In situ propylation using sodium tetrapropylborate as a fast and simplified sample preparation for the speciation analysis of organolead compounds using GC-MIP-AES

1999 ◽  
Vol 14 (9) ◽  
pp. 1307-1311 ◽  
Author(s):  
Monika Heisterkamp ◽  
Freddy C. Adams
Keyword(s):  
Sample Preparation ◽  
Speciation Analysis ◽  
Organolead Compounds ◽  
Sodium Tetrapropylborate

scholarly journals Innovations in the Speciation of Organolead Compounds in Water: Towards a More Rational, Rapid, and Simple Analytical Process

2002 ◽  
Vol 2 ◽  
pp. 1332-1337
Author(s):  
J.R. Baena ◽  
M. Gallego ◽  
M. Valcarcel
Keyword(s):  
Sample Preparation ◽  
Continuous Flow ◽  
Speciation Analysis ◽  
Automated Systems ◽  
Final Solution ◽  
Analytical Process ◽  
Organolead Compounds ◽  
Simple Systems ◽  
Sodium Tetrapropylborate ◽  
Made In

Speciation analysis calls for rapid, simple systems for minimizing errors made in the most troublesome of all steps in the analytical process: sample preparation. In this context, continuous-flow systems are of great help. The evolution in the different methodologies enabled solutions to the main shortcomings occurring from the lack of selectivity of using RP–C18as sorbent material. One solution was a shift to more sensitive and selective, but only partially automated, systems employing C60fullerene and Grignard’s reagent; another was a shift to completely automated systems employing sodium tetrapropylborate; and a final solution was to employ the simplest possible configuration by removing the reagent stream. The analytical methods developed allowed the identification and quantification of different organolead species at the pg/ml levels in rainwater samples, with precision (RSD) of about 5% and recoveries ranging from 92 to 100%.

To Eliminate Curtain Effect of FIB TEM Samples by a Combination of Sample Dicing and Backside Milling

2014 ◽  
Author(s):  
Jian-Shing Luo ◽  
Hsiu Ting Lee
Keyword(s):  
Sample Preparation ◽  
Focused Ion Beam ◽  
Preparation Method ◽  
Low Cost ◽  
Ion Beam ◽  
Sample Preparation Method ◽  
Site Specific ◽  
Dual Beam ◽  
Transmission Electron

Abstract Several methods are used to invert samples 180 deg in a dual beam focused ion beam (FIB) system for backside milling by a specific in-situ lift out system or stages. However, most of those methods occupied too much time on FIB systems or requires a specific in-situ lift out system. This paper provides a novel transmission electron microscopy (TEM) sample preparation method to eliminate the curtain effect completely by a combination of backside milling and sample dicing with low cost and less FIB time. The procedures of the TEM pre-thinned sample preparation method using a combination of sample dicing and backside milling are described step by step. From the analysis results, the method has applied successfully to eliminate the curtain effect of dual beam FIB TEM samples for both random and site specific addresses.

In-Situ Mechanical Sample Preparation of Selected Sites and Components on Large Modules and Boards

2016 ◽  
Author(s):  
Jim Colvin ◽  
Timothy Hazeldine ◽  
Heenal Patel
Keyword(s):  
Sample Preparation ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Tilt Table ◽  
Standard Requirement ◽  
Open Design ◽  
Bga Packages ◽  
Silicon Thickness ◽  
Board Level

Abstract The standard requirement for FA Engineers needing to remove components from a board, prior to decapsulation or sample preparation, is shown to be greatly reduced, by the methods discussed here. By using a mechanical selected area preparation system with an open-design it is possible to reach all required areas of a large printed circuit board (PCB) or module to prepare a single component ‘in situ’. This makes subsequent optical or electrical testing faster and often more convenient to accomplish. Electronic End-pointing and 3D curvature compensation methods can often be used in parallel with sample prep techniques to further improve the consistency and efficacy of the decapsulation and thinning uniformity and final remaining silicon thickness (RST). Board level prep eliminates the worry of rework removal of BGA packages and the subsequent risk of damage to the device. Since the entire board is mounted, the contamination is restricted to the die surface and can be kept from the underside ball connections unlike current liquid immersion methods of package thinning or delayering. Since the camera is in line with the abrasion interface, imaging is real time during the entire milling and thinning process. Recent advances in automated tilt-table design have meant that a specific component’s angular orientation can be optimized for sample preparation. Improved tilt table technology also allows for improved mounting capability for boards of many types and sizes. The paper describes methods for decapsulation, thinning and backside polishing of a part ‘in situ’ on the polishing machine and allows the system to operate as a probe station for monitoring electrical characteristics while thinning. Considerations for designing board-level workholders are described – for boards that that are populated with components on one or even both sides. Using the techniques described, the quality of sample preparation and control is on a par with the processing of single package-level devices.

