Preparation and properties of graphene oxide/polyimide composite films with low dielectric constant and ultrahigh strength via in situ polymerization

Thermostable well-functionalized graphene oxide/polyimide composites with high dielectric constant and low dielectric loss were obtained at a low percolation threshold.

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Preparation of Fluorinated Graphene Oxide/Polyimide Composites with Low Dielectric Constant and Moisture Resistance

NANO ◽

10.1142/s1793292018500984 ◽

2018 ◽

Vol 13 (08) ◽

pp. 1850098

Author(s):

Dongqing He ◽

Zhiguo Wang ◽

Jiapeng Long ◽

Bing Liang

Keyword(s):

Dielectric Constant ◽

Graphene Oxide ◽

In Situ Polymerization ◽

Composite Films ◽

Decomposition Temperature ◽

Low Dielectric ◽

Strong Interfacial Interaction ◽

Fluorinated Graphene ◽

Different Content ◽

Fluorinated Graphene Oxide

Fluorinated graphene oxide (FGO) was successfully prepared in this paper, and the chemical structure of FGO was characterized. A series of polyimide (PI) composite films with different content of FGO was prepared by in situ polymerization. Because of the homogeneous dispersion of FGO and the strong interfacial interaction between FGO and the PI matrix, the resulting composite films that contained FGO exhibited effects of mechanical properties, thermal properties and dielectric properties that were even better than the pure PI. Furthermore, due to the hydrophobic properties of FGO, the water absorption of the composite films were reduced. The result showed when the 0.6[Formula: see text]wt.% FGO was filled into the PI, the tensile strength was increased about 66.3%, the decomposition temperature was increased from 540∘C to 570∘C, and the dielectric constant (Dk) decreased with the increasing content of FGO, and a Dk value of 2.28 was achieved when the content of FGO was 1.0[Formula: see text]wt.%.

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A novel approach to prepare graphene oxide/soluble polyimide composite films with a low dielectric constant and high mechanical properties

RSC Advances ◽

10.1039/c4ra07716d ◽

2014 ◽

Vol 4 (93) ◽

pp. 51117-51125 ◽

Cited By ~ 17

Author(s):

Wei-Hao Liao ◽

Shin-Yi Yang ◽

Sheng-Tsung Hsiao ◽

Yu-Sheng Wang ◽

Shin-Ming Li ◽

...

Keyword(s):

Mechanical Properties ◽

Dielectric Constant ◽

Graphene Oxide ◽

High Performance ◽

Composite Films ◽

Low Dielectric Constant ◽

Low Dielectric ◽

Novel Approach ◽

Soluble Polyimide

This study proposes a facile, practical and effective approach to prepare high-performance graphene oxide (GO)/soluble polyimide (SPI) composite films through a dissolved and dispersed strategy.

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Preparation of Hollow Glass Microsphere/Organic Silicone Resin Composite Material with Low Dielectric Constant by In-Situ Polymerization

Silicon ◽

10.1007/s12633-019-00234-1 ◽

2019 ◽

Vol 12 (6) ◽

pp. 1417-1423 ◽

Cited By ~ 1

Author(s):

Yan Yuan ◽

Shen Diao ◽

Caide Zhao ◽

Shuhua Ge ◽

Xue Wang ◽

...

Keyword(s):

Dielectric Constant ◽

Composite Material ◽

In Situ Polymerization ◽

Resin Composite ◽

Low Dielectric Constant ◽

Silicone Resin ◽

Hollow Glass Microsphere ◽

Hollow Glass ◽

Low Dielectric

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Stress Development in Low Dielectric Constant Silica Films During Drying and Heating Process

MRS Proceedings ◽

10.1557/proc-594-463 ◽

1999 ◽

Vol 594 ◽

Cited By ~ 1

Author(s):

Mengcheng Lu ◽

C. Jeffrey Brinker

Keyword(s):

Dielectric Constant ◽

Tensile Stress ◽

Sol Gel ◽

Low Dielectric Constant ◽

Heating Process ◽

Residual Tensile Stress ◽

Silica Films ◽

Stress Development ◽

Low Dielectric

AbstractLow dielectric constant silica films are made using a surfactant templated sol-gel process (K∼2.5) or an ambient temperature and pressure aerogel process (K∼1.5). This paper will present the in-situ measurement and analysis of stress development during the making of these films, from the onset of drying till the end of heating. The drying stress is measured by a cantilever beam technique; the thermal stress is measured by monitoring the wafer curvature using a laser deflection method. During the course of drying, the surfactant templated films experience a low drying stress due to the influence of the surfactant on surface tension and extent of siloxane condensation. The aerogel films first develop a biaxial tensile stress due to solidification and initial drying. At the final stage of drying where the drying stress vanishes, dilation of the film recreates the porosity of the wet gel state, reducing the residual stress to zero. For the surfactant templated films, very small residual tensile stress remains after the heat treatment is finished (∼30MPa). Aerogel film has almost no measurable stress developed in the calcination process. In situ spectroscopic ellipsometry analysis during drying and heating, and TGA/DTA are all used to help understand the stress development.

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