An analytical model of the diffusive scattering of low-energy electrons in electron-beam resists

1999 ◽  
Vol 49 (3-4) ◽  
pp. 233-244 ◽  
Author(s):  
B.K Paul
1994 ◽  
Vol 367 ◽  
Author(s):  
P.O. Pettersson ◽  
R.J. Miles ◽  
T.C. Mcgill

AbstractWe present the results of electron beam assisted molecular beam epitaxy (EB-MBE) on the growth mode of silicon on CaF2/Si(111). By irradiating the CaF2 surface with low energy electrons, the fluorine is desorbed, leaving an ordered array of F-centers behind. Using atomic force microscopy (AFM), we do not detect any surface damage on the CaF2 layer due to the low energy electron irradiation. The surface free energy of the CaF2 is raised due to the F-center array and the subsequent silicon layer is smoother. Using AFM and X-ray photoelectron spectroscopy (XPS), we find an optimal range of exposures for high temperature (650°C) growth of the silicon overlayer that minimizes surface roughness of the silicon overlayer and we present a simple model based on geometrical thermodynamics to explain this.We observed a similar optimal range of exposures that minimizes the surface roughness for medium (575°C) and low (500°C) growth temperatures of the silicon layer. We present an explanation for this growth mode based on kinetics.


Author(s):  
T. H. Newman ◽  
R. F. W. Pease ◽  
K. J. Polasko ◽  
Y. W. Yau

Two prominent problems of electron beam lithography are slow throughput and proximity effects. The former arises from the serial nature of the exposure process; the current available in a beam of given resolution is limited by electron optical considerations and the resist sensitivity is limited by material considerations such that a dose of 1 μC/cm2 at 20 kV is required for the most sensitive resist and ten times that dose if high resolution is required.Proximity effects are caused by electrons scattered through lateral distances greater than the resolution of the pattern; a 20 keV electron in silicon has a range of about 3 μm whereas feature sizes are often less than 1 μm. Lowering the energy of the exposing electrons to, say, 2 keV would lower the electron range to less than 0.1 μm in silicon and thus effectively eliminate proximity effects as far as semiconductor circuit fabrication is concerned.


2015 ◽  
Vol 6 ◽  
pp. 1904-1926 ◽  
Author(s):  
Rachel M Thorman ◽  
Ragesh Kumar T. P. ◽  
D Howard Fairbrother ◽  
Oddur Ingólfsson

Focused electron beam induced deposition (FEBID) is a single-step, direct-write nanofabrication technique capable of writing three-dimensional metal-containing nanoscale structures on surfaces using electron-induced reactions of organometallic precursors. Currently FEBID is, however, limited in resolution due to deposition outside the area of the primary electron beam and in metal purity due to incomplete precursor decomposition. Both limitations are likely in part caused by reactions of precursor molecules with low-energy (<100 eV) secondary electrons generated by interactions of the primary beam with the substrate. These low-energy electrons are abundant both inside and outside the area of the primary electron beam and are associated with reactions causing incomplete ligand dissociation from FEBID precursors. As it is not possible to directly study the effects of secondary electrons in situ in FEBID, other means must be used to elucidate their role. In this context, gas phase studies can obtain well-resolved information on low-energy electron-induced reactions with FEBID precursors by studying isolated molecules interacting with single electrons of well-defined energy. In contrast, ultra-high vacuum surface studies on adsorbed precursor molecules can provide information on surface speciation and identify species desorbing from a substrate during electron irradiation under conditions more representative of FEBID. Comparing gas phase and surface science studies allows for insight into the primary deposition mechanisms for individual precursors; ideally, this information can be used to design future FEBID precursors and optimize deposition conditions. In this review, we give a summary of different low-energy electron-induced fragmentation processes that can be initiated by the secondary electrons generated in FEBID, specifically, dissociative electron attachment, dissociative ionization, neutral dissociation, and dipolar dissociation, emphasizing the different nature and energy dependence of each process. We then explore the value of studying these processes through comparative gas phase and surface studies for four commonly-used FEBID precursors: MeCpPtMe3, Pt(PF3)4, Co(CO)3NO, and W(CO)6. Through these case studies, it is evident that this combination of studies can provide valuable insight into potential mechanisms governing deposit formation in FEBID. Although further experiments and new approaches are needed, these studies are an important stepping-stone toward better understanding the fundamental physics behind the deposition process and establishing design criteria for optimized FEBID precursors.


1986 ◽  
Vol 75 ◽  
Author(s):  
R. R. Kunz ◽  
T. M. Mayer

AbstractA low energy, broad beam electron source was used to induce chemical reactions on surfaces. Electron beam energies were selected to maximize the emission of secondary electrons, for the purpose of determining if these low energy electrons contributed to the overall reaction. Room temperature silicon oxidation showed maximum terminal oxide thickness (35 Å) at the primary electron energy that produced the maximum secondary electron flux (300 eV). XPS showed these films to be mostly sub-oxide in nature. Similar results were obtained in analogous experiments using tetraethoxysilane to deposit SiO2 and using iron pentacarbonyl to deposit Fe. By increasing the incident angle of the electron beam to 70 degrees from the normal, the deposition yields of SiO2 and Fe increased by 45% and 30%, respectively. This again was thought to be a result of secondary electron contributions, as the secondary yield increased by a factor of two upon tilting the beam.


Author(s):  
G. G. Hembree ◽  
Luo Chuan Hong ◽  
P.A. Bennett ◽  
J.A. Venables

A new field emission scanning transmission electron microscope has been constructed for the NSF HREM facility at Arizona State University. The microscope is to be used for studies of surfaces, and incorporates several surface-related features, including provision for analysis of secondary and Auger electrons; these electrons are collected through the objective lens from either side of the sample, using the parallelizing action of the magnetic field. This collimates all the low energy electrons, which spiral in the high magnetic field. Given an initial field Bi∼1T, and a final (parallelizing) field Bf∼0.01T, all electrons emerge into a cone of semi-angle θf≤6°. The main practical problem in the way of using this well collimated beam of low energy (0-2keV) electrons is that it is travelling along the path of the (100keV) probing electron beam. To collect and analyze them, they must be deflected off the beam path with minimal effect on the probe position.


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