Effect of Milling Machines and Sieve Sizes on Cooked Cassava Flour Quality

Fermentation of cassava chips prior to drying and milling processes improves cassava flour quality: i.e. lower cyanogenic content, remove specific odour and colour. Composition of microbial starter applied to the fermentation may affect the microbial population during the fermentation and thus directs the process and the produced flour properties. This study mapped the effects of microbial starter composition on the microbial profiles during the fermentation and the corresponding nutritional contents as well as pasting properties of the produced fermented cassava flour (fercaf). Combinations of Lactobacillus plantarum, Bacillus subtilis and Aspergillus oryzae, that were selected based on their enzymatic activities, were evaluated. The addition of microbial starter was shown to affect the dynamics in microbial population during the fermentation. The addition of lactic acid bacteria accelerated the release of cyanogenic glycoside and starch conversion to simpler sugars, the addition of B. subtilis improved the disruption of cassava fibres, whereas the addition of A.oryzae was shown to increase the protein content of fercaf. The different microbial starter added to fermentation system also resulted in different pasting properties of fercaf. Microbial starter composition can be designed as such for the production of a particular flour property.

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Effect of Planting Time and Cassava Variety to MOCAF (Modified Cassava Flour) Quality Level

IOP Conference Series Earth and Environmental Science ◽

10.1088/1755-1315/752/1/012054 ◽

2021 ◽

Vol 752 (1) ◽

pp. 012054

Author(s):

S S Dewi ◽

T Widyastuti

Keyword(s):

Quality Level ◽

Cassava Flour ◽

Flour Quality ◽

Planting Time

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Impacts of Environmental Factors on Pasting Properties of Cassava Flour Mediated by Its Macronutrients

Frontiers in Nutrition ◽

10.3389/fnut.2020.598960 ◽

2020 ◽

Vol 7 ◽

Author(s):

Yayuan Zhang ◽

Lei Nie ◽

Jian Sun ◽

Yan Hong ◽

Huabing Yan ◽

...

Keyword(s):

Principal Component Analysis ◽

Low Temperature ◽

Environmental Factors ◽

Environmental Conditions ◽

Near Infrared ◽

Principal Component ◽

Pasting Properties ◽

Cassava Flour ◽

Flour Quality ◽

Near Infrared Spectra

The impacts of environmental conditions on pasting and physicochemical properties were investigated using flour samples of the same cassava cultivar grown in seven different locations. Significant location differences in essential component (except for fiber) content of cassava flour were observed. Cassava flour showed obviously separated traits in the principal component analysis (PCA) of near-infrared spectra (NIR) according to geographical origins. The environmental effects were significant in the pasting properties of cassava flours. Sufficient precipitation and suitable low temperature promoted accumulation of starch in cassava, resulting in the high peak viscosity values of cassava flour. Pasting temperatures of cassava flour had a significant direct correlation with growth temperature and were negatively correlated with altitude. Precipitation from August to October showed a stronger direct correlation with trough and final viscosity. The results of this study indicated the possibility of predicting and controlling cassava flour quality and pasting properties according to the environmental conditions.

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Comparison of ultra high resolution immersion lens CFESEM and TEM for imaging of semiconductor devices

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100176241 ◽

1990 ◽

Vol 48 (4) ◽

pp. 622-623

Author(s):

Terrence Reilly ◽

Al Pelillo ◽

Barbara Miner

Keyword(s):

High Resolution ◽

Sample Preparation ◽

Cross Sections ◽

Semiconductor Devices ◽

Ion Milling ◽

Observation Area ◽

Transmission Electron ◽

Milling Machines ◽

Resolution Imaging ◽

Electron Microscopes

The use of transmission electron microscopes (TEM) has proven to be very valuable in the observation of semiconductor devices. The need for high resolution imaging becomes more important as the devices become smaller and more complex. However, the sample preparation for TEM observation of semiconductor devices have generally proven to be complex and time consuming. The use of ion milling machines usually require a certain degree of expertise and allow a very limited viewing area. Recently, the use of an ultra high resolution "immersion lens" cold cathode field emission scanning electron microscope (CFESEM) has proven to be very useful in the observation of semiconductor devices. Particularly at low accelerating voltages where compositional contrast is increased. The Hitachi S-900 has provided comparable resolution to a 300kV TEM on semiconductor cross sections. Using the CFESEM to supplement work currently being done with high voltage TEMs provides many advantages: sample preparation time is greatly reduced and the observation area has also been increased to 7mm. The larger viewing area provides the operator a much greater area to search for a particular feature of interest. More samples can be imaged on the CFESEM, leaving the TEM for analyses requiring diffraction work and/or detecting the nature of the crystallinity.

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PERBAIKAN TATA LETAK LANTAI PRODUKSI INDUSTRI MEBEL MENGGUNAKAN METODE GRAFIK DAN ALGORITMA CRAFT

JURNAL REKAYASA SISTEM INDUSTRI ◽

10.33884/jrsi.v6i1.1975 ◽

2020 ◽

Vol 6 (1) ◽

pp. 1

Author(s):

Kuswanto Kuswanto ◽

Juan Junius ◽

Anita Christine Sembiring

Keyword(s):

Operating System ◽

Material Handling ◽

Facility Layout ◽

Integrated Planning ◽

Furniture Manufacturing ◽

Milling Machines ◽

Material Handling Costs ◽

The Cost ◽

A Company ◽

Research Show

Facility layout is integrated planning of the flow of a product in an operating system to obtain the most effective and efficient interrelation between workers, materials, machinery, and equipment as well as handling and transferring materials. A company engaged in furniture manufacturing has a problem in its production process, namely, the distance between machines is too far so that it affects the cost of handling materials. Distant workstations are found on profile machines, milling machines, measuring machines, cutting machines. Therefore, improvements must be made to the layout of facilities on the production floor so that facility layout is efficient and material handling costs are reduced. The problem-solving approach used is the Graph Method and CRAFT Algorithm. The results of the research show that material handling costs are reduced by 7.58% or Rp. 17,765 using the CRAFT algorithm.

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