Efficient 3D observation of steel microstructure using serial sectioning with precision cutting and on-site etching

Author(s):  
Norio Yamashita ◽  
Takashi Matsuno ◽  
Daisuke Maeda ◽  
Mayuko Kikuzuki ◽  
Hideo Yokota
Author(s):  
Antonia M. Milroy

In recent years many new techniques and instruments for 3-Dimensional visualization of electron microscopic images have become available. Higher accelerating voltage through thicker sections, photographed at a tilt for stereo viewing, or the use of confocal microscopy, help to analyze biological material without the necessity of serial sectioning. However, when determining the presence of neurotransmitter receptors or biochemical substances present within the nervous system, the need for good serial sectioning (Fig. 1+2) remains. The advent of computer assisted reconstruction and the possibility of feeding information from the specimen viewing chamber directly into a computer via a camera mounted on the electron microscope column, facilitates serial analysis. Detailed information observed at the subcellular level is more precise and extensive and the complexities of interactions within the nervous system can be further elucidated.We emphasize that serial ultra thin sectioning can be performed routinely and consistently in multiple user electron microscopy laboratories. Initial tissue fixation and embedding must be of high quality.


Author(s):  
A. G. Korchunov ◽  
E. M. Medvedeva ◽  
E. M. Golubchik

The modern construction industry widely uses reinforced concrete structures, where high-strength prestressing strands are used. Key parameters determining strength and relaxation resistance are a steel microstructure and internal stresses. The aim of the work was a computer research of a stage-by-stage formation of internal stresses during production of prestressing strands of structure 1х7(1+6), 12.5 mm diameter, 1770 MPa strength grade, made of pearlitic steel, as well as study of various modes of mechanical and thermal treatment (MTT) influence on their distribution. To study the effect of every strand manufacturing operation on internal stresses of its wires, the authors developed three models: stranding and reducing a 7-wire strand; straightening of a laid strand, stranding and MTT of a 7-wire strand. It was shown that absolute values of residual stresses and their distribution in a wire used for strands of a specified structure significantly influence performance properties of strands. The use of MTT makes it possible to control in a wide range a redistribution of residual stresses in steel resulting from drawing and strand laying processes. It was established that during drawing of up to 80% degree, compressive stresses of 1100-1200 MPa degree are generated in the central layers of wire. The residual stresses on the wire surface accounted for 450-500 MPa and were tension in nature. The tension within a range of 70 kN to 82 kN combined with a temperature range of 360-380°С contributes to a two-fold decrease in residual stresses both in the central and surface layers of wire. When increasing temperature up to 400°С and maintaining the tension, it is possible to achieve maximum balance of residual stresses. Stranding stresses, whose high values entail failure of lay length and geometry of the studied strand may be fully eliminated only at tension of 82 kN and temperature of 400°С. Otherwise, stranding stresses result in opening of strands.


Author(s):  
Halit Dogan ◽  
Md Mahbub Alam ◽  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Domenic Forte ◽  
...  

Abstract X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies. We perform a 3D imaging using an advanced X-ray machine on Intel flash memories, Macronix flash memories, Xilinx Spartan 3 and Spartan 6 FPGAs. Electrical functionalities are then tested in a systematic procedure after each round of tomography to estimate the impact of X-ray on Flash erase time, read margin, and program operation, and the frequencies of ring oscillators in the FPGAs. A major finding is that erase times for flash memories of older technology are significantly degraded when exposed to tomography, eventually resulting in failure. However, the flash and Xilinx FPGAs of newer technologies seem less sensitive to tomography, as only minor degradations are observed. Further, we did not identify permanent failures for any chips in the time needed to perform tomography for counterfeit detection (approximately 2 hours).


2021 ◽  
Vol 30 (4) ◽  
pp. 2916-2929
Author(s):  
Tushar R. Dandekar ◽  
Amit Kumar ◽  
Rajesh K. Khatirkar ◽  
Diksha Mahadule ◽  
Gowthaman Ayyappan

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