Preparation of manganese silicide thin films by solid phase reaction

1997 ◽  
Vol 113-114 ◽  
pp. 53-56 ◽  
Author(s):  
Jinliang Wang ◽  
Masaaki Hirai ◽  
Masahiko Kusaka ◽  
Motohiro Iwami
2018 ◽  
Vol 60 (7) ◽  
pp. 1397
Author(s):  
Р.Р. Алтунин ◽  
Е.Т. Моисеенко ◽  
С.М. Жарков

AbstractA sequence of phases forming during the solid-phase reaction in Al/Pt bilayer thin films has been investigated by in situ electron diffraction. It is shown that the amorphous PtAl_2 phase forms first during the solid-phase reaction initiated by heating. Upon further heating, PtAl_2, Pt_2Al_3, PtAl, and Pt_3Al crystalline phases sequentially form, which is qualitatively consistent with an effective formation heat model. The content of phases forming during the reaction has been quantitatively analyzed and the structural phase transformations have been examined.


2002 ◽  
Vol 16 (07) ◽  
pp. 205-215 ◽  
Author(s):  
Q. R. HOU ◽  
Z. M. WANG ◽  
Y. B. CHEN ◽  
Y. J. HE

The adhesion of manganese silicide ( MnSi x) films on silicon and glass substrates is studied by using the micro-scratch method. The films were prepared by electron beam evaporation and thermal evaporation. To improve adhesion of the films, several techniques including ion bombardment, increasing substrate temperature, and insertion of a silicon intermediate layer were used. Finally, adherent MnSi x(x~1.7) films were prepared through solid phase reaction as well as reactive deposition. The hardness and modulus of the MnSi x(x~1.7) film were measured by a nano-indenter and the values are 8.8±1.0 GPa and 141±15 GPa, respectively.


1987 ◽  
Vol 26 (Part 2, No. 9) ◽  
pp. L1451-L1452 ◽  
Author(s):  
Yoshio Sorimachi ◽  
Akihito Kobayashi ◽  
Tsutomu Yamashita ◽  
Masasuke Takata ◽  
Shinnosuke Miyauchi ◽  
...  

1990 ◽  
Vol 67 (10) ◽  
pp. 6269-6273
Author(s):  
R. S. Rastogi ◽  
V. D. Vankar ◽  
K. L. Chopra

1995 ◽  
Vol 402 ◽  
Author(s):  
Z. Wang ◽  
D. B. Aldrich ◽  
P. Goeller ◽  
R. J. Nemanich ◽  
D. E. Sayers

AbstractWe have investigated the electrical and structural properties of zirconium germanosilicide (Zr-Si-Ge) films formed during the Zr-Sil−xGex solid state reaction. Thin films of C49 Zr(Si1−xGex)2 were formed from the solid phase reaction of Zr and Si1−xGex bilayer structures. It was observed that Zr reacts uniformly with the Sil−xGex alloy and that C49 Zr(Si1−x Gex)2 is the final phase of the Zr-Si1−xGex, solid phase reaction (such tht y = x) for all compositions examined (x = 0.20, 0.33, and 0.50). The sheet resistance of the Zr(Si1−xGex)2 thin films were higher than the sheet resistance measured for ZrSi2 films. The stability of Zr(Sil−x Gex)2 in contact with Si1−Gex was investigated and no germanium segregation was detected in the Zr(Si1−xGex)2/Si1−Gex structures.


1986 ◽  
Vol 137 (2) ◽  
pp. 243-249 ◽  
Author(s):  
E. Zsoldos ◽  
G. Petõ ◽  
V. Schiller ◽  
G. Vályi

Sign in / Sign up

Export Citation Format

Share Document