Growth kinetics analysis of Nb–Al intermetallic compounds interfacial layers based on Nb–Al phase diagram

Vacuum ◽  
2021 ◽  
Vol 194 ◽  
pp. 110589
Author(s):  
Xianjun Lei ◽  
Xiaopeng Wang ◽  
Fantao Kong ◽  
Haitao Zhou ◽  
Yuyong Chen
Keyword(s):  
Phase Diagram ◽  
Intermetallic Compounds ◽  
Growth Kinetics ◽  
Kinetics Analysis ◽  
Interfacial Layers

scholarly journals Study of deposition parameters and growth kinetics of ZnO deposited by aerosol assisted chemical vapor deposition

RSC Advances ◽  
2021 ◽  
Vol 11 (30) ◽  
pp. 18493-18499
Author(s):  
Sergio Sánchez-Martín ◽  
S. M. Olaizola ◽  
E. Castaño ◽  
E. Urionabarrenetxea ◽  
G. G. Mandayo ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Growth Kinetics ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Kinetics Analysis ◽  
Deposition Parameters ◽  
Kinetics Of

Impact of deposition parameters, microstructure and growth kinetics analysis of ZnO grown by Aerosol-assisted Chemical Vapor Deposition (AACVD).

The Influence of Grain Size Determination Method on Grain Growth Kinetics Analysis

2015 ◽  
Vol 17 (11) ◽  
pp. 1598-1607 ◽  
Author(s):  
Leyla Hashemi-Sadraei ◽  
S. Ebrahim Mousavi ◽  
Enrique J. Lavernia ◽  
Julie M. Schoenung
Keyword(s):  
Grain Size ◽  
Grain Growth ◽  
Growth Kinetics ◽  
Size Determination ◽  
Determination Method ◽  
Kinetics Analysis ◽  
Grain Growth Kinetics

Influencing factors and growth kinetics analysis of carbon nanotube growth on the surface of continuous fibers

2021 ◽  
Vol 32 (28) ◽  
pp. 285702
Author(s):  
Jianjie Qin ◽  
Chengguo Wang ◽  
Zhiqiang Yao ◽  
Ziming Ma ◽  
Xuanhao Cui ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Influencing Factors ◽  
Growth Kinetics ◽  
Kinetics Analysis ◽  
Carbon Nanotube Growth ◽  
Nanotube Growth

Growth Kinetics of Interfacial Intermetallic Compound in Al(AA4343)/Steel(SUS316) Clad Strip

2020 ◽  
Vol 993 ◽  
pp. 447-456
Author(s):  
Xiao Jun Zhang ◽  
Kun Yuan Gao ◽  
Xiu Hua Hu ◽  
Yu Sheng Ding ◽  
Guo Zhan Wang ◽  
...  
Keyword(s):  
Growth Kinetics ◽  
Annealing Temperature ◽  
Optical Microscope ◽  
Alloy Layer ◽  
Kinetics Analysis ◽  
Growth Constant ◽  
Transmission Electron ◽  
Dispersive System ◽  
The Relationship ◽  
Kinetics Of

The composition and microstructure of intermetallic compounds (IMC) at the interface of aluminum(AA4343)-stainless steel(SUS316) were studied upon annealing at 550°C for 1h to 20h and at 610°C for 15min to 10h by means of optical microscope(OM) , scanning electron microscope (SEM) with energy dispersive system(EDS) and transmission Electron Microscopy (TEM). The results showed that the IMC was of 4.3μm to 36.1μm thick during heat treatment at 550°C for 1h to 20h, and the IMC contained Al-Fe-Si-Cr-Ni-Mo and Al-Fe-Si -Ni. During annealing at 610°C for 15min to 5h, the thickness of IMC was 31.2 μm to 208 μm, and the IMC were mainly of η-Fe2Al5 and τ10- Al4Fe1.7Si at 550°C for 10h. As the annealing time extended to 10h, natural delamination occurred at the interface between the aluminum alloy layer and IMC layer. The growth kinetics analysis showed that the relationship between the thickness of IMC “X” and time “t” followed the relational equation X=(kt)n. For AA4343(solid) - SUS316(solid), n was 1/2, and the growth constant k = 1.9×10-13m2/s at annealing temperature of 550 °C. When the temperature was 610°C, AA4343 - SUS316 was a liquid-solid contact reaction, n was 1, the growth constant k=1.45×10-8m/s.

Intermetallic compounds in solar cell interconnections: Microstructure and growth kinetics

2017 ◽  
Vol 159 ◽  
pp. 370-388 ◽  
Author(s):  
Torsten Geipel ◽  
Monja Moeller ◽  
Johann Walter ◽  
Achim Kraft ◽  
Ulrich Eitner
Keyword(s):  
Solar Cell ◽  
Intermetallic Compounds ◽  
Growth Kinetics
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