scholarly journals Dynamic detection of electron spin accumulation in ferromagnet–semiconductor devices by ferromagnetic resonance

2016 ◽  
Vol 7 (1) ◽  
Author(s):  
Changjiang Liu ◽  
Sahil J. Patel ◽  
Timothy A. Peterson ◽  
Chad C. Geppert ◽  
Kevin D. Christie ◽  
...  
2016 ◽  
Author(s):  
Paul A. Crowell ◽  
Changjiang Liu ◽  
Sahil Patel ◽  
Tim Peterson ◽  
Chad C. Geppert ◽  
...  

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
S. S. Nkosi ◽  
H. M. Gavi ◽  
D. E. Motaung ◽  
J. Keartland ◽  
E. Sideras-Haddad ◽  
...  

Electron spin resonance (ESR) measurements at room temperature and X-band microwave frequency were performed on highly crystalline FePt system thin films. Fairly high DC static magnetic field absorption of about 300 mT was observed in these films. We attribute the high field absorption to ferromagnetic resonance (FMR). Upon increasing iron content in FePt system, no detectable spin waves modes were identified already at room temperature. This signifies a homogeneous distribution of the magnetization across the films. We qualitatively attributed such homogeneity distribution in the films to self-assembly of these Fe–Pt system nanoparticles. The results revealed that the FePt system contains hyperfine coupling with sextetI=5/2exhibiting a phase reversal behaviour compared to FMR line. Both iron content and crystallite size increased the FMR intensity making the films good candidates for large data storage mediums and spintronics.


2010 ◽  
Vol 168-169 ◽  
pp. 109-112
Author(s):  
N.I. Yurasov

The spin-orbital subsystem model with electron clusters was used for studying the frequency spectra ferromagnetic resonance (FMR). A new type of ferromagnetic order and new region of FMR were found. The new region may be in the microwave region or in the infrared region (IR). The volume of spin-orbital electron cluster is equal to 1-50 cubic nanometer approximately.


2008 ◽  
Vol 78 (3) ◽  
Author(s):  
Y. G. Wei ◽  
C. E. Malec ◽  
D. Davidović

Author(s):  
X. Lou ◽  
C. Adelmann ◽  
M. Furis ◽  
S.A. Crooker ◽  
C.J. Palmstrom ◽  
...  

Author(s):  
Peter Pegler ◽  
N. David Theodore ◽  
Ming Pan

High-pressure oxidation of silicon (HIPOX) is one of various techniques used for electrical-isolation of semiconductor-devices on silicon substrates. Other techniques have included local-oxidation of silicon (LOCOS), poly-buffered LOCOS, deep-trench isolation and separation of silicon by implanted oxygen (SIMOX). Reliable use of HIPOX for device-isolation requires an understanding of the behavior of the materials and structures being used and their interactions under different processing conditions. The effect of HIPOX-related stresses in the structures is of interest because structuraldefects, if formed, could electrically degrade devices.This investigation was performed to study the origin and behavior of defects in recessed HIPOX (RHIPOX) structures. The structures were exposed to a boron implant. Samples consisted of (i) RHlPOX'ed strip exposed to a boron implant, (ii) recessed strip prior to HIPOX, but exposed to a boron implant, (iii) test-pad prior to HIPOX, (iv) HIPOX'ed region away from R-HIPOX edge. Cross-section TEM specimens were prepared in the <110> substrate-geometry.


Author(s):  
Terrence Reilly ◽  
Al Pelillo ◽  
Barbara Miner

The use of transmission electron microscopes (TEM) has proven to be very valuable in the observation of semiconductor devices. The need for high resolution imaging becomes more important as the devices become smaller and more complex. However, the sample preparation for TEM observation of semiconductor devices have generally proven to be complex and time consuming. The use of ion milling machines usually require a certain degree of expertise and allow a very limited viewing area. Recently, the use of an ultra high resolution "immersion lens" cold cathode field emission scanning electron microscope (CFESEM) has proven to be very useful in the observation of semiconductor devices. Particularly at low accelerating voltages where compositional contrast is increased. The Hitachi S-900 has provided comparable resolution to a 300kV TEM on semiconductor cross sections. Using the CFESEM to supplement work currently being done with high voltage TEMs provides many advantages: sample preparation time is greatly reduced and the observation area has also been increased to 7mm. The larger viewing area provides the operator a much greater area to search for a particular feature of interest. More samples can be imaged on the CFESEM, leaving the TEM for analyses requiring diffraction work and/or detecting the nature of the crystallinity.


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