Thermal analysis of a flip chip ceramic ball grid array (CBGA) package
2008 ◽
Vol 48
(2)
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pp. 261-273
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2010 ◽
Vol 3
(1)
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pp. 83-89
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Keyword(s):
2010 ◽
Vol 97-101
◽
pp. 23-27
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2010 ◽
Vol 148-149
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pp. 1108-1111
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2011 ◽
Vol 462-463
◽
pp. 1194-1199
Keyword(s):
Keyword(s):
2001 ◽
Vol 24
(2)
◽
pp. 191-198
◽
Keyword(s):
Keyword(s):