scholarly journals Continuous Manufacturing of High Quality Pharmaceutical Cocrystals Integrated with Process Analytical Tools for In-Line Process Control

2016 ◽  
Vol 16 (6) ◽  
pp. 3425-3434 ◽  
Author(s):  
Hiren G. Moradiya ◽  
Muhammad T. Islam ◽  
Nikolaos Scoutaris ◽  
Sheelagh A. Halsey ◽  
Babur Z. Chowdhry ◽  
...  
Keyword(s):  
Process Control ◽  
Continuous Manufacturing ◽  
High Quality ◽  
Pharmaceutical Cocrystals ◽  
Line Process ◽  
Analytical Tools

Thermal Laser Separation – A Novel Dicing Technology Fulfilling the Demands of Volume Manufacturing of 4H-SiC Devices

2015 ◽  
Vol 821-823 ◽  
pp. 528-532 ◽  
Author(s):  
Dirk Lewke ◽  
Karl Otto Dohnke ◽  
Hans Ulrich Zühlke ◽  
Mercedes Cerezuela Barret ◽  
Martin Schellenberger ◽  
...  
Keyword(s):  
Experimental Data ◽  
Process Control ◽  
Tool Wear ◽  
Large Scale ◽  
State Of The Art ◽  
Scale Production ◽  
High Quality ◽  
Large Scale Production ◽  
Laser Separation

One challenge for volume manufacturing of 4H-SiC devices is the state-of-the-art wafer dicing technology – the mechanical blade dicing which suffers from high tool wear and low feed rates. In this paper we discuss Thermal Laser Separation (TLS) as a novel dicing technology for large scale production of SiC devices. We compare the latest TLS experimental data resulting from fully processed 4H-SiC wafers with results obtained by mechanical dicing technology. Especially typical product relevant features like process control monitoring (PCM) structures and backside metallization, quality of diced SiC-devices as well as productivity are considered. It could be shown that with feed rates up to two orders of magnitude higher than state-of-the-art, no tool wear and high quality of diced chips, TLS has a very promising potential to fulfill the demands of volume manufacturing of 4H-SiC devices.

scholarly journals Coprocessing of Pharmaceutical Cocrystals for High Quality and Enhanced Physicochemical Stability

2018 ◽  
Vol 19 (2) ◽  
pp. 876-888 ◽  
Author(s):  
Steven A. Ross ◽  
Adam Ward ◽  
Pat Basford ◽  
Mark McAllister ◽  
Dennis Douroumis
Keyword(s):  
High Quality ◽  
Pharmaceutical Cocrystals ◽  
Physicochemical Stability

Diagnostic errors and repetitive sequential classifications in on-line process control by attributes

2010 ◽  
Vol 201 (1) ◽  
pp. 231-238 ◽  
Author(s):  
Roberto da Costa Quinino ◽  
Emerson C. Colin ◽  
Linda Lee Ho
Keyword(s):  
Process Control ◽  
Diagnostic Errors ◽  
On Line ◽  
Line Process

On-Line Process Control using Attributes with Misclassification Errors: An Economical Design for Short-Run Production

2012 ◽  
Vol 41 (10) ◽  
pp. 1813-1832 ◽  
Author(s):  
Lupércio F. Bessegato ◽  
Roberto C. Quinino ◽  
Luiz H. Duczmal ◽  
Linda Lee Ho
Keyword(s):  
Process Control ◽  
Economical Design ◽  
Misclassification Errors ◽  
Short Run ◽  
On Line ◽  
Line Process

Automated Metrology Improves Productivity and Yields for Wafer Level Packaging in High Volume Manufacturing

2014 ◽  
Vol 2014 (1) ◽  
pp. 000155-000160
Author(s):  
Jin You Zao ◽  
Bong Yin Yen ◽  
Lim Beng Kuan ◽  
John Thornell ◽  
Darcy Hart ◽  
...  
Keyword(s):  
Process Control ◽  
High Volume ◽  
Critical Dimension ◽  
Thickness Measurement ◽  
Electrical Performance ◽  
Wafer Level ◽  
Chip Scale Package ◽  
Under Sampling ◽  
Line Process ◽  
Increasing Demand

Wafer Bumping In-line Process control of Wafer-Level Chip Scale Package (WLCSP) requires accurate measurement of bump features during processing. These bump features include critical dimension of Redistribution Layer (RDL), Under Bump Metal (UBM) and transparent polyimide thickness. For a 4-Mask Layer Cu plated WLCSP, accurate feature thickness measurement is required for both the Redistribution Layer (RDL) and Under Bump Metal (UBM) to ensure consistent delivery of good electrical performance and package reliability. This is especially important as WLCSP is moving towards finer feature size and pitch to meet increasing demand for smaller form factor. This paper reports the development of an automated Critical Dimension (CD) measurement solution capable of measuring features at pre-defined locations on different topology both under sampling and full inspection mode on wafer. The solution is fully scalable to meet the requirement of high product-mix HVM environment, by highly adaptive to different features on different products for which measurement needs to be automated for effective process control.

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