Enhanced sputtering yield of nanostructured samples under Ar+ cluster bombardment

Vacuum ◽  
2020 ◽  
Vol 172 ◽  
pp. 109096
Author(s):  
Vasiliy Pelenovich ◽  
Xiaomei Zeng ◽  
Wenbin Zuo ◽  
Alexander Tolstogouzov ◽  
Gennady Gololobov ◽  
...  
2018 ◽  
Vol 4 (4) ◽  
Author(s):  
Qiang Zhao ◽  
Yang Li ◽  
Zheng Zhang ◽  
Xiaoping Ouyang

The sputtering of graphite due to the bombardment of hydrogen isotopes is crucial to successfully using graphite in the fusion environment. In this work, we use molecular dynamics to simulate the sputtering using the large-scale atomic/molecular massively parallel simulator (lammps). The calculation results show that the peak values of the sputtering yield are between 25 eV and 50 eV. When the incident energy is greater than the energy corresponding to the peak value, a lower carbon sputtering yield is obtained. The temperature that is most likely to sputter is approximately 800 K for hydrogen, deuterium, and tritium. Below the 800 K, the sputtering yields increase with temperature. By contrast, above the 800 K, the yields decrease with increasing temperature. Under the same temperature and incident energy, the sputtering rate of tritium is greater than that of deuterium, which in turn is greater than that of hydrogen. When the incident energy is 25 eV, the sputtering yield at 300 K increases below an incident angle at 30 deg and remains steady after that.


1996 ◽  
Vol 03 (01) ◽  
pp. 1017-1021 ◽  
Author(s):  
J. MATSUO ◽  
M. AKIZUKI ◽  
J. NORTHBY ◽  
G.H. TAKAOKA ◽  
I. YAMADA

A high-current (~100 nA) cluster-ion-beam equipment with a new mass filter has been developed to study the energetic cluster-bombardment effects on solid surfaces. A dramatic reduction of Cu concentration on silicon surfaces has been achieved by 20-keV Ar cluster (N~3000) ion bombardment. The removal rate of Cu with cluster ions is two orders of magnitude higher than that with monomer ions. A significantly higher sputtering yield is expected for cluster-ion irradiation. An energetic cluster-ion beam is quite suitable for removal of metal.


2007 ◽  
Vol 353-358 ◽  
pp. 1891-1894
Author(s):  
Zhi Yong He ◽  
Xiao Feng Wang ◽  
Ying Fan ◽  
Zhen Xia Wang ◽  
Xiao Ping Liu ◽  
...  

Sputtering rate Sr was proposed as an alternative parameter instead of sputtering yield Y to calibrate the sputtering ability of the target, defined as the mass loss of the target per unit time and sputtering current. The approach is more reliable for glow discharge processes since the intense backscattering effect was taken into consideration. The effects of processing parameters on Sr were investigated through orthogonal test, the results indicated that target temperature affects Sr obviously, and among the discharge parameters, the target voltage and discharge pressure were the governing factors. Through regression analysis, the sputtering rate Sr was expressed as a function of sputtering voltage and discharge pressure which could be used to evaluate or predict the real output of the sputtering target.


2016 ◽  
Vol 22 (2) ◽  
Author(s):  
Abdelkader Bouazza ◽  
Abderrahmane Settaouti

AbstractSputtering is characterized by a sputtering yield ratio which depends on several conditions, in particular the incident ions energy to the cathode, in normal incidence and when considers the angle α of the incident ions. Our investigations may be considered in first step to calculate the sputtering yield of three metals: copper, silver, and aluminum collide with argon, xenon, oxygen and nitrogen ions using highly developed software called SRIM (Stopping and Range of Ions in Matter) with normal incidence, then with varied angles in future works. The results obtained are compared with those obtained using the analytical models based on the Monte Carlo method proposed by researchers as Sigmund and Yamamaura in order to validate models.


Author(s):  
Qiang Zhao ◽  
Yang Li ◽  
Zheng Zhang ◽  
Xiaoping Ouyang

The sputtering of graphite due to the bombardment of hydrogen isotopes is one of the critical issues in successfully using graphite in the fusion environment. In this work, we use molecular dynamics method to simulate the sputtering by using the LAMMPS. Calculation results show that the peak values of the sputtering yield are located between 25 eV to 50 eV. After the energy of 25 eV, the higher incident energy cause the lower carbon sputtering yield. The temperature which is most likely to sputter is about 800 K for hydrogen, deuterium and tritium. Before the 800 K, the sputtering rates increase when the temperature increase. After the 800 K, they decrease with the temperature increase. Under the same temperature and energy, the sputtering rate of tritium is bigger than that of deuterium, the sputtering rate of deuterium is bigger than that of hydrogen.


1993 ◽  
Author(s):  
Samuel L. Espy ◽  
I. F. Urazgil'din ◽  
Alan V. Barnes ◽  
Y. Yao ◽  
J. L. Allen ◽  
...  
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