scholarly journals Comparative Study of Al Metallization Degradation in Power Diodes Under Passive and Active Thermal Cycling

2018 ◽  
Vol 8 (12) ◽  
pp. 2073-2080 ◽  
Author(s):  
Mads Brincker ◽  
Kristian Bonderup Pedersen ◽  
Peter Kjar Kristensen ◽  
Vladimir N. Popok
Keyword(s):  
Comparative Study ◽  
Thermal Cycling ◽  
Power Diodes ◽  
Al Metallization

scholarly journals Comparative study of non-standard power diodes

2009 ◽  
Author(s):  
Cher Ming Tan ◽  
Nagarajan Raghavan ◽  
Lina Sun ◽  
Chuck Hsu ◽  
Chase Wang
Keyword(s):  
Comparative Study ◽  
Power Diodes

A Comparative Study of Ti/Low-k HSQ (Hydrogen Silsesquioxane) and Ti/TEOS (Tetraethylorthosilicate) Structures at Elevated Temperatures

2000 ◽  
Vol 612 ◽  
Author(s):  
Yuxiao Zeng ◽  
Linghui Chen ◽  
T. L. Alford
Keyword(s):  
Comparative Study ◽  
Direct Contact ◽  
Elevated Temperatures ◽  
Primary Source ◽  
Hydrogen Silsesquioxane ◽  
Titanium Layer ◽  
To Come ◽  
Al Metallization ◽  
Interconnect Technology ◽  
Low K

AbstractFor the benefit of reducing capacitance in multilevel interconnect technology, low-k dielectric HSQ (hydrogen silsesquioxane) has been used as a gapfill material in Al-metallization- based non-etchback embedded scheme. The vias are consequently fabricated through the HSQ layer followed by W plug deposition. In order to reduce the extent of via poisoning and achieve good W/Al contact, thin Ti/TiN stack films are typically deposited before via plug deposition. In this case, HSQ makes direct contact with the Ti layer. The reliability of the Ti/HSQ structures at elevated temperatures has been systematically studied in this work by using a variety of techniques. These results are also compared with those from Ti/TEOS (Tetraethylorthosilicate) structure, where TEOS is a conventional intra-metal dielectric. When the temperature is below 550 °C, a significant number of oxygen atoms are observed to diffuse into the titanium layer. The primary source of oxygen is believed to come from the HSQ film. When the temperature is above 550 °C, HSQ starts to react with Ti. At 700 °C, a TiO/Ti5Si3/HSQ stack structure forms. The Ti/HSQ system exhibits a higher reactivity than that of the Ti/TEOS system.

Effects of thermal cycling on aluminum metallization of power diodes

2015 ◽  
Vol 55 (9-10) ◽  
pp. 1988-1991 ◽  
Author(s):  
M. Brincker ◽  
K.B. Pedersen ◽  
P.K. Kristensen ◽  
V.N. Popok
Keyword(s):  
Thermal Cycling ◽  
Power Diodes ◽  
Aluminum Metallization

Characterization of TBC Systems with NiPtAl or NiCoCrAlYTa Bond Coatings after Thermal Cycling at 1100°C: A Comparative Study of Failure Mechanisms

2008 ◽  
Vol 595-598 ◽  
pp. 213-221 ◽  
Author(s):  
Aurélie Vande Put ◽  
Djar Oquab ◽  
Daniel Monceau
Keyword(s):  
High Temperature ◽  
Comparative Study ◽  
Thermal Cycling ◽  
Nickel Aluminide ◽  
Morphological Changes ◽  
Failure Mechanisms ◽  
Bond Coatings ◽  
Failure Path ◽  
Tbc Systems

During service, TBC can suffer degradation by CMAS, FOD, erosion or spallation. Whereas the first three are due to foreign particles, the last one is related to thermal cycling. When subjected to high temperature exposures followed by rapid coolings under oxidizing conditions, a TBC system undergoes morphological changes and stress development. This will initiate cracks which propagate and finally lead to failure by spallation. Consequently, the aim of the present study is to understand better the mechanisms responsible for such spallation events. Two kinds of TBC systems with different bond coatings (NiCoCrAlYTa or Pt-modified nickel aluminide bond coatings) are thermally cycled. Subsequently, SEM investigations on TBC systems after spallation concentrate on failure path, defect, morphological and microstructural changes to propose way for improving TBC system lifetime.

Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking

2020 ◽  
Vol 31 (7) ◽  
pp. 5731-5737 ◽  
Author(s):  
Jianhao Wang ◽  
Songbai Xue ◽  
Jianxin Wang ◽  
Peng Zhang ◽  
Yu Tao ◽  
...  
Keyword(s):  
Solder Joint ◽  
Comparative Study ◽  
Thermal Cycling

A Comparative Study of Two-Layer NiAl Bond Coat TBC and its Failure Mechanism

2007 ◽  
Vol 336-338 ◽  
pp. 1770-1772
Author(s):  
He Fei Li ◽  
Zhao Hui Zhou ◽  
Hesnawi A ◽  
Kuo Jiang ◽  
Sheng Kai Gong
Keyword(s):  
Electron Beam ◽  
Comparative Study ◽  
Thermal Cycling ◽  
Failure Mechanism ◽  
Thermal Barrier Coatings ◽  
Vapor Deposition ◽  
Bond Coat ◽  
Physical Vapor Deposition ◽  
Thermal Barrier ◽  
Barrier Coatings

Thermal barrier coatings with one-layered/ two-layered NiAl bond coat were produced by electron beam physical vapor deposition (EB-PVD). Compared to the TBC with one-layered bond coat, the TBC with two-layered bond coat improved the thermal cycling resistance significantly. The failure mechanism of the two-layer NiAl bond coat TBC was investigated in this paper.

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