Investigation of the Interface Condition Influence on Backcalculated Layer Properties

2021 ◽  
Vol 147 (3) ◽  
pp. 04021026
Author(s):  
Dandan Cao ◽  
Yanqing Zhao ◽  
Jinxi Zhang ◽  
Peng Jing ◽  
Hui Yao
Keyword(s):  
Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.


Author(s):  
Hailing Yu

In ballasted concrete tie track, the tie-ballast interface can deteriorate resulting in concrete tie bottom abrasion, ballast pulverization and/or voids in tie-ballast interfaces. Tie-ballast voids toward tie ends can lead to unfavorable center binding support conditions that can result in premature concrete tie failure and possible train derailment. Direct detection of these conditions is difficult. There is a strong interest in assessing the concrete tie-ballast interface conditions indirectly using measured vertical deflections. This paper seeks to establish a link between the vertical deflection profile of a concrete tie top surface and the tie-ballast interface condition using the finite element analysis (FEA) method. The concrete tie is modeled as a concrete matrix embedded with prestressing steel strands or wires. The configurations of two commonly used concrete ties, one with 8 prestressing strands and the other with 20 prestressing wires, are employed in this study. All models are three-dimensional and symmetric about the tie center. A damaged plasticity model that can predict onset and propagation of tensile cracks is applied to the concrete material. The steel-concrete interface is homogenized and represented with a thin layer of cohesive elements sandwiched between steel and concrete elements. Strand- or wire-specific elasto-plastic bond models developed at the Volpe Center are applied to the cohesive elements to account for the interface bonding mechanisms. FE models are developed for both original and worn concrete ties, with the latter assuming hypothetical patterns of reduced cross sections resulting from abrasive interactions with the ballast. Static analyses of pretension release in these concrete ties are conducted, and vertical deflection gradients along tie lengths are calculated and shown to correspond well with the worn cross sectional patterns for a given reinforcement type. The ballast is further modeled with Extended Drucker-Prager plasticity, and hypothetical voids are applied toward the tie ends along the concrete tie-ballast interface to simulate center binding support conditions. The distance range over which the concrete tie is supported in the center is variable and yields different center binding severity. Static simulations are completed with vertical rail seat loads applied on the concrete tie-ballast assembly. The influences of various factors on the vertical deflection profile, including tie type, vertical load magnitude, center binding severity, cross sectional material loss and prestress loss, are examined based on the FEA results. The work presented in this paper demonstrates the potential of using the vertical deflection profile of concrete tie top surfaces to assess deteriorations in the tie-ballast interface. The simulation results further help to clarify minimum technical requirements on inspection technologies that measure concrete tie vertical deflection profiles.


2014 ◽  
Vol 701-702 ◽  
pp. 246-249
Author(s):  
Sai Tan ◽  
Jun Yong Lu ◽  
Xin Lin Long ◽  
Xiao Zhang

Basing on governing Maxwell and energy equation of rail gun considering armature movement in two dimension, The total domain to be solved is divided into two subdomains: moving (armature) part and static (rail) part, finite element formulations of two subdomains are built independently, then using the interface condition of two subdomains, formulations are connected by coupled equation which is derived out by penalty method. Shifted physical quantity is used to simulate movement. The final magnetic-thermal coupled fields finite element formulations of rail gun are established by these methods. Numerical calculation results compared by theoretical and other numerical results verify that penalty method is an effective way to deal with electric sliding contact problem associating with Shifted physical quantity method.


Author(s):  
Kirill Cherednichenko ◽  
William Graham

We analyse waves propagating along the interface between half-spaces filled with a perfect dielectric and a Lorentz material. We show that the corresponding interface condition leads to a generalization of the classical Leontovich condition on the boundary of a dielectric half-space. We study when this condition supports propagation of (dispersive) surface waves. We derive the related dispersion relation for waves along the boundary of a stratified half-space and determine the relationship between the loss parameter, frequency and wavenumber for which interfacial waves exist. This article is part of the theme issue ‘Modelling of dynamic phenomena and localization in structured media (part 1)’.


Geophysics ◽  
1995 ◽  
Vol 60 (5) ◽  
pp. 1514-1526 ◽  
Author(s):  
Richard T. Coates ◽  
Michael Schoenberg

For the purposes of seismic propagation, a slip fault may be regarded as a surface across which the displacement caused by a seismic wave is discontinuous while the stress traction remains continuous. The simplest assumption is that this slip and the stress traction are linearly related. Such a linear slip interface condition is easily modeled when the fault is parallel to the finite‐difference grid, but is more difficult to do for arbitrary nonplanar fault surfaces. To handle such situations we introduce equivalent medium theory to model material behavior in the cells of the finite‐ difference grid intersected by the fault. Virtually identical results were obtained from modeling the fault by (1) an explicit slip interface condition (fault parallel to the grid) and (2) using the equivalent medium theory when the finite‐difference grid was rotated relative to the fault and receiver array. No additional computation time is needed except for the preprocessing required to find the relevant cells and their associated moduli. The formulation is sufficiently general to include faults in and between arbitrary anisotropic materials with slip properties that vary as a function of position.


ChemInform ◽  
2010 ◽  
Vol 26 (27) ◽  
pp. no-no
Author(s):  
M. AGGOUR ◽  
M. GIERSIG ◽  
H. J. LEWERENZ

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