Ultralow thermal conductivity and high thermoelectric figure of merit in mixed valence In5X5Br (X = S, and Se) compounds

2020 ◽  
Vol 8 (27) ◽  
pp. 13812-13819 ◽  
Author(s):  
Tribhuwan Pandey ◽  
Arun S. Nissimagoudar ◽  
Avanish Mishra ◽  
Abhishek K. Singh
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Figure Of Merit ◽  
Mixed Valence ◽  
Thermoelectric Figure Of Merit ◽  
High Electrical Conductivity ◽  
Thermoelectric Figure ◽  
Low Thermal Conductivity ◽  
Indium Compounds

We predict that mixed valent indium compounds exhibit a combination of high electrical conductivity, high thermopower, and low thermal conductivity, resulting in a large thermoelectric figure of merit.

scholarly journals Термоэлектрические свойства нанокомпозитного Bi-=SUB=-0.45-=/SUB=-Sb-=SUB=-1.55-=/SUB=-Te-=SUB=-2.985-=/SUB=- с микрочастицами SiO-=SUB=-2-=/SUB=-

2019 ◽  
Vol 53 (6) ◽  
pp. 751
Author(s):  
А.А. Шабалдин ◽  
П.П. Константинов ◽  
Д.А. Курдюков ◽  
Л.Н. Лукьянова ◽  
А.Ю. Самунин ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Electrical Conductivity ◽  
Wide Temperature Range ◽  
Figure Of Merit ◽  
Nanostructured Material ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Efficiency ◽  
Thermoelectric Figure ◽  
P Type

AbstractNanocomposite thermoelectrics based on Bi_0.45Sb_1.55Te_2.985 solid solution of p -type conductivity are fabricated by the hot pressing of nanopowders of this solid solution with the addition of SiO_2 microparticles. Investigations of the thermoelectric properties show that the thermoelectric power of the nanocomposites increases in a wide temperature range of 80–420 K, while the thermal conductivity considerably decreases at 80–320 K, which, despite a decrease in the electrical conductivity, leads to an increase in the thermoelectric efficiency in the nanostructured material without the SiO_2 addition by almost 50% (at 300 K). When adding SiO_2, the efficiency decreases. The initial thermoelectric fabricated without nanostructuring, in which the maximal thermoelectric figure of merit ZT = 1 at 390 K, is most efficient at temperatures above 350 K.

scholarly journals Термоэлектрические свойства твердых растворов (CuInSe-=SUB=-2-=/SUB=-)-=SUB=-1-x-=/SUB=-(In-=SUB=-2-=/SUB=-Te-=SUB=-3-=/SUB=-)-=SUB=-x-=/SUB=-

2022 ◽  
Vol 56 (1) ◽  
pp. 38
Author(s):  
Ч.И. Абилов ◽  
М.Ш. Гасанова ◽  
Н.Т. Гусейнова ◽  
Э.К. Касумова
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Solid Solutions ◽  
Figure Of Merit ◽  
Charge Carriers ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Figure ◽  
Mobility Of Charge Carriers ◽  
Temperature Dependences ◽  
Thermoelectric Coefficient

The results of studying the temperature dependences of electrical conductivity, thermoelectric coefficient, Hall mobility of charge carriers, total and electronic thermal conductivity, as well as phonon thermal resistance of alloys of (CuInSe2)1-x(In2Te3)x solid solutions at x=0.005 and 0.0075 are presented. The values ​​of these parameters for certain temperatures were used to calculate the values ​​of the thermoelectric figure of merit of the indicated compositions. It turned out that as the temperature rises, the thermoelectric figure of merit tends to grow strongly, from which it can be concluded that these materials can be used in the manufacture of thermoelements.

Atomic-Scale Three-Dimensional Phononic Crystals With a Large Thermoelectric Figure of Merit

2008 ◽  
Author(s):  
Jean-Numa Gillet ◽  
Sebastian Volz
Keyword(s):  
Thermal Conductivity ◽  
Figure Of Merit ◽  
Phononic Crystal ◽  
Three Dimensional ◽  
Phononic Crystals ◽  
Atomic Scale ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Figure ◽  
Low Thermal Conductivity ◽  
Cmos Compatible

