A novel approach to prepare graphene oxide/soluble polyimide composite films with a low dielectric constant and high mechanical properties

RSC Advances ◽  
2014 ◽  
Vol 4 (93) ◽  
pp. 51117-51125 ◽  
Author(s):  
Wei-Hao Liao ◽  
Shin-Yi Yang ◽  
Sheng-Tsung Hsiao ◽  
Yu-Sheng Wang ◽  
Shin-Ming Li ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Graphene Oxide ◽  
High Performance ◽  
Composite Films ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Novel Approach ◽  
Soluble Polyimide

This study proposes a facile, practical and effective approach to prepare high-performance graphene oxide (GO)/soluble polyimide (SPI) composite films through a dissolved and dispersed strategy.

Facile method for fabricating low dielectric constant polyimide fibers with hyperbranched polysiloxane

2017 ◽  
Vol 5 (11) ◽  
pp. 2818-2825 ◽  
Author(s):  
Jie Dong ◽  
Cairan Yang ◽  
Yang Cheng ◽  
Tingting Wu ◽  
Xin Zhao ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Dielectric Constant ◽  
High Performance ◽  
Low Dielectric Constant ◽  
Excellent Thermal Stability ◽  
Low Dielectric ◽  
Polyimide Fibers ◽  
Hyperbranched Polysiloxane ◽  
Radar Wave

High-performance fibers with a low dielectric constant and good mechanical properties as well as excellent thermal stability are in demand for the next generation of advanced radar-wave-transparent composites.

The characterization and preparation of porous low dielectric films using various cyclodextrins as template materials

2003 ◽  
Vol 766 ◽  
Author(s):  
Jin-Heong Yim ◽  
Jung-Bae Kim ◽  
Hyun-Dam Jeong ◽  
Yi-Yeoul Lyu ◽  
Sang Kook Mah ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Dielectric Constant ◽  
Pore Structure ◽  
Pore Diameter ◽  
Dielectric Films ◽  
Low Dielectric Constant ◽  
Cyclodextrin Derivatives ◽  
Low Dielectric ◽  
Low K

AbstractPorous low dielectric films containing nano pores (∼20Å) with low dielectric constant (<2.2), have been prepared by using various kinds of cyclodextrin derivatives as porogenic materials. The pore structure such as pore size and interconnectivity can be controlled by changing functional groups of the cyclodextrin derivatives. We found that mechanical properties of porous low-k thin film prepared with mCSSQ (modified cyclic silsesquioxane) precursor and cyclodextrin derivatives were correlated with the pore interconnection length. The longer the interconnection length of nanopores in the thin film, the worse the mechanical properties of the thin film (such as hardness and modulus) even though the pore diameter of the films were microporous (∼2nm).

Structural and Mechanical Properties of Low Dielectric Constant SiOC(-H) Films Using MTES/O2 Deposited by PECVD

2007 ◽  
pp. 239-242
Author(s):  
R. Navamathavan ◽  
Anvar Zakirov ◽  
Hyun Seung Kim ◽  
Yong Jun Jang ◽  
An Soo Jung ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Low Dielectric

Outstanding dielectric and thermal properties of main chain-type poly(benzoxazine-co-imide-co-siloxane)-based cross-linked networks

2019 ◽  
Vol 10 (19) ◽  
pp. 2387-2396 ◽  
Author(s):  
Kan Zhang ◽  
Xinye Yu ◽  
Shiao-Wei Kuo
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
High Performance ◽  
Main Chain ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Chain Type ◽  
Dielectric And Thermal Properties

A high performance cross-linked polymer with a very low dielectric constant was achieved via a newly designed main-chain type poly(benzoxazine-co-imide-co-siloxane).

High-performance fluorinated polyimide/pure silica zeolite nanocrystal hybrid films with a low dielectric constant

RSC Advances ◽  
2015 ◽  
Vol 5 (93) ◽  
pp. 76476-76482 ◽  
Author(s):  
Zhenxun Huang ◽  
Shumei Liu ◽  
Yanchao Yuan ◽  
Jianqing Zhao
Keyword(s):  
Dielectric Constant ◽  
High Performance ◽  
Low Dielectric Constant ◽  
Hybrid Films ◽  
Low Dielectric ◽  
Simple Strategy ◽  
Pure Silica ◽  
Fluorinated Polyimide ◽  
Enhanced Properties

A simple strategy for preparing the low-κ FPI hybrids with enhanced properties.

31.2: Low Dielectric Constant Materials for High Performance LCDs

2015 ◽  
Vol 46 (1) ◽  
pp. 450-453
Author(s):  
Haiwei Chen ◽  
Fenglin Peng ◽  
Shin-Tson Wu ◽  
Minggang Hu ◽  
Jian Li ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
High Performance ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Low Dielectric Constant Materials

Robust spin-on-glass poly(methyl)silsesquioxane-based low-k materials derived from a cyclic siloxane precursor

RSC Advances ◽  
2015 ◽  
Vol 5 (82) ◽  
pp. 66511-66517 ◽  
Author(s):  
Albert S. Lee ◽  
Sung Yeoun Oh ◽  
Seung-Sock Choi ◽  
He Seung Lee ◽  
Seung Sang Hwang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Cyclic Siloxane ◽  
Low Dielectric ◽  
Methyl Silsesquioxane ◽  
Low K

Low dielectric constant poly(methyl)silsesquioxane spin-on-glass resins incorporating a cyclic precursor exhibited exceptional mechanical properties to withstand CMP processes.

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