Terraced substrate inner stripe semiconductor lasers by one‐step liquid‐phase epitaxy

1989 ◽  
Vol 66 (5) ◽  
pp. 2225-2227 ◽  
Author(s):  
Guotong Du ◽  
Xiaoyu Ma ◽  
Zheng Zou ◽  
Xiaobo Zhang ◽  
Dingsan Gao
1999 ◽  
Vol 587 ◽  
Author(s):  
H. Yokoi ◽  
T. Mizumoto

AbstractSelective area growth of magnetic garnet crystals was studied by liquid-phase epitaxy. The garnet layers grown on Ti-masked substrates were analyzed under a scanning electron microscope, and by X-ray diffraction measurements, energy-dispersive X-ray analysis and reflection high-energy electron diffraction. Narrow stripes in the Ti mask were designed to form waveguides by one-step growth. The light waves could be guided within the waveguide fabricated by selective area liquid-phase epitaxy.


Rare Metals ◽  
2009 ◽  
Vol 28 (4) ◽  
pp. 313-316 ◽  
Author(s):  
Yuzhu Gao ◽  
Xiuying Gong ◽  
Weizheng Fang ◽  
Ishida Akihiro

Author(s):  
Guangwei Qu ◽  
Lizhong Hu ◽  
Xiuping Liang ◽  
Heqiu Zhang ◽  
Yu Zhao

2004 ◽  
Vol 40 (4) ◽  
pp. 3045-3047 ◽  
Author(s):  
J.-H. Park ◽  
H. Takagi ◽  
J.-K. Cho ◽  
K. Nishimura ◽  
H. Uchida ◽  
...  

1987 ◽  
Vol 91 ◽  
Author(s):  
H.-P. Trah ◽  
M.I. Alonso ◽  
M. Konuma ◽  
E. Bauser ◽  
H. Cerva ◽  
...  

ABSTRACTSingle-crystal Si1−x Gex(O<×≲1) layers are grown by seeded growth on partially SiO2-masked Si-substrates, using a one-step liquid phase epitaxy (LPE) process. The seed regions are stripe- and hole-shaped windows in the oxide, having linear dimensions between 1.5 and 100 μm. The windows extend in different orientation on (111) and (100) orientated substrates. Lateral overgrowth over the oxide-masked areas is achieved up to 70 μm in <110>-directions. X-ray diffraction and Raman scattering show that the epitaxial islands are homogeneous and of excellent crystal quality. In the regions of lateral overgrowth the dislocation density is reduced considerably as shown by defect-etching and cross section transmission electron microscopy.


1979 ◽  
Vol 35 (6) ◽  
pp. 441-443 ◽  
Author(s):  
A. Doi ◽  
T. Fukuzawa ◽  
M. Nakamura ◽  
R. Ito ◽  
K. Aiki

Author(s):  
N.A. Bert ◽  
A.O. Kosogov

The very thin (<100 Å) InGaAsP layers were grown not only by molecular beam epitaxy and metal-organic chemical vapor deposition but recently also by simple liquid phase epitaxy (LPE) technique. Characterization of their thickness, interfase abruptness and lattice defects is important and requires TEM methods to be used.The samples were InGaAsP/InGaP double heterostructures grown on (111)A GaAs substrate. The exact growth conditions are described in Ref.1. The salient points are that the quarternary layers were being grown at 750°C during a fast movement of substrate and a convection caused in the melt by that movement was eliminated. TEM cross-section specimens were prepared by means of conventional procedure. The studies were conducted in EM 420T and JEM 4000EX instruments.The (200) dark-field cross-sectional imaging is the most appropriate TEM technique to distinguish between individual layers in 111-v semiconductor heterostructures.


Author(s):  
F. Banhart ◽  
F.O. Phillipp ◽  
R. Bergmann ◽  
E. Czech ◽  
M. Konuma ◽  
...  

Defect-free silicon layers grown on insulators (SOI) are an essential component for future three-dimensional integration of semiconductor devices. Liquid phase epitaxy (LPE) has proved to be a powerful technique to grow high quality SOI structures for devices and for basic physical research. Electron microscopy is indispensable for the development of the growth technique and reveals many interesting structural properties of these materials. Transmission and scanning electron microscopy can be applied to study growth mechanisms, structural defects, and the morphology of Si and SOI layers grown from metallic solutions of various compositions.The treatment of the Si substrates prior to the epitaxial growth described here is wet chemical etching and plasma etching with NF3 ions. At a sample temperature of 20°C the ion etched surface appeared rough (Fig. 1). Plasma etching at a sample temperature of −125°C, however, yields smooth and clean Si surfaces, and, in addition, high anisotropy (small side etching) and selectivity (low etch rate of SiO2) as shown in Fig. 2.


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