Low-power current reference with temperature compensation by subthreshold leakage current

2020 ◽  
pp. 104936
Author(s):  
Zhentao Xu ◽  
Zhi Lin
2013 ◽  
Vol 1 (4) ◽  
pp. 6-13
Author(s):  
Vanitha . ◽  
◽  
M. Parimaladevi ◽  
D. Sharmila ◽  
◽  
...  

Author(s):  
G. Sambasiva Rao ◽  
◽  
L. Ashok ◽  
M. Mahesh ◽  
◽  
...  

2013 ◽  
Vol 1538 ◽  
pp. 291-302
Author(s):  
Edward Yi Chang ◽  
Hai-Dang Trinh ◽  
Yueh-Chin Lin ◽  
Hiroshi Iwai ◽  
Yen-Ku Lin

ABSTRACTIII-V compounds such as InGaAs, InAs, InSb have great potential for future low power high speed devices (such as MOSFETs, QWFETs, TFETs and NWFETs) application due to their high carrier mobility and drift velocity. The development of good quality high k gate oxide as well as high k/III-V interfaces is prerequisite to realize high performance working devices. Besides, the downscaling of the gate oxide into sub-nanometer while maintaining appropriate low gate leakage current is also needed. The lack of high quality III-V native oxides has obstructed the development of implementing III-V based devices on Si template. In this presentation, we will discuss our efforts to improve high k/III-V interfaces as well as high k oxide quality by using chemical cleaning methods including chemical solutions, precursors and high temperature gas treatments. The electrical properties of high k/InSb, InGaAs, InSb structures and their dependence on the thermal processes are also discussed. Finally, we will present the downscaling of the gate oxide into sub-nanometer scale while maintaining low leakage current and a good high k/III-V interface quality.


2021 ◽  
Author(s):  
Cuong Do ◽  
Ashwin A. Seshia

Temperature variation is one of the most crucial factors that need to be cancelled in MEMS sensors. Many traditional methodologies require an additional circuit to compensate for temperature. This work describes a new active temperature compensation method for MEMS capacitive strain sensor without any additional circuit. The proposed method is based on a complement 2-D capacitive structure design. It consumes zero-power, which is essential toward the realization of a low-power temperature-compensated sensor in battery-powered or energy-harvesting applications<br>


Author(s):  
Woo Wei Kai ◽  
Nabihah Ahmad ◽  
Mohamad Hairol Jabbar

In digital system, the full adders are fundamental circuits that are used for arithmetic operations. Adder operation can be used to implement and perform calculation of the multipliers, subtraction, comparators, and address operation in an Arithmetic Logic Unit (ALU). The subthreshold leakage current increasing as proportional with the scaling down of oxide thickness and transistor in short channel sizes. In this paper, a Gate-diffusion Input (GDI) circuit design technique allow minimization the number of transistor while maintaining low complexity of logic design and low power realization of Variable Body Biasing (VBB) technique to reduce the static power consumption. The Silterra 90nm process design kit (PDK) was used to design 8-bit full adder with VBB technique in full custom methodology by using Synopsys Electronic Design Automation (EDA) tools. The simulation of 8-bit full adder was compared within a conventional bias technique and VBB technique with operating voltage of  supply. The result showed the reduction of VBB technique in term of peak power,  and average power,   compare with conventional bias technique. Moreover, the Power Delay Product (PDP) showed 1.29pJ in VBB technique compare with conventional bias mode 1.67pJ. The area size of 8-Bit full adder was 10μm×23μm.


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