Investigating the stability of electrically conductive membranes

2021 ◽  
Vol 627 ◽  
pp. 119181
Author(s):  
Mohamad Amin Halali ◽  
Melissa Larocque ◽  
Charles-Franҫois de Lannoy
Keyword(s):  
Electrically Conductive ◽  
Conductive Membranes ◽  
The Stability

scholarly journals Mechanical and Electrical Performance of Flexible Polymer Film Designed for a Textile Electrically-Conductive Path

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2169
Author(s):  
Agnieszka Tabaczyńska ◽  
Anna Dąbrowska ◽  
Marcin Masłowski ◽  
Anna Strąkowska
Keyword(s):  
Ionic Liquid ◽  
Ionic Liquids ◽  
Surface Resistance ◽  
Conductive Filler ◽  
Extrusion Process ◽  
Electrical Performance ◽  
Electrically Conductive ◽  
Non Invasive ◽  
Flexible Polymer ◽  
The Stability

Electro-conductive paths that are mechanically resistant and stable during simulated aging cycles are promising, in relation to the non-invasive application in e-textiles in our everyday surroundings. In the paper, an analysis of the influence of electro-conductive filler, as well as ionic liquid on surface resistance is provided. Authors proved that depending on the tested variant, obtained surface resistance may vary from 50 kΩ (when 50 phr of Ag and [bmim][PF6] ionic liquid applied) to 26 GΩ (when 25 phr of Ag and [bmim][PF6] ionic liquid applied). The samples were also evaluated after simulated aging cycles and the stability of electric properties was confirmed. Moreover, it was proved that the addition of ionic liquids reduced the resistance of vulcanizates, while no significant influence of the extrusion process on conductivity was observed.

Electrically conductive membranes for contemporaneous dye rejection and degradation

2021 ◽  
pp. 131184
Author(s):  
Shaheen F. Anis ◽  
Boor S. Lalia ◽  
Alain Lesimple ◽  
Raed Hashaikeh ◽  
Nidal Hilal
Keyword(s):  
Electrically Conductive ◽  
Conductive Membranes ◽  
Dye Rejection

Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration

2012 ◽  
Vol 2012 (1) ◽  
pp. 000561-000567
Author(s):  
Rabindra N. Das ◽  
Frank D. Egitto ◽  
Barry Bonitz ◽  
Erich Kopp ◽  
Mark D. Poliks ◽  
...  
Keyword(s):  
System Integration ◽  
Integrated Approach ◽  
Power Delivery ◽  
Solder Paste ◽  
3D Integration ◽  
Electrically Conductive ◽  
Reflow Temperature ◽  
Electrically Conductive Adhesive ◽  
The Stability ◽  
Electrical Connections

Package on Package (PoP) stacking has become an attractive method for 3D integration to meet the demands of higher functionality in ever smaller packages, especially when coupled with the use of stacked die. To accomplish this, new packaging designs need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller and smaller footprints. A new 3D “Package Interposer Package” (PIP) solution is suitable for combining multiple memory, ASICs, stacked die, stacked packaged die, etc., into a single package. This approach also favors system integration with high density power delivery by appropriate interposer design and thermal management. Traditional Package on Package (PoP) approaches use direct solder connections between the substrates and are limited to use of single (or minimum) die on the bottom substrate, to reduce warpage and improve stability. For PIP, the stability imparted by the interposer reduces warpage, allowing assemblers of the PIP to select the top and bottom components (substrates, die, stacked die, modules) from various suppliers. This mitigates the problem of variation in warpage trends from room temperature to reflow temperature for different substrates/modules when combined with other packages. PIP facilitates more space-efficient designs, and can accommodate any stacked die height without compromising warpage and stability. PIP can accommodate modules with stacked die on organic, ceramic, or silicon board substrates, where each can be detached and replaced without affecting the rest of the package. Thus, PIP will be economical for high-end electronics, since a damaged, non-factional part of the package can be selectively removed and replaced. A variety of interposer structures were used to fabricate Package Interposer Package (PIP) modules. Electrical connections were formed during reflow using a tin-lead eutectic solder paste. Interconnection among substrates (packages) in the stack was achieved using interposers. Plated through holes in the interposers, formed by laser or mechanical drilling and having diameters ranging from 50 μm to 250 μm, were filled with an electrically conductive adhesive and cured. The adhesive-filled and cured interposers were reflowed with circuitized substrates to produce a PIP structure. In summary, the present work describes an integrated approach to develop 3D PIP constructions on various stacked die or stacked packaged die configurations.

Adapting Aluminum-Doped Zinc Oxide for Electrically Conductive Membranes Fabricated by Atomic Layer Deposition

2019 ◽  
Vol 12 (1) ◽  
pp. 963-969
Author(s):  
Wulin Yang ◽  
Moon Son ◽  
Ruggero Rossi ◽  
Johannes S. Vrouwenvelder ◽  
Bruce E. Logan
Keyword(s):  
Zinc Oxide ◽  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Electrically Conductive ◽  
Conductive Membranes ◽  
Layer Deposition ◽  
Aluminum Doped Zinc Oxide

scholarly journals The Reactivity and Stability of Polyoxometalate Water Oxidation Electrocatalysts

Molecules ◽  
2019 ◽  
Vol 25 (1) ◽  
pp. 157 ◽  
Author(s):  
Dandan Gao ◽  
Ivan Trentin ◽  
Ludwig Schwiedrzik ◽  
Leticia González ◽  
Carsten Streb
Keyword(s):  
Water Oxidation ◽  
Homogeneous Solution ◽  
Theoretical Studies ◽  
Future Perspectives ◽  
Oxidation Catalysts ◽  
Electrically Conductive ◽  
Conductive Substrates ◽  
Emerging Themes ◽  
Phase Water ◽  
The Stability

This review describes major advances in the use of functionalized molecular metal oxides (polyoxometalates, POMs) as water oxidation catalysts under electrochemical conditions. The fundamentals of POM-based water oxidation are described, together with a brief overview of general approaches to designing POM water oxidation catalysts. Next, the use of POMs for homogeneous, solution-phase water oxidation is described together with a summary of theoretical studies shedding light on the POM-WOC mechanism. This is followed by a discussion of heterogenization of POMs on electrically conductive substrates for technologically more relevant application studies. The stability of POM water oxidation catalysts is discussed, using select examples where detailed data is already available. The review finishes with an outlook on future perspectives and emerging themes in electrocatalytic polyoxometalate-based water oxidation research.

Electrically conductive membranes: Synthesis and applications

1990 ◽  
Vol 50 (1) ◽  
pp. 31-49 ◽  
Author(s):  
Ih-Houng Loh ◽  
Richard A. Moody ◽  
J.C. Huang
Keyword(s):  
Electrically Conductive ◽  
Conductive Membranes
Sign in / Sign up

Export Citation Format

Share Document