its magnetic moment of 1.90 BM indicated that the complexs is paramagnetic and there are no Cu-Cu bonding. This complexs is stable with the value of log k [CuL]2+ = 17.3(2). Visible spectra of [CuL]2+ showed that single wide peak at λmax of 628 nm (ε = 164 dm3.mol-1.cm-1) and indicated of E9 - T29 transition. The IR spectra and the conductancy data indicated that the ClO4 was not coordinated to Cu.   Keywords: tembaga (II), senyawa kompleks, paramagnetik


Author(s):  
Jay S. Mitchell ◽  
Gholamhassan R. Lahiji ◽  
Khalil Najafi

A Au-Si eutectic vacuum packaging process was evaluated using high sensitivity poly-Si Pirani vacuum sensors. Encapsulation of devices was achieved by bonding a silicon cap wafer to a device wafer using a Au-Si eutectic solder at above 390°C in a vacuum bonder. The Au-Si eutectic solder encircled the devices, providing an airtight seal. The Pirani gauges were encapsulated and tested over a period of several months in order to determine base pressures and leak/outgassing rates of the micro-cavities. Packaged devices without getters showed initial pressures from 2 to 12 Torr with initial leak/outgassing rates of −0.073 to 80 Torr/year. Using getters, pressures as low as 5 mTorr have been achieved with leak/outgassing rates of <10 mTorr/year. Trends in pressure over time seem to indicate outgassing (desorption of atoms from inside of the microcavity) as the primary mechanism for pressure change over time.


2012 ◽  
Vol 45 (1) ◽  
pp. 22-31 ◽  
Author(s):  
Gérard Bourse ◽  
Wei-Jiang Xü ◽  
Anne Mouftiez ◽  
Loic Vandevoorde ◽  
Mohamed Ourak

2013 ◽  
Vol 41 ◽  
pp. 144-151 ◽  
Author(s):  
V. Chean ◽  
R. Matadi Boumbimba ◽  
R. El Abdi ◽  
J.C. Sangleboeuf ◽  
P. Casari ◽  
...  

2021 ◽  
Vol 11 (20) ◽  
pp. 9444
Author(s):  
Yoonho Kim ◽  
Seungmin Park ◽  
Sarah Eunkyung Kim

Low-temperature Cu-Cu bonding technology plays a key role in high-density and high-performance 3D interconnects. Despite the advantages of good electrical and thermal conductivity and the potential for fine pitch patterns, Cu bonding is vulnerable to oxidation and the high temperature of the bonding process. In this study, chip-level Cu bonding using an Ag nanofilm at 150 °C and 180 °C was studied in air, and the effect of the Ag nanofilm was investigated. A 15-nm Ag nanofilm prevented Cu oxidation prior to the Cu bonding process in air. In the bonding process, Cu diffused rapidly to the bonding interface and pure Cu-Cu bonding occurred. However, some Ag was observed at the bonding interface due to the short bonding time of 30 min in the absence of annealing. The shear strength of the Cu/Ag-Ag/Cu bonding interface was measured to be about 23.27 MPa, with some Ag remaining at the interface. This study demonstrated the good bonding quality of Cu bonding using an Ag nanofilm at 150 °C.


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