Comparative study of thermal cycling and thermal shocks tests on electronic components reliability

2004 ◽  
Vol 44 (9-11) ◽  
pp. 1343-1347 ◽  
Author(s):  
Mads Brincker ◽  
Kristian Bonderup Pedersen ◽  
Peter Kjar Kristensen ◽  
Vladimir N. Popok

2017 ◽  
Vol 74 ◽  
pp. 131-135 ◽  
Author(s):  
Bart Vandevelde ◽  
Filip Vanhee ◽  
Davy Pissoort ◽  
Lieven Degrendele ◽  
Johan De Baets ◽  
...  

2008 ◽  
Vol 595-598 ◽  
pp. 213-221 ◽  
Author(s):  
Aurélie Vande Put ◽  
Djar Oquab ◽  
Daniel Monceau

During service, TBC can suffer degradation by CMAS, FOD, erosion or spallation. Whereas the first three are due to foreign particles, the last one is related to thermal cycling. When subjected to high temperature exposures followed by rapid coolings under oxidizing conditions, a TBC system undergoes morphological changes and stress development. This will initiate cracks which propagate and finally lead to failure by spallation. Consequently, the aim of the present study is to understand better the mechanisms responsible for such spallation events. Two kinds of TBC systems with different bond coatings (NiCoCrAlYTa or Pt-modified nickel aluminide bond coatings) are thermally cycled. Subsequently, SEM investigations on TBC systems after spallation concentrate on failure path, defect, morphological and microstructural changes to propose way for improving TBC system lifetime.


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