Epitaxial growth and rectification characteristics of double perovskite oxide La2NiMnO6 films on Nb-SrTiO3 single crystal substrates

2011 ◽  
Vol 519 (18) ◽  
pp. 6148-6150 ◽  
Author(s):  
G.Y. Gao ◽  
Y. Wang ◽  
Y. Jiang ◽  
L.F. Fei ◽  
N.Y. Chan ◽  
...  
Author(s):  
Marina Tyunina ◽  
Leonid L. Rusevich ◽  
Eugene A Kotomin ◽  
O Pacherova ◽  
T Kocourek ◽  
...  

Single-crystal epitaxial films of technologically important and scientifically intriguing multifunctional ABO3 perovskite-type metal oxides are essential for advanced applications and understanding of these materials. In such films, a film-substrate misfit...


Author(s):  
Noor Zamin Khan ◽  
Sayed Ali Khan ◽  
Muhammad Sohail ◽  
M.A. Majeed Khan ◽  
Jahangeer Ahmed ◽  
...  

2020 ◽  
Vol 4 (1) ◽  
Author(s):  
Yogesh Sharma ◽  
Qiang Zheng ◽  
Alessandro R. Mazza ◽  
Elizabeth Skoropata ◽  
Thomas Heitmann ◽  
...  

1999 ◽  
Vol 564 ◽  
Author(s):  
S. Ohmi ◽  
R. T. Tung

AbstractA number of modifications of the oxide-mediated epitaxy (OME) technique are presented which have enabled the growth of thick (∼25–40nm) epitaxial CoSi2 layers in a single deposition sequence. The uses of (a) a thin Ti cap, (b) a thin Ti blocking layer, (c) the codeposition of Co-rich CoSix, and (d) the co-deposition of Col−xTix. have all been shown to lead to improved epitaxial quality over the pure Co OME process, for Co thickness greater than 6nm. Essentially uniform, single crystal silicide layers of over 25nm have been grown in a single deposition step. These results are supportive of the proposed role of a diffusion barrier/kinetics retarder on the part of the interlayer in the OME and the Ti-interlayer mediated epitaxy processes.


1985 ◽  
Vol 14 (5) ◽  
pp. 633-644 ◽  
Author(s):  
M. Matloubian ◽  
M. Gershenzon

2010 ◽  
Vol 34 (2) ◽  
pp. 78-91 ◽  
Author(s):  
O. Yabuhara ◽  
Y. Nukaga ◽  
M. Ohtake ◽  
F. Kirino ◽  
M. Futamoto

2006 ◽  
Vol 527-529 ◽  
pp. 299-302
Author(s):  
Hideki Shimizu ◽  
Yosuke Aoyama

3C-SiC films grown on carbonized Si (100) by plasma-assisted CVD have been investigated with systematic changes in flow rate of monosilane (SiH4) and propane (C3H8) as source gases. The deposition rate of the films increased monotonously and the microstructures of the films changed from 3C-SiC single crystal to 3C-SiC polycrystal with increasing flow rate of SiH4. Increasing C3H8 keeps single crystalline structure but results in contamination of α-W2C, which is a serious problem for the epitaxial growth. To obtain high quality 3C-SiC films, the effects of C3H8 on the microstructures of the films have been investigated by reducing the concentration of C3H8. Good quality 3C-SiC single crystal on Si (100) is grown at low net flow rate of C3H8 and SiH4, while 3C-SiC single crystal on Si (111) is grown at low net flow rate of C3H8 and high net flow rate of SiH4. It is expected that 3C-SiC epitaxial growth on Si (111) will take placed at a higher deposition rate and lower substrate temperature than that on Si (100).


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