A New Method of Wafer Level Plan View TEM Sample Preparation by DualBeam

2008 ◽  
Author(s):  
Hyoung H. Kang ◽  
Michael A. Gribelyuk ◽  
Oliver D. Patterson ◽  
Steven B. Herschbein ◽  
Corey Senowitz
Keyword(s):  
Sample Preparation ◽  
Ex Situ ◽  
Wafer Level ◽  
Cross Sectional ◽  
Plan View ◽  
Manufacturing Line ◽  
Transmission Electron ◽  
Thin Lamella ◽  
Preparation Techniques

Abstract Cross-sectional style transmission electron microscopy (TEM) sample preparation techniques by DualBeam (SEM/FIB) systems are widely used in both laboratory and manufacturing lines with either in-situ or ex-situ lift out methods. By contrast, however, the plan view TEM sample has only been prepared in the laboratory environment, and only after breaking the wafer. This paper introduces a novel methodology for in-line, plan view TEM sample preparation at the 300mm wafer level that does not require breaking the wafer. It also presents the benefit of the technique on electrically short defects. The methodology of thin lamella TEM sample preparation for plan view work in two different tool configurations is also presented. The detailed procedure of thin lamella sample preparation is also described. In-line, full wafer plan view (S)TEM provides a quick turn around solution for defect analysis in the manufacturing line.

Sample Preparation of Aluminum Bridge Test Vehicles for Tem In-Situ Crystallographic Studies of Electromigration

1987 ◽  
Vol 115 ◽  
Author(s):  
W. E. Rhoden ◽  
J. V. Maskowitz ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd
Keyword(s):  
High Temperature ◽  
Sample Preparation ◽  
Integrated Circuit ◽  
Circuit Reliability ◽  
Test Vehicle ◽  
Aluminum Films ◽  
Current Densities ◽  
Integrated Circuit Reliability ◽  
A Current

IntroductionElectromigration in aluminum films has been identified as an increasing concern for integrated circuit reliability. Electromigration is the mass transport of atoms in a conductor under a current stress. Electromigration occurs in conductors experiencing current densities greater than 105 A/cm2 and is accelerated by high temperature. The damage to aluminum films manifests itself in the formation of voids, hillocks and whiskers along the conductor. This paper presents a test vehicle preparation procedure which can be used to investigate electromigration.

In situ TEM study of stability of TaRhx diffusion barriers using a novel sample preparation method

Micron ◽  
2014 ◽  
Vol 58 ◽  
pp. 25-31 ◽  
Author(s):  
Neda Dalili ◽  
Peng Li ◽  
Martin Kupsta ◽  
Qi Liu ◽  
Douglas G. Ivey
Keyword(s):  
Sample Preparation ◽  
Preparation Method ◽  
Diffusion Barriers ◽  
In Situ Tem ◽  
Sample Preparation Method

Effect of sample preparation when evaluating feed degradability using dacron bags

1996 ◽  
Vol 1996 ◽  
pp. 229-229
Author(s):  
H.J. Kim ◽  
M.S. Dhanoa ◽  
W.J. Maeng ◽  
M.A. Neville ◽  
R.T. Evans ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Dry Matter ◽  
Fine Particles ◽  
Important Measurement

In dacron bag methodology an important measurement is the wash value component. This component is assumed to be wholly degrabable and forms a major proportion of effective degradability calculations (Cockburn et al., 1993). Grinding of feeds with a high content of solubles or fine particles may result in high initial wash-out values and may affect feed degradability adversely. An experiment, was conducted to assess the effect of grinding on dry matter (DM) degradation of maize and wheat, using the in situ dacron bag technique.

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