Fabrication of pyramidal (111) MAPbBr3 film with low surface defect density using homogeneous quantum-dot seeds

Nanoscale ◽  
2020 ◽  
Vol 12 (3) ◽  
pp. 1366-1373
Author(s):  
Hyeon Jun Jeong ◽  
Seungho Bang ◽  
Dae Young Park ◽  
Hobeom Jeon ◽  
Gon Namkoong ◽  
...  

Unique pyramidal MAPbBr3 film is formed by MAPbBr3 seeds. The pyramidal MAPbBr3 film effectively reduces surface defects, eliminating hysteresis from the photodetector.

2011 ◽  
Vol 291-294 ◽  
pp. 219-222
Author(s):  
Xiang Yu ◽  
Lei Ma ◽  
Yang Liu ◽  
Zhong Zhou Yang ◽  
Hua Meng

Influence of the process parameters of a reactive mid-frequency dual-magnetron sputtering on surface defects of CrxOy film was investigated. The forming mechanisms of the observed droplets and craters were analyzed. The optimal parameter combination for accomplishing fewer surface defects was explored; and the optimized process parameters evidently minimized the surface defects of the film. In the condition of the target current of 16 A, the gases pressure of 0.31 Pa, and the bias voltages in a range of -120~-240 V, an optimized CrxOy film has been synthesized with surface defect density low to 78 defect/mm-2.


2001 ◽  
Vol 664 ◽  
Author(s):  
A.H.M. Smets ◽  
J.H. van Helden ◽  
M.C.M. van de Sanden

ABSTRACTFor the first time it is demonstrated that the surface defect density can be measured using the cavity ring down (CRD) absorption technique and it is shown that CRD is more sensitive for surface defects than dual beam photoconductivity (DBP) technique. Ex situ measurements have shown that the surface defects of the oxidized a-Si:H surface are distributed over a surface region with thickness W(d). The obtained surface defect density is 1.0 × 1012 up to 1.4 × 1012 cm-2. During growth the a-Si:H surface defect density region has at least a thickness of 15 nm. During deposition of 15 nm a-Si:H the surface density increases up to a not yet saturated value of 1×1013 cm-2.


2008 ◽  
Vol 600-603 ◽  
pp. 783-786 ◽  
Author(s):  
Tetsuo Hatakeyama ◽  
Takuma Suzuki ◽  
Junji Senzaki ◽  
Kenji Fukuda ◽  
Hirofumi Matsuhata ◽  
...  

We report on the reliability of the gate oxide on C-face of 4H-SiC. Constant current stress TDDB measurement shows that QBD of the gate oxide of f200 [μm] on C-face is as much as 18 [C/ cm2], which is much larger than the typical value (0.1[C/ cm2]) of that on Si-face of 4H-SiC. The lifetimes of the gate oxide under the electric field of 3[MV/cm] are roughly evaluated from the leakage characteristics and obtained QBD. The estimated lifetimes of the gate oxide of f600 [μm] are about 900 years. TDDB measurements of MOSs on two wafers, which have different dislocation densities, show that reliability of gate oxide on C-face is insensitive to the dislocation density. Meanwhile, reliability of the gate oxide is sensitive to the surface defect density: it is significantly degraded on the wafer, which has 2000 surface defects in a whole 2-inch wafer.


Nano Letters ◽  
2014 ◽  
Vol 14 (9) ◽  
pp. 5452-5457 ◽  
Author(s):  
Anielle Christine Almeida Silva ◽  
Marcelo José Barbosa Silva ◽  
Felipe Andrés Cordero da Luz ◽  
Danielle Pereira Silva ◽  
Samantha Luara Vieira de Deus ◽  
...  

2017 ◽  
Vol 422 ◽  
pp. 798-808 ◽  
Author(s):  
Mayoorika Shukla ◽  
Pramila ◽  
Tejendra Dixit ◽  
Rajiv Prakash ◽  
I.A. Palani ◽  
...  

1998 ◽  
Vol 507 ◽  
Author(s):  
J Robertson ◽  
M J Powell

ABSTRACTThe growth of a-Si:H and the resulting weak bond and defect formation mechanism is analysed in terms of the adsorbed Sill3 model of growth. It is found that this model describes the surface processes well, but it needs further development to correctly describe the temperature dependence of the formation of defects and weak bonds, since the surface defect density decreases monotonically with temperature and does not show a minimum near 250C. We show that the experimentally observed increase in hydrogen content, weak bond and defect density at lower deposition temperatures can be accounted for by a hydrogen evolution reaction from H2* sites.


2022 ◽  
Author(s):  
Yoshiyuki Abe ◽  
Richard M. Laine

LaTiO2N NP synthesized from flame made LaTiO3 NP exhibits less absorption background above the optical absorption edge than that synthesized from flame made La2Ti2O7 NP, suggesting a low surface defect density.


MRS Advances ◽  
2016 ◽  
Vol 1 (54) ◽  
pp. 3631-3636 ◽  
Author(s):  
Johji Nishio ◽  
Hirokuni Asamizu ◽  
Mitsuhiro Kushibe ◽  
Hidenori Kitai ◽  
Kazutoshi Kojima

ABSTRACT Reduction in background carrier concentration has been investigated for 4H-SiC C-face epitaxial growth in order to be applied for ultra-high voltage power devices. Optimizing epitaxial growth parameters made it possible to achieve 7.6x1013 cm-3 as the background carrier concentration within a whole area of specular 3-inch wafers. In addition to the background carrier concentration reduction, epitaxial film thickness variation, surface defect density and the carrier lifetime have been confirmed to fulfill the requirements for the devices.


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