The design of thermoelectric materials led to extensive research on superlattices with a low thermal conductivity. Indeed, the thermoelectric figure of merit ZT varies with the inverse of the thermal conductivity but is directly proportional to the power factor. Unfortunately, as nanowires, superlattices cancel heat conduction in only one main direction. Moreover they often show dislocations owing to lattice mismatches, which reduces their electrical conductivity and avoids a ZT larger than unity. Self-assembly is a major epitaxial technology to design ultradense arrays of germanium quantum dots (QDs) in silicon for many promising electronic and photonic applications as quantum computing. Accurate positioning of the self-assembled QD can now be achieved with few dislocations. We theoretically demonstrate that high-density three-dimensional (3-D) arrays of self-assembled Ge QDs, with a size of only some nanometers, in a Si matrix can also show an ultra-low thermal conductivity in the three spatial directions. This property can be considered to design new CMOS-compatible thermoelectric devices. To obtain a realistic and computationally-manageable model of these nanomaterials, we simulate their thermal behavior with atomic-scale 3-D phononic crystals. A phononic-crystal period (supercell) consists of diamond-like Si cells. At each supercell center, we substitute Si atoms by Ge atoms to form a box-like nanoparticle. Since this phononic crystal is periodic, we compute its phonon dispersion curves by classical lattice dynamics. Non-periodicities can be introduced with statistical distributions. From the flat dispersion curves, we obtain very small group velocities; this reduces the thermal conductivity in our phononic crystal compared to bulk Si. However, owing to the wave-particle duality at very small scales in quantum mechanics, another reduction arises from multiple scattering of the particle-like phonons in nanoparticle clusters. At room temperature, the thermal conductivity in an example phononic crystal can be reduced by a factor of at least 165 compared to bulk Si or below 0.95 W/mK. This value, which is lower than the classical Einstein limit of single crystalline Si, is an upper limit of the thermal conductivity since we use an incoherent-scattering approach for the nanoparticles. Because of its very low thermal conductivity, we hope to obtain a much larger ZT than unity in our atomic-scale 3-D phononic crystal. Indeed, this silicon-based nanomaterial is crystalline with a power factor that can be optimized by doping using CMOS-compatible processes. Future research on the phononic-crystal electrical conductivity has to be performed in order to compute the full ZT with a good accuracy.

Thermoelectric Properties of a Wide–Gap Chalcopyrite Compound AgInSe2

2012 ◽  
Vol 519 ◽  
pp. 188-192 ◽  
Author(s):  
P.Z. Ying ◽  
H. Zhou ◽  
Y.L. Gao ◽  
Y.Y. Li ◽  
Y.P. Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Thermoelectric Properties ◽  
Figure Of Merit ◽  
Chemical Compositions ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Figure ◽  
Remarkable Improvement ◽  
Wide Gap ◽  
Chalcopyrite Compound

Here we report the thermoelectric properties of a wide–gap chalcopyrite compound AgInSe2, and observed the remarkable improvement in electrical conductivity σ, due to the bandgap (Eg = 1.12 eV) reduction compared to In2Se3. The improvement in σ is directly responsible for the enhancement of thermoelectric figure of merit ZT, though the thermal conductivity is much higher at 500 ~ 724 K. The maximum ZT value is 0.34 at 724 K, increasing by a factor of 4, indicating that this chalcopyrite compound is of a potential thermoelectric candidate if further optimizations of chemical compositions and structure are made.

Synthesis and Thermoelectric Properties of WO3/Cu2SnSe3 Composites

2018 ◽  
Vol 913 ◽  
pp. 811-817 ◽  
Author(s):  
Di Wu ◽  
Ji Ai Ning ◽  
De Gang Zhao ◽  
Xue Zhen Wang ◽  
Na Liu
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Electrical Properties ◽  
Grain Boundary ◽  
Figure Of Merit ◽  
Milling Process ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Figure ◽  
Plasma Sintering ◽  
Spark Plasma

In this study, nanometer WO3 powder was uniformly dispersed into the Cu2SnSe3 powder by ball milling process, and the WO3/Cu2SnSe3 thermoelectric composite was prepared by spark plasma sintering (SPS). The results showed that the nano-WO3 particles were mainly distributed in the grain boundary of Cu2SnSe3 matrix, and the grain growth of Cu2SnSe3 was inhibited. The addition of nano-WO3 could enhance the electrical conductivity of Cu2SnSe3, and while the Seebeck coefficient increased slightly for the 0.4% WO3/Cu2SnSe3 composite. The thermal conductivity was not decreased until the content of WO3 exceeded 1.6%. The highest thermoelectric figure of merit ZT of 0.177 was achieved at 700 K for 0.4% WO3/Cu2SnSe3 composite. The enhancement of ZT value of WO3/Cu2SnSe3 thermoelectric material was mainly attributed to the improvement of the electrical properties.

Low thermal conductivity and high thermoelectric figure of merit in p-type Sb2Te3/poly(3,4-ethylenedioxythiophene) thermoelectric composites

2014 ◽  
Vol 105 (2) ◽  
pp. 023901 ◽  
Author(s):  
Wenwen Zheng ◽  
Peng Bi ◽  
Haochen Kang ◽  
Wei Wei ◽  
Fengming Liu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Figure Of Merit ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Figure ◽  
Low Thermal Conductivity ◽  
P Type

scholarly journals The impact of charge transfer and structural disorder on the thermoelectric properties of cobalt intercalated TiS2

2016 ◽  
Vol 4 (9) ◽  
pp. 1871-1880 ◽  
Author(s):  
Gabin Guélou ◽  
Paz Vaqueiro ◽  
Jesús Prado-Gonjal ◽  
Tristan Barbier ◽  
Sylvie Hébert ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Charge Transfer ◽  
Thermoelectric Properties ◽  
Figure Of Merit ◽  
Structural Disorder ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Figure ◽  
Low Levels ◽  
The Impact

The thermoelectric figure of merit of TiS2 is increased by 25% through the intercalation of low levels of cobalt due to an increased electrical conductivity, arising from charge transfer, and a reduced thermal conductivity resulting from disorder.

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