Optimizing Multiple Quality Characteristics of Stereolithography Process via Taguchi Method-based Grey Analysis for SL5530 Epoxy Resin Material to Enhance Part Quality

In this study, the Taguchi method, analysis of variance, and principal component analysis were used to design the optimal parameters with respect to different quality characteristics for the continuous electrospinning of polyacrylonitrile nanofibrous yarn. The experiment was designed using a Taguchi L9(34) orthogonal array. The Taguchi method is a unique statistical method for efficiently evaluating optimal parameters and the effects of different factors on quality characteristics. The experimental results obtained by this method are more accurate and reliable than one-factor-at-a-time experiments. The control factors discussed in this work include the draw ratio, nozzle size, flow rate, and draw temperature. The quality characteristics taken into consideration are fiber diameter, fiber uniformity, and fiber arrangement. The parameters to optimize the different quality characteristics were obtained from the main effect plot of the signal-to-noise ratios, after which analysis of variance and confidence intervals were applied to confirm that the results were acceptable. Multiple quality characteristics were analyzed by principal component analysis from the normalized signal-to-noise ratios and the principal component score. Combining the experimental and analysis results, the optimum parameters for multiple quality characteristics were found to be a draw ratio of 2.0, a nozzle number of 22 G, a flow rate of 7 ml/h, and a draw temperature 120℃.

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Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method

Microelectronics Reliability ◽

10.1016/j.microrel.2013.09.001 ◽

2014 ◽

Vol 54 (1) ◽

pp. 287-296 ◽

Cited By ~ 19

Author(s):

Jun-Hsien Yeh ◽

Tsung-Nan Tsai

Keyword(s):

Taguchi Method ◽

Copper Wire ◽

Quality Characteristics ◽

Wire Bonding ◽

Bonding Process ◽

Multiple Quality Characteristics ◽

Fine Pitch ◽

Copper Wire Bonding

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A study of multi-quality processing parameter optimization for sueded fabric

Textile Research Journal ◽

10.1177/0040517516631314 ◽

2016 ◽

Vol 87 (4) ◽

pp. 389-398 ◽

Cited By ~ 6

Author(s):

Chung-Feng Jeffrey Kuo ◽

Wen-Tsung Lin

Keyword(s):

Taguchi Method ◽

Color Difference ◽

Processing Parameters ◽

Quality Characteristics ◽

Gray Relational Analysis ◽

Processing Parameter ◽

Optimum Processing ◽

Multiple Quality Characteristics ◽

Response Table ◽

Fabric Surface

Sueded fabric quality control depends on the processing parameter settings. The quality characteristics considered in this study are surface softness and color difference. The Taguchi method was combined with gray relational analysis (GRA) to optimize the multi-quality sueding processing parameter combinations. First, an orthogonal array is designed by using the design of experiments of the Taguchi method for the major processing parameters of the sueding machine. The signal/noise ratio and analysis of variance are calculated from the measured fabric surface softness and color difference data, significant factors influencing the quality characteristics obtained, and GRA used to remedy the deficiency in the Taguchi method, which is only applicable to single-quality characteristics. The optimum processing parameters of multiple-quality characteristics are obtained from the response table and response diagram of GRA. The quality of suede fabric can be controlled effectively by using the optimum processing parameters to set the processing parameters, and the 95% confidence interval validates the reliability and reproducibility of the experiment.

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Grey-Taguchi-Based Optimization of Wire-Sawing for a Slicing Ceramic

Processes ◽

10.3390/pr8121602 ◽

2020 ◽

Vol 8 (12) ◽

pp. 1602

Author(s):

Yao-Yang Tsai ◽

Jihng-Kuo Ho ◽

Wen-Hao Wang ◽

Chia-Chin Hsieh ◽

Chung-Chen Tsao ◽

...

Keyword(s):

Taguchi Method ◽

Removal Rate ◽

Mesh Size ◽

Quality Characteristics ◽

Machined Surface ◽

Wire Tension ◽

Slurry Concentration ◽

Multiple Quality Characteristics ◽

The Wire ◽

Grey Taguchi

Slicing ceramic (SC) is well-known as difficult-to-cut material. It is a hard and brittle material. The Grey-Taguchi method, which converts multiple response problems into a single response, is used to determine the effect of the process parameters for wire-sawing on multiple quality characteristics. The wire-sawing parameters include the wire tension (T), the slurry concentration (C), mixed grains mesh size (G), the wire speed (S), and the working load (P). The machining quality characteristics include a material removal rate (MRR), machined surface roughness (SR) of SC, kerf width (KW), wire wear (WW), and flatness (FT). An analysis of variance (ANOVA) is used to identify the mixed grains and slurry concentration that have a significant effect on multiple quality characteristics. The results of the ANOVA using the Grey-Taguchi method show that the optimum conditions are T2C1G1S2P1 (wire tension of 24 N, slurry concentration of 10% wt., mixed grains of #600 + #1000 mesh size, wire speed of 2.8 m/s, and working load of 1.27 N). The respective improvement in MRR, machined SR of SC, KW, WW, and FT is 2.43%, 2.36%, 1.08%, 2.33%, and 14.27%. The addition of #600 + #1000 mixed grains mesh size to the slurry improves the machined SR of SC, KW, and WW. An increase in wire speed and working load and the use of appropriate mixed grains mesh size and slurry concentration increases the MRR for wire-saw machining.

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Optimisation of multiple quality characteristics of hardfacing using grey-based Taguchi method

Materials & Design (1980-2015) ◽

10.1016/j.matdes.2011.04.050 ◽

2012 ◽

Vol 33 ◽

pp. 459-468 ◽

Cited By ~ 39

Author(s):

S. Ilo ◽

Ch. Just ◽

F. Xhiku

Keyword(s):

Taguchi Method ◽

Quality Characteristics ◽

Multiple Quality Characteristics

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Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes

Journal of Electronic Packaging ◽

10.1115/1.4002727 ◽

2010 ◽

Vol 132 (4) ◽

Cited By ~ 1

Author(s):

Chung-Feng Jeffrey Kuo ◽

Hui-Ta Chen ◽

Te-Li Su ◽

Jr-Da Huang

Keyword(s):

Taguchi Method ◽

Flip Chip ◽

Processing Parameters ◽

Quality Characteristics ◽

Gray Relational Analysis ◽

Light Emitting ◽

Relational Analysis ◽

Optimal Processing ◽

Multiple Quality Characteristics ◽

Flip Chip Bonding

Flip-chip bonding is a kind of chip packaging technology, which can make fabricated chips lighter and smaller. Thermo-ultrasonic flip-chip bonding is a technology that directly joins gold pad and gold bump. This study combines principle component analysis and gray relational analysis to determine the optimal processing parameters for multiple quality characteristics of light emitting diodes (LEDs). The quality characteristics of this experiment include the candle light, forward voltage, and leakage current of LED and thrust value. First, this study determines the processing parameters that may affect the thermo-ultrasonic flip-chip bonding with the L18 orthogonal array, including substrate temperature, bonding downforce, ultrasonic working time, ultrasonic power, and rising and delay time of tool head bonding. Then, the gray relational analysis is applied to indicate the optimal processing parameters for the multiple quality characteristics of LED. Since the Taguchi method only takes one single quality characteristic into consideration, this study applies the Taguchi method to reduce the number of thermo-ultrasonic flip-chip bonding experiments. The experimental results prove that the optimal LED has good integral quality, which is above industrial standard.

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