Amorphization and thermal stability of aluminum-based nanoparticles prepared from the rapid cooling of nanodroplets: effect of iron addition

2015 ◽  
Vol 17 (9) ◽  
pp. 6511-6522 ◽  
Author(s):  
Shifang Xiao ◽  
Xiaofan Li ◽  
Huiqiu Deng ◽  
Lei Deng ◽  
Wangyu Hu
Keyword(s):  
Thermal Stability ◽  
Glass Formation ◽  
Rapid Cooling ◽  
Glass Formation Ability ◽  
Cluster Network ◽  
Thermal Stability Of ◽  
Iron Addition

The Fe-centred ICO cluster network near the surface effectively promotes the glass formation ability of Fe–Al nanoalloy.

The Microalloying Effects in Cu-Based Bulk Metallic Glasses

2011 ◽  
Vol 688 ◽  
pp. 407-412
Author(s):  
Li Jie Yue ◽  
Jin Sheng Han ◽  
Kun Xie
Keyword(s):  
Thermal Stability ◽  
Corrosion Resistance ◽  
Metallic Glass ◽  
Metallic Glasses ◽  
Glass Formation ◽  
Glassy Alloy ◽  
Liquid Region ◽  
Scanning Calorimetry ◽  
Glass Formation Ability ◽  
Better Than

The glassy alloy rods of Cu50Zr43Al7, (Cu50Zr43Al7)100-xYx(x=2,5) and (Cu50Zr43Al7)100-xAgx(x=6,7) with diameters of 3.0 mm were prepared by copper mold suction casting method. The influence of adding Ag and Y to Cu50Zr43Al7 metallic glass on glass formation ability (GFA) and thermal stability was studied by means of X-ray diffraction analysis (XRD) and differential scanning calorimetry (DSC). The results show that Ag and Y appropriate micro-addition enhance the glass formation ability and thermal stability of the Cu-Zr-Al metallic glass. The effect of Ag is better than that of Y. The addition of Ag causes a increase of the reduced glass transition temperature (Trg) of (Cu50Zr43Al7)100-xAgx alloy from 0.618 at 0 at.% Ag to 0.628 at 7 at.% Ag. The width of the supercooled liquid region of Cu43Zr43Al7Ag7 glassy alloy increases about 25K compared with that of Cu50Zr43Al7, and the γ value of Cu43Zr43Al7Ag7 reaches 0.433. The electrochemical corrosion behaviors of Cu50Zr43Al7, (Cu50Zr43Al7)100-xYx(x=2,5) and (Cu50Zr43Al7)100-xAgx(x=6,7) metallic glasses in 3.5% NaCl solution were investigated by potentiodynamic polarization method. It is found that corrosion resistance of all amorphous alloys is better than that of the corresponding crystalline alloys. The Ag and Y micro-addition improve corrosion resistance of Cu50Zr43Al7 metallic glass. The corrosion current density of Cu43Zr43Al7Ag7 metallic glass decreases 1~2 orders of magnitude compared with that of Cu50Zr43Al7.

Glass Formation and Thermal Stability of Mechanically Alloyed Al75Ni10Ti10Zr5 Amorphous Composites with Graphene Addition

2016 ◽  
Vol 849 ◽  
pp. 58-63 ◽  
Author(s):  
Tong Yang Wang ◽  
Zhen Xi Sun ◽  
Lan Xiang Zhang ◽  
Yan Wang
Keyword(s):  
Thermal Stability ◽  
Crystallization Temperature ◽  
Glass Formation ◽  
Milling Time ◽  
Glass Forming Ability ◽  
Mechanically Alloyed ◽  
Glass Forming ◽  
Onset Crystallization Temperature ◽  
Long Duration ◽  
Thermal Stability Of

In this study, the influence of 0.5 wt.% graphene (Gr) addition on the glass formation and thermal stability of the Al75Ni10Ti10Zr5 alloy during mechanical alloying (MA) process has been investigated. The as-milled products consist of the amorphous phase and a small amount of the AlNi nanocrystals. The results showed that the 0.5 wt.% Gr addition could shorten the amorphization process, indicating the enhancement of the glass forming ability. Moreover, the onset crystallization temperature (Tx1) slightly decreased with prolonging milling time for the as-milled alloys. However, it is worth noting that the Gr addition effectively increased the Tx1 of the as-milled Al-based amorphous composites for the long duration of MA time. The Tx1 values of the as-milled AlNiTiZrGr amorphous composites were more than 1120 K, exhibiting the highly thermal stability.

Effect of microalloying on glass formation and thermal stability of Cu–Pr-based amorphous alloys

2007 ◽  
Vol 439 (1-2) ◽  
pp. 87-90 ◽  
Author(s):  
Xuelian Li ◽  
Xiufang Bian ◽  
Lina Hu ◽  
Yuqin Wu ◽  
Junyan Zhang
Keyword(s):  
Thermal Stability ◽  
Glass Formation ◽  
Amorphous Alloys ◽  
Thermal Stability Of

Preparation of Mg-Cu-Y and Mg-Ni-Gd Based Amorphous Brazing Material

2011 ◽  
Vol 686 ◽  
pp. 287-291
Author(s):  
Mei Qing Cao ◽  
Kun Xie
Keyword(s):  
Thermal Stability ◽  
Rapid Solidification ◽  
Glass Formation ◽  
Amorphous Structure ◽  
Glass Formation Ability

Several Mg-Cu-Y and Mg-Ni-Gd based amorphous brazing materials were prepared by means of rapid solidification. The amorphous structure was examined by XRD and DSC, glass formation ability and melting feature of the amorphous brazing material were also studied. Results show that the alloys prepared are all amorphous and Mg-Ni-Gd alloy has higher glass formation ability and thermal stability.

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

Thermal stability of Al-Cu-Fe icosahedral alloys

1991 ◽  
Vol 1 (12) ◽  
pp. 1823-1836 ◽  
Author(s):  
M. Bessière ◽  
A. Quivy ◽  
S. Lefebvre ◽  
J. Devaud-Rzepski ◽  
Y. Calvayrac
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of
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