scholarly journals Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling

2010 ◽  
Vol 3 (1) ◽  
pp. 83-89 ◽  
Author(s):  
Kornain
Keyword(s):  
Comparative Study ◽  
Thermal Cycling ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Ceramic Ball ◽  
Accelerated Thermal Cycling ◽  
Underfill Material

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
S. B. Park ◽  
Rahul Joshi ◽  
Izhar Ahmed ◽  
Soonwan Chung
Keyword(s):  
Thermal Cycling ◽  
Flip Chip ◽  
Thermal Loading ◽  
Ball Grid Array ◽  
Element Analysis ◽  
Severe Condition ◽  
Experimental Stress Analysis ◽  
Computational Fluid Dynamics Analysis ◽  
Accelerated Thermal Cycling ◽  
Ball Grid Array Packages

Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). In PC, nonuniform temperature distribution and different coefficients of thermal expansion of each component make the package deform differently compared to the case of ATC. Traditionally, reliability assessment is conducted by ATC because ATC is believed to have a more severe thermal loading condition compared to PC, which is similar to the actual field condition. In this work, the comparative study of PC and ATC was conducted for the reliability of board level interconnects. The comparison was made using both ceramic and organic flip chip ball grid array packages. Moiré interferometry was adopted for the experimental stress analysis. In PC simulation, computational fluid dynamics analysis and finite element analysis are performed. The assembly deformations in numerical simulation are compared with those obtained by Moiré images. It is confirmed that for a certain organic package PC can be a more severe condition that causes solder interconnects to fail earlier than in ATC while the ceramic package fails earlier in ATC always.

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

2004 ◽  
Vol 126 (1) ◽  
pp. 41-47 ◽  
Author(s):  
Seungmin Cho ◽  
Bongtae Han ◽  
Jinwon Joo
Keyword(s):  
Thermal Cycling ◽  
Ball Grid Array ◽  
Maximum Temperature ◽  
Deformation Analysis ◽  
Temperature Dependent ◽  
Ceramic Ball ◽  
Ball Grid Array Package ◽  
Rapid Temperature ◽  
Time Observation ◽  
Accelerated Thermal Cycling

A robust scheme of moire´ interferometry for real-time observation is employed to study the temperature dependent thermo-mechanical behavior of a ceramic ball grid array package assembly. The scheme is implemented with a convection-type environmental chamber that provides the rapid temperature control required in accelerated thermal cycling. Thermal deformations are documented at various temperatures. Thermal-history dependent analyses of global and local deformations are presented. A significant nonlinear global behavior is documented due to complete stress relaxation at the maximum temperature. An analysis of solder interconnections reveals that inelastic deformation accumulates at the bottom eutectic solder fillet only at high temperatures.

scholarly journals Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies

2000 ◽  
Vol 122 (4) ◽  
pp. 335-340 ◽  
Author(s):  
Reza Ghaffarian
Keyword(s):  
Thermal Cycling ◽  
Failure Mechanisms ◽  
Ball Grid Array ◽  
Test Methods ◽  
Temperature Cycling ◽  
Chip Scale Package ◽  
Interconnect Reliability ◽  
Commercial Off The Shelf ◽  
Accelerated Thermal Cycling ◽  
Cycles To Failure

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies. Acceleration induced failure mechanisms varied from conventional surface mount (SM) failures for CSPs. Examples of unrealistic life projections for other CSPs are also presented. The cumulative cycles-to-failure for ceramic BGA assemblies performed under different conditions, including plots of their two Weibull parameters, are presented. The results are for cycles in the range of −30°C to 100°C, −55°C to 100°C, and −55°C to 125°C. Failure mechanisms, as well as cycles to failure for thermal shock and thermal cycling conditions in the range of −55°C to 125°C, were compared. Projection to other temperature cycling ranges using a modified Coffin-Manson relationship is also presented. [S1043-7398(00)00104-3]

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

2012 ◽  
Vol 134 (1) ◽  
Author(s):  
P. Borgesen ◽  
D. Blass ◽  
M. Meilunas
Keyword(s):  
Thermal Cycling ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Ball Grid Array ◽  
Cycling Performance ◽  
Circuit Board ◽  
Lead Free ◽  
Sac305 Solder ◽  
Solder Balls ◽  
Selection Of

Underfilling will almost certainly improve the performance of an area array assembly in drop, vibration, etc. However, depending on the selection of materials, the thermal fatigue life may easily end up worse than without an underfill. This is even more true for lead free than for eutectic SnPb soldered assemblies. If reworkability is required, the bonding of the corners or a larger part of the component edges to the printed circuit board (PCB), without making contact with the solder joints, may offer a more attractive materials selection. A 30 mm flip chip ball grid array (FCBGA) component with SAC305 solder balls was attached to a PCB and tested in thermal cycling with underfills and corner/edge bonding reinforcements. Two corner bond materials and six reworkable and nonreworkable underfills with a variety of mechanical properties were considered. All of the present underfills reduced the thermal cycling performance, while edge bonding improved it by up to 50%. One set of the FCBGAs was assembled with a SnPb paste and underfilled with a soft reworkable underfill. Surprisingly, this improved the thermal cycling performance slightly beyond that of the nonunderfilled assemblies, providing up to three times better life than for those assembled with a SAC305 paste.

An Optimization of Two-Steps Curing Profile to Eliminate Voids Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging

2010 ◽  
Vol 97-101 ◽  
pp. 23-27 ◽  
Author(s):  
Zainudin Kornain ◽  
Azman Jalar ◽  
Rozaidi Rashid ◽  
Shahrum Abdullah
Keyword(s):  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Ball Grid Array ◽  
Statistic Analysis ◽  
Curing Process ◽  
Ceramic Ball ◽  
Die Attach ◽  
Ball Grid Array Package ◽  
Flip Chip Packaging ◽  
The Impact

Underfilling is the preferred process to reduce the impact of the thermal stress that results from the mismatch in the coefficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. Voids formation in underfill is considered as failure in flip chip manufacturing process. Voids formation possibly caused by several factors such as poor soldering and flux residue during die attach process, voids entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the optimization of two steps curing profile in order to reduce voids formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids after curing process. Statistic analysis was conducted to analyze the suitable curing profile in order to minimize or eliminate the voids formation. It was shown that the two steps curing profile provided solution for void elimination.

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