Experimental and analytical technique for estimating interface thermal conductance in composite structural elements under simulated fire conditions

2004 ◽  
Vol 28 (4) ◽  
pp. 347-354 ◽  
Author(s):  
Jamil Ghojel
Fire Research ◽  
2016 ◽  
Author(s):  
Hélder D. Craveiro ◽  
João Paulo C. Rodrigues ◽  
Luís M. Laím

Cold-formed steel (CFS) profiles with a wide range of cross-section shapes are commonly used in building construction industry. Nowadays several cross-sections can be built using the available standard single sections (C, U, Σ, etc.), namely open built-up and closed built-up cross-sections. This paper reports an extensive experimental investigation on the behavior of single and built-up cold-formed steel columns at both ambient and simulated fire conditions considering the effect of restraint to thermal elongation. The buckling behavior, ultimate loads and failure modes, of different types of CFS columns at both ambient and simulated fire conditions with restraint to thermal elongation, are presented and compared. Regarding the buckling tests at ambient temperature it was observed that the use of built-up cross-sections ensures significantly higher values of buckling loads. Especially for the built-up cross-sections the failure modes were characterized by the interaction of individual buckling modes, namely flexural about the minor axis, distortional and local buckling. Regarding the fire tests, it is clear that the same levels of restraint used in the experimental investigation induce different rates in the generated restraining forces due to thermal elongation of the columns. Another conclusion that can be drawn from the results is that by increasing the level of restraint to thermal elongation the failure of the columns is controlled by the generated restraining forces, whereas for lower levels of restraint the temperature plays a more important role. Hence, higher levels of imposed restraint to thermal elongation will lead to higher values of generated restraining forces and eventually to lower values of critical temperature and time.


2020 ◽  
Vol 56 (3) ◽  
pp. 2241-2274
Author(s):  
S. Q. Jia ◽  
F. Yang

Abstract Copper/diamond composites have drawn lots of attention in the last few decades, due to its potential high thermal conductivity and promising applications in high-power electronic devices. However, the bottlenecks for their practical application are high manufacturing/machining cost and uncontrollable thermal performance affected by the interface characteristics, and the interface thermal conductance mechanisms are still unclear. In this paper, we reviewed the recent research works carried out on this topic, and this primarily includes (1) evaluating the commonly acknowledged principles for acquiring high thermal conductivity of copper/diamond composites that are produced by different processing methods; (2) addressing the factors that influence the thermal conductivity of copper/diamond composites; and (3) elaborating the interface thermal conductance problem to increase the understanding of thermal transferring mechanisms in the boundary area and provide necessary guidance for future designing the composite interface structure. The links between the composite’s interface thermal conductance and thermal conductivity, which are built quantitatively via the developed models, were also reviewed in the last part.


2012 ◽  
Vol 101 (22) ◽  
pp. 221903 ◽  
Author(s):  
Yann Chalopin ◽  
Natalio Mingo ◽  
Jiankuai Diao ◽  
Deepak Srivastava ◽  
Sebastian Volz

2021 ◽  
Author(s):  
Houfu Song ◽  
Fang Liu ◽  
Song Hu ◽  
Qinshu Li ◽  
Susu Yang ◽  
...  

Abstract Understanding thermal transport across metal/semiconductor interfaces is crucial for heat dissipation of electronics The dominant heat carriers in non-metals, phonons, transport elastically across most interfaces, except for a few extreme cases where the two materials that formed the interface are highly dissimilar with a large difference in Debye temperature. In this work we show that even for two materials with similar Debye temperatures (Al/Si, Al/GaN), a substantial portion of phonons will transport inelastically across their interfaces at high temperatures, significantly enhancing interface thermal conductance. Moreover, we find that interface roughness strongly affects phonon transport process. For atomically sharp interfaces, phonons are allowed to transport inelastically and interface thermal conductance linearly increases at high temperatures. With increasing interface roughness, inelastic phonon transport rapidly diminishes. Our results provide new insights on phonon transport across interfaces and open up opportunities to engineering interface thermal conductance specifically for materials of relevance to microelectronics.


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